Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
08/2005
08/24/2005CN1657865A System and method of using a side-mounted interferometer to acquire position information
08/24/2005CN1657648A Chemical vapor deposition method for amorphous silicon and resulting thin film
08/24/2005CN1657647A Method for operating an in-line coating installation
08/24/2005CN1657646A Sputter arrangement with a magnetron and a target
08/24/2005CN1657584A Adhesive sheet for laser dicing and its manufacturing method
08/24/2005CN1657530A Multi-functional linear siloxane compound, a siloxane polymer prepared from the compound, and a process for forming a dielectric film by using the polymer
08/24/2005CN1657462A Glass ceramic having a low thermal expansion
08/24/2005CN1657456A Synthetic silica glass member, photolithography apparatus and process for producing photolithography apparatus
08/24/2005CN1657401A 差动压力传感器 Differential Pressure Sensor
08/24/2005CN1657298A Thermal head and bonding connection method therefor
08/24/2005CN1657287A Ejection device, material coating method, method of manufacturing color filter substrate
08/24/2005CN1657220A Laser based splitting method, object to be split, and semiconductor element chip
08/24/2005CN1657209A Ceramic resonator welding machine
08/24/2005CN1216505C Photoelectric device and electronic apparatus
08/24/2005CN1216458C Semiconductor device with temp compensating circuit
08/24/2005CN1216427C Transistor with notches gate
08/24/2005CN1216425C Ferroelectric memory device and its manufacturing method, and hybrid device
08/24/2005CN1216423C Semiconductor device and its production method
08/24/2005CN1216422C Manufacturing method and structure of electroplated nickel/gold for electric contact pad of chip package substrate
08/24/2005CN1216419C Wiring baseboard, semiconductor device with wiring baseboard, and mfg. and installing method thereof
08/24/2005CN1216417C Nonvolatile memory
08/24/2005CN1216416C Mark design method for integrated circuit layout of semiconductor chip
08/24/2005CN1216415C Method of depositing metal film and metal deposition cluster including supercritical drying/cleaning module
08/24/2005CN1216414C Vacuum suction device capable of reducing particle pollution
08/24/2005CN1216413C Quick evaluation method for reliability of microelectronic device
08/24/2005CN1216412C Forming unit and manufacturing method thereof
08/24/2005CN1216411C Method for making laminated crystal semiconductor packaging device and structure thereof
08/24/2005CN1216410C Abrasives for chemical mechanical polishing
08/24/2005CN1216409C Method of forming rough compound crystal silicon layer on upper portion of semiconductor base
08/24/2005CN1216408C Method for increasing thermal oxidation uniformity and oxidation oven system
08/24/2005CN1216407C Process for preparing dielectric layer between metal layers
08/24/2005CN1216406C Magnetic p-n junction thin film material and mfg. method thereof
08/24/2005CN1216405C Semiconductor substrate, field effect transistor, and method for forming silicon germanide layer and manufacturing method thereof
08/24/2005CN1216404C Manufacturing method of semiconductor device
08/24/2005CN1216403C Exposure method
08/24/2005CN1216402C Method for preparing semiconductor zinc oxide film with periodic wide band gap
08/24/2005CN1216401C Method for preparing low temp. ultrathin heteroepitaxial flexible substrate
08/24/2005CN1216112C Polishing composition and polishing method for its use
08/24/2005CN1215968C Micro-structure and method for protecting structures material in manufacturing period
08/24/2005CN1215965C Transporting equipment
08/23/2005US6934930 Generating an optical model for lens aberrations
08/23/2005US6934925 Method for designing semiconductor circuit
08/23/2005US6934923 Semiconductor integrated circuit, method and program for designing the semiconductor integrated circuit
08/23/2005US6934920 Specimen analyzing method
08/23/2005US6934919 Semiconductor device having embedded array
08/23/2005US6934918 IP (Intellectual Property) generating system
08/23/2005US6934661 Wafer edge detector
08/23/2005US6934658 Computer chip heat responsive method and apparatus
08/23/2005US6934606 Automatic calibration of a wafer-handling robot
08/23/2005US6934595 Method and system for reducing semiconductor wafer breakage
