Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2005
08/23/2005US6933201 Method for manufacturing semiconductor device
08/23/2005US6933199 Method for integrating non-volatile memory with high-voltage and low-voltage logic in a salicide process
08/23/2005US6933198 Method for forming enhanced areal density split gate field effect transistor device array
08/23/2005US6933197 Method of manufacturing semiconductor device
08/23/2005US6933196 Isolation structure and method for semiconductor device
08/23/2005US6933195 Method of fabricating a flash memory device
08/23/2005US6933194 Method of manufacturing semiconductor device using STI technique
08/23/2005US6933193 Method of forming a capacitor
08/23/2005US6933192 Method for fabricating a trench having a buried dielectric collar
08/23/2005US6933191 Two-mask process for metal-insulator-metal capacitors and single mask process for thin film resistors
08/23/2005US6933190 Semiconductor device having a capacitor with rare metal electrode
08/23/2005US6933189 Integration system via metal oxide conversion
08/23/2005US6933188 Use of a selective hard mask for the integration of double diffused drain MOS devices in deep sub-micron fabrication technologies
08/23/2005US6933187 Method for forming narrow trench structures
08/23/2005US6933186 Method for BEOL resistor tolerance improvement using anodic oxidation
08/23/2005US6933185 Polysilicon evaluating method, polysilicon inspection apparatus and method for preparation of thin film transistor
08/23/2005US6933184 Method of manufacturing semiconductor device
08/23/2005US6933183 Selfaligned source/drain FinFET process flow
08/23/2005US6933182 Method of manufacturing a semiconductor device and manufacturing system thereof
08/23/2005US6933181 Method for fabricating semiconductor device
08/23/2005US6933180 Thin-film transistor and method for making the same
08/23/2005US6933179 Method of packaging semiconductor device
08/23/2005US6933178 Method of manufacturing semiconductor packages and a clamping device for manufacturing a semiconductor package
08/23/2005US6933175 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader
08/23/2005US6933174 Leadless leadframe package design that provides a greater structural integrity
08/23/2005US6933173 Method and system for flip chip packaging
08/23/2005US6933172 Semiconductor wafer with spacer and its manufacturing method, semiconductor device and its manufacturing method, and circuit substrate and electronic device
08/23/2005US6933171 Large bumps for optical flip chips
08/23/2005US6933170 Packaged microelectronic component assemblies
08/23/2005US6933167 Image sensor having micro-lens array separated with trench structures and method of making
08/23/2005US6933164 Method of fabrication of a micro-channel based integrated sensor for chemical and biological materials
08/23/2005US6933162 Method for fabricating a liquid crystal display
08/23/2005US6933158 Method of monitoring anneal processes using scatterometry, and system for performing same
08/23/2005US6933157 Semiconductor wafer manufacturing methods employing cleaning delay period
08/23/2005US6933156 Semiconductor capacitor with diffusion prevention layer
08/23/2005US6933155 Methods for providing a sub .15 micron magnetic memory structure
08/23/2005US6933100 Method of forming a minute resist pattern
08/23/2005US6933099 Method of forming a patterned metal layer
08/23/2005US6933095 Polymers, resist compositions and patterning process
08/23/2005US6933083 Selecting an intended modified form of illumination that the phase grating is to provide in a photolithography; dividing into subcells; arbitrarily assigning one of a plurality of phase values to the subcells, randomly selecting mask system
08/23/2005US6933082 Photomask with dust-proofing device and exposure method using the same
08/23/2005US6933041 Method for producing high surface area foil electrodes
08/23/2005US6933033 Scribed interleaf separator wafer packaging
08/23/2005US6933025 Chamber having components with textured surfaces and method of manufacture
08/23/2005US6933021 Diffusion barrier; protective coatings; reacting titanium nitride with organosilicon compound
08/23/2005US6933015 Moving coating solution discharge member relative to substrate while solution is being discharged to surface and changing discharge direction of solution to outer periphery to decrease amount of application there; uniformity; photolithography
08/23/2005US6933011 alternatively reacting a surface of the substrate with a non-fluorine containing copper precursor and an oxygen containing gas, reducing the copper oxide layer by contacting the oxide layer with a hydrogen containing gas to form a copper
