| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 11/24/2005 | US20050257947 Integrated circuit having building blocks |
| 11/24/2005 | US20050257913 Heat sink with fins fitted and bonded thereto by applying conductive glue |
| 11/24/2005 | US20050257891 Plasma processing apparatus |
| 11/24/2005 | US20050257890 Method of cleaning an interior of a remote plasma generating tube and appartus and method for processing a substrate using the same |
| 11/24/2005 | US20050257889 Etching and cleaning methods and etching and cleaning apparatuses used therefor |
| 11/24/2005 | US20050257877 Bonded assemblies |
| 11/24/2005 | US20050257828 In-situ gas blending and dilution system for delivery of dilute gas at a predetermined concentration |
| 11/24/2005 | US20050257747 Worktable device, film formation apparatus, and film formation method for semiconductor process |
| 11/24/2005 | US20050257746 Clamp member, film deposition apparatus, film deposition method, and semiconductor device manufacturing method |
| 11/24/2005 | US20050257743 Plasma processing apparatus and method |
| 11/24/2005 | US20050257741 Film forming apparatus and method of manufacturing light emitting device |
| 11/24/2005 | US20050257738 Manufacturing apparatus of semiconductor device and pattern-forming method |
| 11/24/2005 | US20050257733 III nitride crystal and method for producing same |
| 11/24/2005 | US20050257617 Method and apparatus for ultrasonic scanning of a fabrication wafer |
| 11/24/2005 | US20050257396 Wafer dryer and method for drying a wafer |
| 11/24/2005 | DE69034191T2 EEPROM-System mit aus mehreren Chips bestehender Blocklöschung EEPROM system with an existing block of several chips deletion |
| 11/24/2005 | DE4016720B4 Verfahren und Vorrichtung zum Ultraschallbonden Method and apparatus for ultrasonic bonding |
| 11/24/2005 | DE19752510B4 Einrichtung und Verfahren zur Erkennung und Unterscheidung geometrisch verschiedener Arten von fächerbildenden Auflagen in Kassetten und darauf abgelegten scheibenförmigen Objekten Apparatus and method for detecting and distinguishing geometrically different types of fan-forming conditions in packs and stored on disk-shaped objects |
| 11/24/2005 | DE19742072B4 Verfahren zur Herstellung druckdichter Durchkontaktierungen A process for producing a pressure-tight vias |
| 11/24/2005 | DE19581789B4 Ankoppelungsvorrichtung und System für Substrate Ankoppelungsvorrichtung and system for substrates |
| 11/24/2005 | DE10236880B4 Getriebemechanismus zum Übertragen einer Drehkraft auf eine Waferauflageplatte einer Ionenimplantiervorrichtung Transmission mechanism for transmitting a rotational force to a wafer platen an ion implanter |
| 11/24/2005 | DE102005028166A1 Treating a semiconductor wafer comprises using a system held by rollers which hold the wafer in a region of their edges so that an etching medium flows against the edge of the wafer |
| 11/24/2005 | DE102005018347A1 Flash-Speicherzelle, Flash-Speichervorrichtung und Herstellungsverfahren hierfür Flash memory cell flash memory device and manufacturing method thereof |
| 11/24/2005 | DE102005018114A1 Spannungs-/Prozessbewertung bei Halbleitern Voltage / process evaluation in semiconductors |
| 11/24/2005 | DE102005018108A1 Verfahren zur Herstellung eines Halbleiterbauelements mit einer Lötschicht A process for producing a semiconductor device with a solder layer |
| 11/24/2005 | DE102005016573A1 Laserstrahl-Bearbeitungsmaschine Laser beam processing machine |
| 11/24/2005 | DE102004063454A1 Verfahren zur Herstellung einer Gateelektrode einer Halbleitervorrichtung A method of manufacturing a gate electrode of a semiconductor device |
| 11/24/2005 | DE102004063452A1 Fabrication of flash memory device includes depositing first oxide layer, polysilicon layers, and dielectric layer, forming second oxide layer, performing heat treatment, and removing parts of dielectric layer and second polysilicon layer |
| 11/24/2005 | DE102004062834A1 Metal pattern formation n semiconductor device manufacture, involves forming damascene trench having inclined bottom profile for exposing side wall of interconnection contact |
| 11/24/2005 | DE102004043626A1 Production process for a semiconductor structure in shallow trench isolation forms oxide layer between trench and spin on glass filling and thermally cures |
| 11/24/2005 | DE102004021457A1 Production of a layer structure for DRAM memory chips comprises depositing an amorphous silicon layer on a substrate using a PECVD method and structuring the silicon layer to form a hard mask |
| 11/24/2005 | DE102004021442A1 Process for measuring the characteristics of a structure especially on a mask or wafer in semiconductor technology scans the structure in rows in at least two different directions |
| 11/24/2005 | DE102004021401A1 Stapelkondensatorfeld und Herstellungsverfahren für ein Stapelkondensatorfeld Stack capacitor array and manufacturing method of a stacked capacitor field |
| 11/24/2005 | DE102004021398A1 Verfahren und Schaltungsanordnung zum Zurücksetzen einer integrierten Schaltung Method and circuit for resetting an integrated circuit |
| 11/24/2005 | DE102004021391A1 Integrated circuit has cmos and or logic circuit and a power circuit with pile up effect dopant enrichment by the trench structure |
| 11/24/2005 | DE102004021260A1 System und Verfahren für eine erhöhte Badlebensdauer in einem Einzelbadplattierungsverfahren System and method for enhanced bath life in a Einzelbadplattierungsverfahren |
| 11/24/2005 | DE102004021259A1 Production of a semiconductor substrate used in electronic products, e.g. laptops, comprises preparing the substrate, forming a contact surface on a first surface, thinning the substrate and forming a solder on the contact surface |
| 11/24/2005 | DE102004021113A1 SOI-Scheibe und Verfahren zu ihrer Herstellung SOI wafer and processes for their preparation |
| 11/24/2005 | DE102004021085A1 Eine Technik zum Verringern der Rauhigkeit von Metallleitungen in einer Metallisierungsschicht One technique for reducing the roughness of the metal lines in a metallization layer |
| 11/24/2005 | DE102004020593A1 Fin-Feldeffekttransistor-Anordnung und Verfahren zum Herstellen einer Fin-Feldeffektransistor-Anordnung Fin field effect transistor arrangement and method for producing a fin field effect transistor arrangement |
| 11/24/2005 | DE102004020230A1 Zusammesetzung für das Chemisch-Mechanische Polieren (CMP) Present constituted for the Chemical-Mechanical Polishing (CMP) |
| 11/24/2005 | DE102004020213A1 Zusammensetzung für das Chemisch-Mechanische Polieren (CMP) Composition for chemical-mechanical polishing (CMP) |
| 11/24/2005 | DE102004019090A1 Trench capacitor used in a semiconductor memory cell comprises a trench formed in a semiconductor substrate, an insulating collar in the upper region of the trench, upper and lower capacitor electrodes and a dielectric layer |
| 11/24/2005 | DE102004014753B3 Ceramic element e.g. for temperature measurement over high temperature conductor, has body, connection ports with electrical inlets attached to it and element body has connection ports and are soldered on ends of the inlets in glass body |
| 11/24/2005 | DE102004010673A1 Semiconductor device, has two tunnel FETs of opposite conductivity types arranged in substrate |
| 11/24/2005 | DE10152911B4 Integrierte Schaltungsvorrichtungen, die aktive Bereiche mit erweiterten effektiven Breiten aufweisen, und Verfahren zur Herstellung derselben Integrated circuit devices having active regions with enhanced effective widths, and processes for making them |
| 11/24/2005 | DE10035439B4 Verbesserter DRAM-Durchgangstransistor mit Arsen-Implantierung Improved DRAM pass transistor with arsenic implantation |
| 11/24/2005 | CA2605871A1 Microfabricated miniature grids |
| 11/23/2005 | EP1599078A2 Method of mounting an electronic component on a substrate |
| 11/23/2005 | EP1599076A1 Wired circuit board |
| 11/23/2005 | EP1598909A2 Semiconductor device having quantum well structure, and method of forming the same |
| 11/23/2005 | EP1598881A2 Method for removing a substance from a substrate using electron attachment |
| 11/23/2005 | EP1598880A2 Method of manufacturing of an OLED display |
| 11/23/2005 | EP1598872A1 High dielectric constant insulating film, thin-film capacitive element, thin-film multilayer capacitor, and method for manufacturing thin-film capacitive element |
| 11/23/2005 | EP1598871A1 Thin-film capacitative element and electronic circuit or electronic equipment including the same |
| 11/23/2005 | EP1598870A1 Thin-film capacitative element and electronic circuit or electronic equipment including the same |
| 11/23/2005 | EP1598867A2 Test circuit under pad |
