Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2005
08/25/2005DE10207740B4 Verfahren zur Herstellung eines p-Kanal-Feldeffekttransistors auf einem Halbleitersubstrat A process for preparing a p-channel field-effect transistor on a semiconductor substrate
08/25/2005DE102005006734A1 Fabrication of split-gate transistor involves forming control gate structure conforming to side surface and including projecting portion that extends over portion of floating gate structure
08/25/2005DE102005006730A1 Lead frame for semiconductor chip package comprises leads on four sides of frame and tie bars extending from side edges and having recessed bottom surfaces
08/25/2005DE102005001851A1 Multichip package has pad of one semiconductor chip electrically connected to spacer pad which is connected to substrate bonding pad
08/25/2005DE102004063149A1 Fabrication of semiconductor device involves forming protective layer comprising hafnium oxide, on planarized copper layer which is formed by depositing copper in trench pattern on insulating layer
08/25/2005DE102004062585A1 Verfahren zur Ausbildung eines ultradünnen Films und Halbleitereinrichtung, die einen derartigen Film enthält A method of forming an ultra-thin film and semiconductor device containing such a film
08/25/2005DE102004061349A1 Verfahren zum Herstellen eines MOS-Feldeffekttransistors A method of manufacturing a MOS field effect transistor
08/25/2005DE102004059453A1 Halbleitervorrichtung Semiconductor device
08/25/2005DE102004059154A1 Verfahren zum Überprüfen einer laserbearbeiteten verschlechterten Schicht A method for checking a laser processed deteriorated layer
08/25/2005DE102004055640A1 LDMOS-Transistorvorrichtung, Integrierter Schaltkreis und Herstellungsverfahren hiervon LDMOS transistor device, integrated circuit and manufacturing method thereof
08/25/2005DE102004053095A1 Manufacture of capacitors for dynamic random access memory, comprises patterning layer of support material to form support structures around first electrodes
08/25/2005DE102004040748A1 Gerät und Verfahren zum Reinigen von Halbleitersubstraten Apparatus and method for cleaning semiconductor substrates
08/25/2005DE102004006520A1 DRAM storage cell, formed by producing trench capacitors in a semiconductor substrate, and applying a mask to enable gate sections to be formed
08/25/2005DE102004006258A1 Method for approximation of two measuring processes of tapering structure widths on substrate for obtaining mutually comparable values
08/25/2005DE102004005774A1 Method for manufacturing gate electrodes in field-plate trench transistors, involves etching back applied mask layer to give residual mask layer only within indentations
08/25/2005DE102004005242A1 Process for the generation of intensive short wavelength plasma emissions for EUV lithography
08/25/2005DE102004005022A1 Method for fabricating metallic conductor paths on electronic components, involves forming resist mask on copper seed layer by lithographic structuring
08/25/2005DE102004004879A1 Masking for a substrate during dry etching, comprises a hard mask which is applied to the substrate, followed by a photo lacquer
08/25/2005DE102004004865A1 Polymere auf der Basis von Zimtsäure als Antireflexschicht für die 157 nm Photolithographie Polymers on the basis of cinnamic acid as an anti-reflective coating for 157 nm photolithography
08/25/2005DE102004004597A1 Method for measuring a structure formed on semiconductor wafer e.g. for manufacture of integrated circuits, involves use of raster electron microscope with electron beam source and detector
08/25/2005DE102004004584A1 Halbleiterspeicherzelle sowie zugehöriges Herstellungsverfahren A semiconductor memory cell, and manufacturing method thereof
08/25/2005DE102004004406A1 Determining the volume of an etched structure, comprises weighing the substrate, etching by targeted removal of material, and then weighing the substrate
08/25/2005DE102004004289A1 Integrierte Schaltungsanordnung An integrated circuit device
08/25/2005DE102004003374A1 Halbleiter-Leistungsschalter sowie dafür geeignetes Herstellungsverfahren The semiconductor power switches and for suitable manufacturing process
08/25/2005DE102004003341A1 Attenuated phase shift mask for projecting a pattern onto a light sensitive layer, comprises a transparent mask substrate, and primary and secondary patterned sections
08/25/2005DE102004003275A1 Verbindungselemente auf Halbleiterchips für Halbleiterbauteile und Verfahren zur Herstellung derselben Connecting elements on semiconductor chips for semiconductor devices and method of manufacturing the same
08/25/2005DE10156341B4 Verdrahtungsaufbau für Übertragungsleitung Wiring structure for transmission line
08/25/2005DE10147120B4 Grabenkondensator und Verfahren zur Herstellung desselben Grave capacitor and method for manufacturing the same
08/25/2005CA2596831A1 Back-contact solar cells and methods for fabrication
08/25/2005CA2556824A1 Vapor phase growth method
08/25/2005CA2555032A1 Cylindrical microwave chamber
08/24/2005EP1566886A2 Power amplification apparatus, and mobile communication terminal apparatus
08/24/2005EP1566844A2 Multi-gate transistor and method for manufacturing the same
08/24/2005EP1566843A1 Silicon carbide semiconductor device and its manufacturing method
08/24/2005EP1566837A2 Semiconductor device manufacturing method
08/24/2005EP1566836A1 Semiconductor multilayer interconnection forming method
08/24/2005EP1566835A1 Insulating film material containing organic silane or organic siloxane compound, method for producing same, and semiconductor device
08/24/2005EP1566834A1 Light irradiator and light irradiating method
08/24/2005EP1566833A2 Method for integration of colloidal nanoparticles within epitaxial layers
08/24/2005EP1566832A1 Method for producing semiconductor substrate and method for fabricating field effect transistor and semiconductor substrate and field effect transistor
08/24/2005EP1566831A2 Semiconductor device and method for manufacturing it
08/24/2005EP1566830A1 Method for manufacturing soi wafer
08/24/2005EP1566827A1 Magnetron sputtering apparatus
08/24/2005EP1566810A2 Resistive memory device with stable writing
08/24/2005EP1566715A2 Method for real-time semiconductor process and yield analysis
08/24/2005EP1566698A1 Lithographic apparatus and device manufacturing method
08/24/2005EP1566697A2 Lithographic apparatus and device manufacturing method
08/24/2005EP1566696A1 Lithographic apparatus and device manufacturing method with feed-forward focus control.
08/24/2005EP1566693A2 Resist composition for immersion exposure and pattern forming method using the same
08/24/2005EP1566692A1 Photosensitive composition and pattern-forming method using the photosensitive composition
08/24/2005EP1566691A2 Method for correcting mask pattern, exposure mask, and mask producing method
08/24/2005EP1566642A1 Probe card
08/24/2005EP1566613A1 Sensor device
08/24/2005EP1566469A2 Process for producing a large volume CaF2 single crystal with a low scattering and improved laser stability, as well as such a crystal and its application
08/24/2005EP1566468A2 Method for fabrication of integrated circuits and corresponding device
08/24/2005EP1566421A2 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate.
08/24/2005EP1566420A1 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
08/24/2005EP1566417A1 Composition for porous film formation, porous film, process for producing the same, interlayer insulation film and semiconductor device
08/24/2005EP1566416A1 Coating liquid for forming amorphous silica coating film of low dielectric constant and process for producing the coating liquid
08/24/2005EP1566410A1 Thermally vanishing material, transfer sheet using the same, and method for forming pattern
08/24/2005EP1566244A1 Robot-guidance assembly for providing a precision motion of an object
08/24/2005EP1566236A1 Adhesive sheet for laser dicing having a controlled average surface roughness (Ra) and its manufacturing method
08/24/2005EP1565946A1 Transistors having buried p-type layers beneath the source region and methods of fabricating the same
08/24/2005EP1565939A1 Semiconductor device having a bond pad and method for its fabrication
08/24/2005EP1565936A2 Novel field effect transistor and method of fabrication
08/24/2005EP1565934A1 Drain/source extension structure of a field effect transistor including doped high-k sidewall spacers
08/24/2005EP1565933A2 Gcib processing of integrated circuit interconnect structures
08/24/2005EP1565932A2 Method for producing and testing a corrosion-resistant channel in a silicon device
08/24/2005EP1565931A1 Strained finfet cmos device structures
08/24/2005EP1565656A2 High-pressure device for closing a container in a clean room
08/24/2005EP1565536A1 B-stageable die attach adhesives
08/24/2005EP1565415A1 Substrate and method for the formation of continuous magnesium diboride and doped magnesium diboride wires
08/24/2005EP1565397A1 Dispersion of nanowires of semiconductor material
08/24/2005EP1565268A1 Nozzle arrangement
08/24/2005EP1470181B1 Improved interface adhesive
08/24/2005EP1421609A4 Process and apparatus for treating a workpiece such as a semiconductor wafer
08/24/2005EP1399951A4 Interchangeable microdeposition head apparatus and method
08/24/2005EP1399950A4 Formation of printed circuit board structures using piezo microdeposition
08/24/2005EP1399269A4 Waveform generator for microdeposition control system
08/24/2005EP1399268A4 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like
08/24/2005EP1399267A4 Microdeposition apparatus
08/24/2005EP1392449A4 Over-clocking in a microdeposition control system to improve resolution
08/24/2005EP1337700B1 Cvd reactor comprising a substrate holder rotatably mounted and driven by a gas flow
08/24/2005EP1299824A4 Convergence technique for model-based optical and proximity correction
08/24/2005EP1274807B1 Polishing agent and method for producing planar layers
08/24/2005EP1269266A4 A method of improving photomask geometry
08/24/2005EP1235257B1 Semiconductor-manufacturing apparatus
08/24/2005EP1192674A4 Universal tool interface and/or workpiece transfer apparatus for smif and open pod applications
08/24/2005EP0948810B1 Bump-bonded semiconductor imaging device
08/24/2005EP0932638B1 Acrylic sheet having uniform distribution of coloring and mineral filler before and after thermoforming
08/24/2005EP0863495B1 Display device
08/24/2005EP0842537B1 Programmable, non-volatile memory device, and method of manufacturing such a device
08/24/2005EP0820644B1 Semiconductor device provided with transparent switching element
08/24/2005CN2720781Y Carrying device for chip laoding port
08/24/2005CN2720641Y High-voltage assembly
08/24/2005CN2720639Y Insulation-layer-coated base of strain semiconductor
08/24/2005CN2720638Y Metal on-line structure
08/24/2005CN2720637Y Internal on-line structure
08/24/2005CN2720636Y 集成电路 IC
08/24/2005CN2720634Y Copper-made sequential structure