08/23/2005US6934312 System and method for fabricating efficient semiconductor lasers via use of precursors having a direct bond between a group III atom and a nitrogen atom
08/23/2005US6934214 Semiconductor memory device having a hierarchical I/O structure
08/23/2005US6934212 Semiconductor apparatus
08/23/2005US6934206 Test structure for detecting bridging of DRAM capacitors
08/23/2005US6934196 Memory module with magnetoresistive elements and a method of reading data from in-row and in-column directions
08/23/2005US6934194 Nonvolatile memory having a trap layer
08/23/2005US6934193 Method of erasing a flash memory cell
08/23/2005US6934191 Nonvolatile semiconductor memory device
08/23/2005US6934186 Semiconductor device
08/23/2005US6934184 Magnetic memory
08/23/2005US6934182 Method to improve cache capacity of SOI and bulk
08/23/2005US6934180 Random access memory cell having reduced current leakage and having a pass transistor control gate formed in a trench
08/23/2005US6934179 Semiconductor integrated circuit device and bit line capacitance adjusting method using the device
08/23/2005US6934178 Nonvolatile data storage circuit using ferroelectric capacitors
08/23/2005US6934177 Ferroelectric memory device and read control method thereof
08/23/2005US6934175 Ferroelectric-type nonvolatile semiconductor memory
08/23/2005US6934173 256 Meg dynamic random access memory
08/23/2005US6934160 Printed circuit board arrangement
08/23/2005US6934154 Micro-channel heat exchangers and spreaders
08/23/2005US6934143 Metal-insulator-metal capacitor structure
08/23/2005US6934136 ESD protection of noise decoupling capacitors
08/23/2005US6934130 Magnetic device having shaped ferromagnetic film
08/23/2005US6934065 Microelectronic devices and methods for packaging microelectronic devices
08/23/2005US6934036 Configuration measuring apparatus and method
08/23/2005US6934032 Copper oxide monitoring by scatterometry/ellipsometry during nitride or BLOK removal in damascene process
08/23/2005US6934019 Confocal wafer-inspection system
08/23/2005US6934011 Method for optimizing the image properties of at least two optical elements as well as methods for optimizing the image properties of at least three optical elements
08/23/2005US6934010 Optical proximity correction method utilizing gray bars as sub-resolution assist features
08/23/2005US6934009 Illumination apparatus, illumination-controlling method, exposure apparatus, device fabricating method
08/23/2005US6934006 Exposure apparatus and exposure method for use in forming a pattern of a semiconductor device
08/23/2005US6934004 Exposure apparatus, semiconductor device manufacturing method, maintenance method of exposure apparatus, and semiconductor manufacturing factory
08/23/2005US6933989 Manufacturing method for a liquid crystal display device
08/23/2005US6933988 Active matrix substrate and method for producing the same
08/23/2005US6933813 Interconnection structure with etch stop
08/23/2005US6933796 Voltage controlled oscillating circuit
08/23/2005US6933750 Buffer circuit, buffer tree, and semiconductor device
08/23/2005US6933737 Probe card
08/23/2005US6933736 Prober
08/23/2005US6933731 Method and system for determining transistor degradation mechanisms
08/23/2005US6933715 Sensor system for sensing movement
08/23/2005US6933665 Structure and method for field emitter tips
08/23/2005US6933620 Semiconductor component and method of manufacture
08/23/2005US6933618 A tablet for producing a semiconductor device with substantially no bowing, comprising an epoxy resin composition comprising an epoxy resin and a curing agent, wherein the tablet has the characteristic of an amount reduced by heating
08/23/2005US6933616 has outward extension portions of under bump metallurgies (UBM) for satisfying the bonding area requirement during wire bonding operation
08/23/2005US6933615 Electronic component device and manufacturing method therefor
08/23/2005US6933614 Integrated circuit die having a copper contact and method therefor
08/23/2005US6933612 Semiconductor device with improved heatsink structure
08/23/2005US6933611 Selective solder bump application
08/23/2005US6933609 Interconnection structure and interconnection structure formation method
08/23/2005US6933608 Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus