Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2005
08/25/2005WO2005078791A1 Pocket implant for complementary bit disturb improvement and charging improvement of sonos memory cell
08/25/2005WO2005078790A1 Contact portion and manufacturing method thereof, thin film transistor array panel and manufacturing method thereof
08/25/2005WO2005078789A1 Chip-sized filp-chip semiconductor package and method for making the same
08/25/2005WO2005078788A1 Group i-vii semiconductor single crystal thin film and process for producing same
08/25/2005WO2005078787A1 Thin film transistor and manufacturing method thereof, display apparatus, method for modifying oxide film, method for forming oxide film, semiconductor device, method for manufacturing semiconductor device and equipment for manufacturing semiconductor device
08/25/2005WO2005078786A1 Method of forming thin sgoi wafers with high relaxation and low stacking fault defect density
08/25/2005WO2005078785A1 Method for the creation of an integrated electronic circuit and integrated electronic circuit thus obtained
08/25/2005WO2005078784A1 Method for producing silicon oxide film
08/25/2005WO2005078783A1 Method for selective etching
08/25/2005WO2005078782A1 Plasma processing apparatus and plasma processing method
08/25/2005WO2005078781A1 Film-forming apparatus
08/25/2005WO2005078780A1 Vapor-phase deposition method
08/25/2005WO2005078779A1 Imprinting apparatus with independently actuating separable modules
08/25/2005WO2005078778A1 Lighting optical device, polarization status detector,and exposure system and exposure method
08/25/2005WO2005078777A1 Drive method, exposure method, exposure device, and device manufacturing method
08/25/2005WO2005078775A1 Measurement method, transfer characteristic measurement method, exposure device adjustment method, and device manufacturing method
08/25/2005WO2005078774A1 Exposure method and system, and device production method
08/25/2005WO2005078773A1 Imaging optical system, exposure system, and exposure method
08/25/2005WO2005078772A2 Method and apparatus for making a mems scanner
08/25/2005WO2005078771A2 Purging of a wafer conveyance container
08/25/2005WO2005078770A2 Active electronic devices with nanowire composite components
08/25/2005WO2005078768A1 Device for inspecting and rotating electronic components
08/25/2005WO2005078758A1 Ion implantation method and ion implantation apparatus
08/25/2005WO2005078748A1 Magnetic thin film and utilizing the same, magnetoresistive effect element and magnetic device
08/25/2005WO2005078739A1 Aluminum alloy wiring material having high resistance to heat and target material
08/25/2005WO2005078509A2 Mems scanning system with improved performance
08/25/2005WO2005078508A2 Method and apparatus for scanning a beam of light
08/25/2005WO2005078506A2 High performance mems scanner
08/25/2005WO2005078168A2 Method of crystallizing silicon, apparatus therefore, thin film transistor and display apparatus
08/25/2005WO2005078155A1 Ultra low dielectric materials based on hybrid system of linear silicon precursor and organic porogen
08/25/2005WO2005077869A1 C2f4 gas generating method and generating system
08/25/2005WO2005077633A1 Resin sealing method for electronic part and mold used for the method
08/25/2005WO2005077549A1 Thin film transistor and display device, and method for manufacturing thereof
08/25/2005WO2005077024A2 Methods and apparatus for data analysis
08/25/2005WO2005077012A2 Cmut devices and fabrication methods
08/25/2005WO2005076960A2 Back-contact solar cells and methods for fabrication
08/25/2005WO2005076807A2 A threshold voltage stabilizer, method of manufacturing and integrated circuit employing the same
08/25/2005WO2005076795A2 Method for forming a semiconductor device with local semiconductor-on- insulator (soi)
08/25/2005WO2005076794A2 Die encapsulation using a porous carrier
08/25/2005WO2005064650A3 Method and apparatus for performing a limited area spectral analysis
08/25/2005WO2005062079A3 Generating multiple bandgaps using multiple epitaxial layers
08/25/2005WO2005045887A3 Method of forming an nmos transistor and structure thereof
08/25/2005WO2005041266A3 Semiconductor device package utilizing proud interconnect material
08/25/2005WO2005039261A3 Solder structures for out of plane connections and related methods
08/25/2005WO2005038880A3 Via density rules
08/25/2005WO2005038875A3 High performance strained cmos devices
08/25/2005WO2005038094A3 Apparatus for electroless deposition
08/25/2005WO2005036642A3 A microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
08/25/2005WO2005031035B1 Method for producing thin semiconductor films by deposition from solution
08/25/2005WO2005029576A3 Glass-based soi structures
08/25/2005WO2005022664A3 Production of electronic devices
08/25/2005WO2005000733A3 Integrated circuit on high performance chip
08/25/2005WO2004114367A3 Method and apparatus for increasing bulk conductivity of a ferroelectric material
