Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2005
04/19/2005US6882051 Nanowires, nanostructures and devices fabricated therefrom
04/19/2005US6882049 Support ring for use with a contact pad and semiconductor device components including the same
04/19/2005US6882048 Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area
04/19/2005US6882045 Multi-chip module and method for forming and method for deplating defective capacitors
04/19/2005US6882044 High speed electronic interconnection using a detachable substrate
04/19/2005US6882043 Electronic assembly having an indium thermal couple
04/19/2005US6882041 Thermally enhanced metal capped BGA package
04/19/2005US6882040 Semiconductor device
04/19/2005US6882039 Semiconductor device
04/19/2005US6882037 Die paddle for receiving an integrated circuit die in a plastic substrate
04/19/2005US6882036 Apparatuses for forming thin microelectronic dies
04/19/2005US6882032 Technique for attaching die to leads
04/19/2005US6882031 Ammonia gas passivation on nitride encapsulated devices
04/19/2005US6882030 Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate
04/19/2005US6882026 Semiconductor apparatus and process for producing the same, and process for making via hole
04/19/2005US6882025 Strained-channel transistor and methods of manufacture
04/19/2005US6882024 Semiconductor device having a dummy active region for controlling high density plasma chemical vapor deposition
04/19/2005US6882021 Packaged image sensing microelectronic devices including a lead and methods of packaging image sensing microelectronic devices including a lead
04/19/2005US6882018 Semiconductor device that include silicide layers
04/19/2005US6882017 Field effect transistors and integrated circuitry
04/19/2005US6882016 Semiconductor device, electro-optical device, electronic apparatus, and method for manufacturing semiconductor device
04/19/2005US6882015 Intralevel decoupling capacitor, method of manufacture and testing circuit of the same
04/19/2005US6882014 Protection circuit for MOS components
04/19/2005US6882013 Transistor with reduced short channel effects and method
04/19/2005US6882012 Semiconductor device and a method of manufacturing the same
04/19/2005US6882010 High performance three-dimensional TFT-based CMOS inverters, and computer systems utilizing such novel CMOS inverters
04/19/2005US6882009 Electrostatic discharge protection device and method of manufacturing the same
04/19/2005US6882008 Semiconductor integrated circuit device
04/19/2005US6882007 SRAM memory cell, memory cell arrangement and method for fabricating a memory cell arrangement
04/19/2005US6882006 Semiconductor device and method of manufacturing the same
04/19/2005US6882005 High-voltage vertical transistor with a multi-layered extended drain structure
04/19/2005US6882004 Semiconductor component, trench structure transistor, trench MOSFET, IGBT, and field-plate transistor
04/19/2005US6882003 Method and apparatus for a flash memory device comprising a source local interconnect
04/19/2005US6882002 Non-volatile semiconductor memory device having a dielectric layer formed around and planar with a first stack's top surface
04/19/2005US6882001 Electrically-programmable non-volatile memory cell
04/19/2005US6882000 Trench MIS device with reduced gate-to-drain capacitance
04/19/2005US6881999 Semiconductor device with analog capacitor and method of fabricating the same
04/19/2005US6881998 Semiconductor device and method for producing the same
04/19/2005US6881996 Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer
04/19/2005US6881995 Semiconductor devices and methods for manufacturing the same
04/19/2005US6881994 Monolithic three dimensional array of charge storage devices containing a planarized surface
04/19/2005US6881991 Dry-etching method and apparatus, photomasks and method for the preparation thereof, and semiconductor circuits and method for the fabrication thereof
04/19/2005US6881990 Semiconductor device including MOS field effect transistor having offset spacers or gate sidewall films on either side of gate electrode and method of manufacturing the same
04/19/2005US6881989 Semiconductor integrated circuit having high-density base cell array
04/19/2005US6881988 Heterojunction bipolar transistor and semiconductor integrated circuit device using the same
04/19/2005US6881987 pMOS device having ultra shallow super-steep-retrograde epi-channel with dual channel doping and method for fabricating the same
04/19/2005US6881984 Resonant-cavity light-emitting diode and optical transmission module using the light-emitting diode
04/19/2005US6881976 Heterojunction BiCMOS semiconductor
04/19/2005US6881975 Semiconductor device and method of manufacturing the same