08/23/2005US6933010 Mixer, and device and method for manufacturing thin-film
08/23/2005US6933009 Thin-film deposition method
08/23/2005US6932934 Formation of discontinuous films during an imprint lithography process
08/23/2005US6932916 Semiconductor substrate with trenches of varying depth
08/23/2005US6932915 System and method for integrated oxide removal and processing of a semiconductor wafer
08/23/2005US6932896 Applying a reverse bias that will cause removal of, or reduction in the size of, conductive particles on the work-piece-surface-influencing device; brushes rotating in a different direction during electrodeposition; wafers/circuits
08/23/2005US6932892 Apparatus and method for electrolytically depositing copper on a semiconductor workpiece
08/23/2005US6932885 Vacuum processing device
08/23/2005US6932884 Substrate processing apparatus
08/23/2005US6932873 Managing work-piece deflection
08/23/2005US6932872 Heating apparatus using induction heating
08/23/2005US6932871 Multi-station deposition apparatus and method
08/23/2005US6932868 Coating film forming apparatus
08/23/2005US6932867 Method for growing thin oxide films
08/23/2005US6932558 Wafer aligner
08/23/2005US6932354 Valve seal assembly
08/23/2005US6932262 Bonding method and bonding apparatus
08/23/2005US6932259 Brittle material breaking apparatus
08/23/2005US6932136 Post singulation die separation apparatus and method for bulk feeding operation
08/23/2005US6932111 Gate valve apparatus
08/23/2005US6932077 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus
08/23/2005US6931725 Circuit component built-in module, radio device having the same, and method for producing the same
08/23/2005US6931723 Organic dielectric electronic interconnect structures and method for making
08/23/2005US6931717 Apparatus for mounting an electronic part onto a circuit substrate
08/23/2005CA2277069C Integrated circuit tray with self aligning pocket
08/18/2005WO2005076683A1 Multilayer printed wiring board
08/18/2005WO2005076682A1 Multilayer printed wiring board
08/18/2005WO2005076679A2 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure
08/18/2005WO2005076382A1 Vertical field effect transistors incorporating semiconducting nanotubes grown in a spacer-defined passage
08/18/2005WO2005076368A1 Transistor with quantum dots in its tunnelling layer
08/18/2005WO2005076367A1 Thin film transistor array panel and manufacturing method thereof
08/18/2005WO2005076365A1 Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof
08/18/2005WO2005076362A2 Semiconductor device containing dielectrically isolated doped field shield region
08/18/2005WO2005076359A1 Semiconductor device
08/18/2005WO2005076358A1 Method for manufacturing thin film integrated circuit, and element substrate
08/18/2005WO2005076357A1 Single-poly 2-transistor based fuse element
08/18/2005WO2005076353A2 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
08/18/2005WO2005076352A1 Semiconductor device and method for manufacturing semiconductor device
08/18/2005WO2005076350A1 Memory device and method of manufacture
08/18/2005WO2005076349A1 System and method for stress free conductor removal
08/18/2005WO2005076348A1 System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
08/18/2005WO2005076347A1 Stress free etch processing in combination with a dynamic liquid meniscus
08/18/2005WO2005076346A1 In-situ liner formation during reactive ion etch
08/18/2005WO2005076345A1 Substrate with determinate thermal expansion coefficient
08/18/2005WO2005076344A1 Filling of insulation trenches using cmos-standard processes for creating dielectrically insulated areas on a soi disk
08/18/2005WO2005076343A1 Substrate holding tool and substrate treating device for treating semiconductor
08/18/2005WO2005076342A1 Non-contact carrier device
08/18/2005WO2005076341A1 PROCESS FOR PRODUCING p-TYPE ZINC OXIDE THIN FILM AND THIN FILM, AND SEMICONDUCTOR DEVICE
08/18/2005WO2005076340A1 Multi-gate transistor formed with active patterns of uniform critical dimension and fabricating method therefor
08/18/2005WO2005076339A1 A semiconductor device, an electronic device and an electronic apparatus
08/18/2005WO2005076338A1 Use of dissolved hafnium alkoxides or zirconium alkoxides as starting materials for hafnium oxide layers and hafnium oxynitride layers or zirconium oxide layers and zirconium oxynitride layers
08/18/2005WO2005076337A1 Techniques for the use of amorphous carbon (apf) for various etch and litho integration scheme
08/18/2005WO2005076336A1 Semiconductor device manufacturing method and insulating film etching method