| 11/23/2005 | EP1598865A1 Mram with a novel buffer layer |
| 11/23/2005 | EP1598864A2 Hardenable pressure-senstitive adhesive sheet for semiconductors and process for producing a semiconductor device |
| 11/23/2005 | EP1598863A1 Semiconductor device and radiation detector employing it |
| 11/23/2005 | EP1598862A1 Semiconductor device and radiation detector employing it |
| 11/23/2005 | EP1598861A1 Method and machine for calibrating and controlling the embedding process in the manufacturing of chip cards |
| 11/23/2005 | EP1598860A2 TFT, method of manufacturing the TFT, flat panel display having the TFT, and method of manufacturing the flat panel display |
| 11/23/2005 | EP1598859A1 Substrate processing method |
| 11/23/2005 | EP1598858A1 Etching resistant film, process for producing the same, surface cured resist pattern, process for producing the same, semiconductor device and process for producing the same |
| 11/23/2005 | EP1598856A2 Method of manufacturing optical devices and related improvements |
| 11/23/2005 | EP1598854A1 Semiconductor device and semiconductor production management system |
| 11/23/2005 | EP1598853A1 Adjustment apparatus for wafers |
| 11/23/2005 | EP1598840A1 Composition for thin-film capacitor device, high dielectric constant insulator film, thin-film capacitor device, thin-film multilayer capacitor, electronic circuit and electronic device |
| 11/23/2005 | EP1598805A2 SRAM core cell for light-emitting display |
| 11/23/2005 | EP1598706A1 Lithographic appartus and device manufacturing method |
| 11/23/2005 | EP1598705A1 Lithographic apparatus and device manufacturing method |
| 11/23/2005 | EP1598703A1 Acrylic polymer-containing gap filler forming composition for lithography |
| 11/23/2005 | EP1598702A1 Coating compositions for use with an overcoated photoresist |
| 11/23/2005 | EP1598700A1 Applicability improver for photosensitive resin composition and photosensitive resin composition containing the same |
| 11/23/2005 | EP1598648A2 Shearing interferometer with dynamic pupil fill |
| 11/23/2005 | EP1598448A1 Lead-free bump and method for forming the same |
| 11/23/2005 | EP1598140A1 Laser machining |
| 11/23/2005 | EP1597947A1 Method for manufacturing an electronic module |
| 11/23/2005 | EP1597946A1 Method for manufacturing an electronic module, and an electronic module |
| 11/23/2005 | EP1597775A2 Improved photovoltaic cell and method of production thereof |
| 11/23/2005 | EP1597769A1 Semiconductor device and method of manufacturing such a device |
| 11/23/2005 | EP1597767A2 Integrated semiconductor circuit comprising a transistor with laterally staggered source and drain electrodes |
| 11/23/2005 | EP1597762A2 Thin multiple semiconductor die package |
| 11/23/2005 | EP1597761A2 Packaged microchip with thermal stress relief |
| 11/23/2005 | EP1597760A1 Integrated electronic component having specifically produced nanotubes in vertical structures |
| 11/23/2005 | EP1597759A1 Relaxation of a thin layer at a high temperature after its transfer |
| 11/23/2005 | EP1597758A1 Relaxation of a thin layer after its transfer |
| 11/23/2005 | EP1597757A2 Connection technology for power semiconductors comprising a layer of electrically insulating material that follows the surface contours |
| 11/23/2005 | EP1597756A2 Internal connection system for power semiconductors comprising large-area terminals |
| 11/23/2005 | EP1597755A2 Self-supporting contacting structures that are directly produced on components without housings |
| 11/23/2005 | EP1597754A2 A method of etching ferroelectric devices |
| 11/23/2005 | EP1597753A2 Coated spherical silicon nanoparticle thin film uv detector with uv response and method of making |
| 11/23/2005 | EP1597752A2 Tailoring nitrogen profile in silicon oxynitride using rapid thermal annealing with ammonia under ultra-low pressure |
| 11/23/2005 | EP1597751A2 Advanced microelectronic connector assembly and method of manufacturing |
| 11/23/2005 | EP1597408A2 Dielectric barrier layer films |
| 11/23/2005 | EP1597332A1 Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices |
| 11/23/2005 | EP1597328A2 Modular barrier removal polishing slurry |
| 11/23/2005 | EP1597194A1 Templated cluster assembled wires |
| 11/23/2005 | EP1573778A3 Access to one or more levels of material storage shelves by an overhead hoist transport vehicle from a single track position |