08/25/2005WO2004070833A8 Method of manufacturing a semiconductor device with mos transistors comprising gate electrodes formed in a packet of metal layers deposited upon one another
08/25/2005WO2004061911A8 Semiconductor devices with reduced active region defects and unique contacting schemes
08/25/2005WO2004039905A8 Composition for polishing metal, polishing method for metal layer, and production method for wafer
08/25/2005US20050188341 Mask data correction method, photomask manufacturing method, computer program, optical image prediction method, resist pattern shape prediction method, and semiconductor device manufacturing method
08/25/2005US20050188147 Non-volatile semiconductor memory system
08/25/2005US20050187751 Evaluation system, evaluation method and evaluation program using device simulation and circuit simulation
08/25/2005US20050187653 Substrate transfer device
08/25/2005US20050187649 Method and apparatus for the monitoring and control of a semiconductor manufacturing process
08/25/2005US20050187648 Semiconductor process and yield analysis integrated real-time management method
08/25/2005US20050187647 Intelligent full automation controlled flow for a semiconductor furnace tool
08/25/2005US20050187118 Cleaning solution, method for cleaning semiconductor substrate using the same, and method for forming metal wiring
08/25/2005US20050186934 Semiconductor integrated circuit
08/25/2005US20050186891 Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization
08/25/2005US20050186806 Method for forming oxide film in semiconductor device
08/25/2005US20050186805 Synthesis of layers, coatings or films using collection layer
08/25/2005US20050186804 Semiconductor device fabrication method and fabrication apparatus
08/25/2005US20050186803 Method of manufacturing semiconductor device
08/25/2005US20050186802 Methods of Forming Openings, And Methods of Forming Container Capacitors
08/25/2005US20050186801 Method of manufacture of semiconductor integrated circuit
08/25/2005US20050186800 Coating the semiconductor surface and defects with a protective layer, thinning the protective layer, removing defects by reactive ion etching, electron cyclotron resonance or chemical mechanical polishing, removing the protective layer; improved wafer surface morphology of epitaxial layers
08/25/2005US20050186799 Chemical-mechanical polishing method
08/25/2005US20050186798 Process for manufacturing semiconductor devices and related semiconductor device
08/25/2005US20050186797 ABS through aggressive stitching
08/25/2005US20050186796 Method for gap filling between metal-metal lines
08/25/2005US20050186795 Method of forming buried wiring in semiconductor device
08/25/2005US20050186794 Method for fabricating semiconductor device
08/25/2005US20050186793 Manufacturing method of semiconductor device
08/25/2005US20050186792 Manufacturing method of a semiconductor device with a metal gate electrode and a structure thereof
08/25/2005US20050186791 Through-hole conductors for semiconductor substrates and method and system for making same
08/25/2005US20050186790 Methods of fabricating interconnects for semiconductor components
08/25/2005US20050186789 Photo-assisted method for semiconductor fabrication
08/25/2005US20050186788 System for improving thermal stability of copper damascene structure
08/25/2005US20050186787 Semiconductor devices and methods to form a contact in a semiconductor device
08/25/2005US20050186786 Method for fabricating metallic interconnects on electronic components
08/25/2005US20050186785 Device manufacturing method and substrate
08/25/2005US20050186784 Methods for forming a metal contact in a semiconductor device in which an ohmic layer is formed while forming a barrier metal layer
08/25/2005US20050186783 Gallium nitride vertical light emitting diode structure and method of separating a substrate and a thin film in the structure
08/25/2005US20050186782 Dual damascene interconnect structure with improved electro migration lifetimes
08/25/2005US20050186781 Method for fabricating semiconductor device by forming damascene interconnections
08/25/2005US20050186780 Method for reducing defects after a metal etching in semiconductor devices
08/25/2005US20050186779 Method for forming conductive material in opening and structure regarding same
08/25/2005US20050186778 Very low effective dielectric constant interconnect structures and methods for fabricating the same
08/25/2005US20050186777 Methods of fabricating interconnects for semiconductor components
08/25/2005US20050186776 Evaluating a multi-layered structure for voids
08/25/2005US20050186775 Conducting wire and contact opening forming method for reducing photoresist thickness and via resistance
08/25/2005US20050186774 Method of using micro-contact imprinted features for formation of electrical interconnects for substrates
08/25/2005US20050186773 Methods and structures for metal interconnections in integrated circuits
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