Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2005
08/30/2005US6936540 Method of polishing a semiconductor substrate, post-CMP cleaning process, and method of cleaning residue from registration alignment markings
08/30/2005US6936539 Antireflective coating for use during the manufacture of a semiconductor device
08/30/2005US6936538 Method and apparatus for depositing tungsten after surface treatment to improve film characteristics
08/30/2005US6936537 Methods for forming low-k dielectric films
08/30/2005US6936536 Methods of forming conductive through-wafer vias
08/30/2005US6936535 Copper interconnect structure having stuffed diffusion barrier
08/30/2005US6936534 Method for the post-etch cleaning of multi-level damascene structures having underlying copper metallization
08/30/2005US6936533 Method of fabricating semiconductor devices having low dielectric interlayer insulation layer
08/30/2005US6936532 Substrate having a plurality of bumps, method of forming the same, and method of bonding substrate to another
08/30/2005US6936531 Process of fabricating a chip structure
08/30/2005US6936530 Deposition method for Si-Ge epi layer on different intermediate substrates
08/30/2005US6936529 Method for fabricating gate-electrode of semiconductor device with use of hard mask
08/30/2005US6936528 Method of forming cobalt silicide film and method of manufacturing semiconductor device having cobalt silicide film
08/30/2005US6936527 Low voltage non-volatile memory cell
08/30/2005US6936526 Method of disordering quantum well heterostructures
08/30/2005US6936525 Chip-like electronic components, a method of manufacturing the same, a pseudo wafer therefor and a method of manufacturing thereof
08/30/2005US6936524 Ultrathin form factor MEMS microphones and microspeakers
08/30/2005US6936523 Two-stage annealing method for manufacturing semiconductor substrates
08/30/2005US6936522 Selective silicon-on-insulator isolation structure and method
08/30/2005US6936520 Method for fabricating semiconductor device having gate electrode together with resistance element
08/30/2005US6936519 Double polysilicon bipolar transistor and method of manufacture therefor
08/30/2005US6936518 Creating shallow junction transistors
08/30/2005US6936517 Method for fabricating transistor of semiconductor device
08/30/2005US6936516 Replacement gate strained silicon finFET process
08/30/2005US6936515 Method for fabricating a memory device having reverse LDD
08/30/2005US6936514 Semiconductor component and method
08/30/2005US6936513 Methods of forming capacitors and electronic devices
08/30/2005US6936512 Semiconductor method and structure for simultaneously forming a trench capacitor dielectric and trench sidewall device dielectric
08/30/2005US6936511 Inverted buried strap structure and method for vertical transistor DRAM
08/30/2005US6936510 Semiconductor device with self-aligned contact and its manufacture
08/30/2005US6936509 STI pull-down to control SiGe facet growth
08/30/2005US6936508 Metal gate MOS transistors and methods for making the same
08/30/2005US6936507 Method of forming field effect transistors
08/30/2005US6936506 Strained-silicon devices with different silicon thicknesses
08/30/2005US6936505 Method of forming a shallow junction
08/30/2005US6936504 Poly-silicon thin film transistor having back bias effects and fabrication method thereof
08/30/2005US6936503 Method for manufacturing a MOS transistor
08/30/2005US6936500 Method for the lateral contacting of a semiconductor chip
08/30/2005US6936499 Semiconductor device and fabrication process therefor
08/30/2005US6936497 Method of forming electronic dies wherein each die has a layer of solid diamond
08/30/2005US6936496 Nanowire filament
08/30/2005US6936495 Method of making an optoelectronic semiconductor package device
08/30/2005US6936494 Processes for hermetically packaging wafer level microscopic structures
08/30/2005US6936493 Micromechanical device latching
08/30/2005US6936490 Semiconductor wafer and its manufacturing method
08/30/2005US6936487 Semiconductor device with ohmic electrode formed on compound semiconductor having wide band gap and its manufacture method
08/30/2005US6936486 Low voltage multi-junction vertical cavity surface emitting laser
08/30/2005US6936484 Method of manufacturing semiconductor device and semiconductor device
08/30/2005US6936482 Method of fabricating substrates and substrates obtained by this method
08/30/2005US6936481 Method of depositing dielectric
08/30/2005US6936480 Method of controlling the chemical mechanical polishing of stacked layers having a surface topology
08/30/2005US6936479 Method of making toroidal MRAM cells
08/30/2005US6936478 Ferroelectric capacitor with dielectric lining, semiconductor memory device employing same, and fabrication methods thereof