04/19/2005US6881969 Electron beam treatment device
04/19/2005US6881968 Electron beam exposure apparatus, electron beam exposure method, semiconductor device manufacturing method, and electron beam shape measuring method
04/19/2005US6881967 Accurate doping the surface of semiconductor wafers by ion implantation, shadowing on the surface, ionization and generating an ion beam, re-orient the ion beam
04/19/2005US6881965 Multi-foil optic
04/19/2005US6881963 Vibration control of an object
04/19/2005US6881952 Residual gas analyzer of semiconductor device manufacturing equipment
04/19/2005US6881914 Apparatus and method for handling, storing and reloading carriers for disk-shaped items, such as semiconductor wafers or CDs
04/19/2005US6881811 Improved heat resistance and low relative permittivity; insulating films for electronic devices/multilayerd wiring boards
04/19/2005US6881688 Method of fabricating a vertically profiled electrode and semiconductor device comprising such an electrode
04/19/2005US6881687 Method for laser cleaning of a substrate surface using a solid sacrificial film
04/19/2005US6881686 Low-fluence irradiation for lateral crystallization enabled by a heating source
04/19/2005US6881685 Device and method for feeding treating air
04/19/2005US6881684 Method of forming silicon nitride deposited film
04/19/2005US6881683 Insulation film on semiconductor substrate and method for forming same
04/19/2005US6881682 Method and structure for reducing leakage current in capacitors
04/19/2005US6881681 Film deposition on a semiconductor wafer
04/19/2005US6881679 Etching solution for etching Cu and Cu/Ti metal layer of liquid crystal display device and method of fabricating the same
04/19/2005US6881678 Method for forming a dual damascene structure in a semiconductor device
04/19/2005US6881676 Semiconductor device manufacturing method
04/19/2005US6881675 Method and system for reducing wafer edge tungsten residue utilizing a spin etch
04/19/2005US6881674 Abrasives for chemical mechanical polishing
04/19/2005US6881673 Integrated deposition process for copper metallization
04/19/2005US6881672 Selective silicide blocking
04/19/2005US6881670 Interconnect process and method for removing metal silicide
04/19/2005US6881669 Process for making electronic devices having a monolayer diffusion barrier
04/19/2005US6881668 Control of air gap position in a dielectric layer
04/19/2005US6881667 Low-resistance contact to silicon having a titanium silicide interface and an amorphous titanium carbonitride barrier layer
04/19/2005US6881666 Method of fabricating semiconductor device
04/19/2005US6881665 Depth of focus (DOF) for trench-first-via-last (TFVL) damascene processing with hard mask and low viscosity photoresist
04/19/2005US6881664 Process for planarizing upper surface of damascene wiring structure for integrated circuit structures
04/19/2005US6881663 Methods of fabricating silicide pattern structures
04/19/2005US6881661 Manufacturing method of semiconductor device
04/19/2005US6881660 Method for forming wiring structure
04/19/2005US6881659 Methods of forming self-aligned contact structures in semiconductor integrated circuit devices
04/19/2005US6881658 Process of and apparatus for heat-treating II-VI compound semiconductors and semiconductor heat-treated by the process
04/19/2005US6881657 Semiconductor device and method for manufacturing semiconductor device
04/19/2005US6881656 Production process for semiconductor apparatus
04/19/2005US6881655 Contact resistances in integrated circuits
04/19/2005US6881654 Solder bump structure and laser repair process for memory device
04/19/2005US6881653 Method of manufacturing CMOS semiconductor device
04/19/2005US6881652 Method to fabricate an intrinsic polycrystalline silicon film
04/19/2005US6881651 Methods and devices using group III nitride compound semiconductor
04/19/2005US6881650 Method for forming SOI substrate
04/19/2005US6881649 Method of making device chips collectively from common material substrate
04/19/2005US6881648 Semiconductor wafer having a thin die and tethers and methods of making the same
04/19/2005US6881647 Synthesis of layers, coatings or films using templates
04/19/2005US6881646 Semiconductor device and process for producing the same
04/19/2005US6881645 Method of preventing semiconductor layers from bending and semiconductor device formed thereby
04/19/2005US6881644 Smoothing method for cleaved films made using a release layer
04/19/2005US6881643 Semiconductor device producing method and semiconductor device
04/19/2005US6881642 Method of forming a MIM capacitor with metal nitride electrode
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