08/30/2005US6936408 Partially photoexposed positive photoresist layer blocking method for regio-selectively processing a microelectronic layer
08/30/2005US6936406 Method of manufacturing integrated circuit
08/30/2005US6936401 Pattern formation material and pattern formation method
08/30/2005US6936400 Negative resist composition
08/30/2005US6936386 for application to semiconductor wafers; comprises charge coupled camera; lithography
08/30/2005US6936385 Calibration methods, calibration substrates, lithographic apparatus and device manufacturing methods
08/30/2005US6936383 Method of defining the dimensions of circuit elements by using spacer deposition techniques
08/30/2005US6936343 Ceramic substrate
08/30/2005US6936309 Depositing a low dielectric constant film comprising silicon, carbon, and hydrogen; treating the deposited film with a plasma of helium, hydrogen, or a mixture thereof at conditions sufficient to increase the hardness of film
08/30/2005US6936302 Electroless Ni-B plating liquid, electronic device and method for manufacturing the same
08/30/2005US6936301 Methods of controlling oxygen partial pressure during annealing of a perovskite dielectric layer
08/30/2005US6936180 Thin-film patterning method, manufacturing method of thin-film device and manufacturing method of thin-film magnetic head
08/30/2005US6936154 Planarity detection methods and apparatus for electrochemical mechanical processing systems
08/30/2005US6936153 contacting a surface of the wafer with an electrode at a contact face forming a part of the electrode, such contact face being covered by a contact face layer, formed from copper metal, immersing the surface of wafer in copper bath for plating
08/30/2005US6936144 High frequency plasma source
08/30/2005US6936135 Twist-N-Lock wafer area pressure ring and assembly for reducing particulate contaminant in a plasma processing chamber
08/30/2005US6936134 Substrate processing apparatus and substrate processing method
08/30/2005US6936133 Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool
08/30/2005US6936114 providing a steam source that produces steam at a greater pressure than atmospheric pressure, directing steam through the channel, steam removing the reaction products of aluminum and halogen from the channel of the component of the equipment
08/30/2005US6936108 Heat treatment device
08/30/2005US6936107 Coating film forming apparatus and coating unit
08/30/2005US6936103 Low indium content quantum well structures
08/30/2005US6935935 Measuring apparatus
08/30/2005US6935933 Viscous electropolishing system
08/30/2005US6935932 Polishing apparatus and method
08/30/2005US6935931 thermoplastic polyurethane foam with an average pore size of about 50 mu m or less, and multi-modal pore size distribution; useful for chemical mechanical polishing
08/30/2005US6935930 Polishing apparatus and method, and wafer evacuation program
08/30/2005US6935928 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
08/30/2005US6935830 Alignment of semiconductor wafers and other articles
08/30/2005US6935828 Wafer load lock and magnetically coupled linear delivery system
08/30/2005US6935638 Universal substrate holder for treating objects in fluids
08/30/2005US6935556 Method for mounting electronic components on substrates
08/30/2005US6935548 Dissipative ceramic bonding tool tip
08/30/2005US6935466 Lift pin alignment and operation methods and apparatus
08/30/2005US6935352 Adding energy to a cleaning process fluid for removing photo resist, residues and particles from semiconductor substrates, photo masks, reticles, disks and flat-panel displays
08/30/2005US6935351 Method of cleaning CVD device and cleaning device therefor
08/30/2005US6935269 Apparatus for treating the surface with neutral particle beams
08/30/2005US6935201 Measurement configuration including a vehicle and method for performing measurements with the measurement configuration at various locations
08/30/2005US6935038 Gap gauge
08/30/2005US6935022 Advanced microelectronic heat dissipation package and method for its manufacture
08/30/2005CA2461540C A reconfigurable integrated circuit with a scalable architecture
08/25/2005WO2005079124A1 Plasma producing device
08/25/2005WO2005079117A1 Cylindrical microwave chamber
08/25/2005WO2005078819A1 Methods of fabricating vertical carbon nanotube field effect transistors for arrangement in arrays and field effect transistors and arrays formed thereby
08/25/2005WO2005078816A1 Organic thin-film transistor, method for manufacturing same and organic thin-film device
08/25/2005WO2005078804A1 Semiconductor device having multi-gate structure and method of manufacturing the same
08/25/2005WO2005078793A1 Method for producing a power module and corresponding power module
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