Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2006
01/12/2006DE102005019358A1 Laserstrahl-Bearbeitungsmaschine Laser beam processing machine
01/12/2006DE102004063246A1 Flüssige Zusammensetzung für die Immersions-Lithographie und Lithographieverfahren unter Verwendung derselben A liquid composition for immersion lithography and lithographic method using the same
01/12/2006DE102004055817B3 Manufacture procedure for heavy-duty semiconductor modules involves mass of solder to produce solder connection and particles of copper are sprayed into place on solder
01/12/2006DE102004054745A1 Verfahren zur Herstellung eines eine Mikrostruktur aufweisenden Elements A process for producing a microstructure bearing element
01/12/2006DE102004030383A1 Bondfolie und Halbleiterbauteil mit Bondfolie sowie Verfahren zu deren Herstellung Bond film and semiconductor device having bonding film and to processes for their preparation
01/12/2006DE102004029584A1 Anordnung zur Erhöhung der Zuverlässigkeit von substratbasierten BGA-Packages Arrangement for increasing the reliability of substrate-based BGA Packages
01/12/2006DE102004029520A1 Transistor-Anordnung Transistor arrangement
01/12/2006DE102004029519A1 Verfahren zum Herstellen einer Schicht-Anordnung A method for producing a layer arrangement
01/12/2006DE102004029212A1 Vorrichtung und Verfahren zur optischen Auf- und/oder Durchlichtinspektion von Mikrostrukturen im IR Apparatus and method for optical-up and / or transmitted light inspection of microstructures in the IR
01/12/2006DE102004029200A1 Verfahren zur Herstellung eines Gehäuses für eine elektronische Schaltung sowie ein Substrat für ein Gehäuse Method for producing a housing for an electronic circuit and a substrate for a housing
01/12/2006DE102004029014A1 Verfahren und System zur Inspektion eines Wafers A method and system for inspecting a wafer
01/12/2006DE102004029012A1 Verfahren und System zur Inspektion eines Wafers A method and system for inspecting a wafer
01/12/2006DE102004019567B3 Securing electronic components to substrate by subjecting the electronic component, supporting film and paste-like layer to pressure and connecting the substrate and the component by sintering
01/12/2006DE102004005645B4 Verfahren zur Herstellung von Schichtaufbauten zur Signalverteilung A process for the production of layer structures for signal distribution
01/12/2006DE10136022B4 Verfahren zur Vermeidung oder Beseitigung von Ausscheidungen im Abgasbereich einer Vakuumanlage Procedures to prevent or eliminate discharges in the exhaust of a vacuum system
01/12/2006DE10135308B4 Elektronisches Bauelement und entsprechendes Herstellungsverfahren The electronic component and corresponding production method
01/12/2006DE10108081B4 Anordnung eines Halbleiterchips auf einem Substrat Arrangement of a semiconductor chip on a substrate
01/12/2006DE10104742B4 Grabenstruktur für eine Halbleiterschaltungsanordnung Grave structure for a semiconductor circuit arrangement
01/12/2006DE10030442B4 Verbindungselement in einem integrierten Schaltkreis Connection element in an integrated circuit
01/12/2006DE10021735B4 Verfahren zur Herstellung eines Halbleiterbauelements mit metallischer Leiterbahn A process for producing a semiconductor device with a metallic conductor track
01/12/2006DE10002121B4 Herstellung einer Halbleitervorrichtung mit flachen Sperrschichten Manufacturing a semiconductor device having flat barrier layers
01/11/2006EP1615482A1 Laser plasma producing method and device
01/11/2006EP1615324A2 Method and apparatus for controlling a circuit with a high voltage sense device
01/11/2006EP1615275A2 Method of manufacturing an electro-optical device
01/11/2006EP1615273A1 Compound semiconductor wafer and process for producing the same
01/11/2006EP1615269A1 Magnetic memory cell, magnetic memory device, and magnetic memory device manufacturing method
01/11/2006EP1615267A1 Metal-base circuit board and its manufacturing method
01/11/2006EP1615265A1 Semiconductor device and fabrication method thereof
01/11/2006EP1615264A2 Method of manufacturing an electronic parts packaging structure
01/11/2006EP1615263A1 Method for interconnecting terminals and method for mounting semiconductor device
01/11/2006EP1615262A1 Active matrix for oled display
01/11/2006EP1615261A1 Semiconductor wafer heat treating jig
01/11/2006EP1615260A2 Organic silicon-oxide-based film, composition and method for forming the same, and semiconductor device
01/11/2006EP1615259A1 Susceptor and vapor growth device
01/11/2006EP1615071A1 Mask blank, mask blank manufacturing method, transfer mask manufacturing method, and semiconductor device manufacturing method
01/11/2006EP1615067A1 Optical element, optical system, laser device, exposure device, mask testing device, and high polymer crystal processing device
01/11/2006EP1614775A2 Method of improving surface flatness of group-III nitride crystal, substrate for epitaxial growth, and semiconductor device
01/11/2006EP1614768A1 Method for forming film
01/11/2006EP1614649A1 Method and device for sticking tape
01/11/2006EP1614499A1 Laser cutting method and arrangement for performing said method
01/11/2006EP1614184A1 Integrated passive devices fabricated utilizing multi-layer, organic laminates
01/11/2006EP1614166A2 Fluidic nanotubes and devices
01/11/2006EP1614162A2 Radiation-hardened transistor fabricated by modified cmos process
01/11/2006EP1614158A2 Multichip module comprising a plurality of semiconductor chips and printed circuit board comprising a plurality of components
01/11/2006EP1614152A1 Sacrificial metal liner for copper interconnects
01/11/2006EP1614151A2 Organosilicate resin formulation for use in microelectronic devices
01/11/2006EP1614150A2 Device and method for cleaning objects used to produce semiconductors, especially transport and cleaning containers for wafers
01/11/2006EP1614146A2 Polycrystalline germanium-based waveguide detector integrated on a thin silicon-on-insulator (soi) platform
01/11/2006EP1614145A2 Silicon substrate comprising positive etching profiles with a defined slope angle, and production method
01/11/2006EP1614125A2 Method for producing soldering globules on an electrical component
01/11/2006EP1613866A2 Fluid handling component with ultraphobic surfaces
01/11/2006EP1613790A1 Method for hafnium nitride deposition
01/11/2006EP1613686A1 Organic siloxane resins and insulating film using the same
01/11/2006EP1613541A2 Carrier with ultraphobic surfaces
01/11/2006EP1474806B1 Antiferromagnetically stabilized pseudo spin valve for memory applications
01/11/2006EP1330836B1 Method for producing a schottky diode in silicon carbide
01/11/2006EP1269530B1 Method of making a trench gate dmos transistor
01/11/2006EP1249521B1 SiC SINGLE CRYSTAL AND METHOD FOR GROWING THE SAME
01/11/2006EP1195083B1 Underfilling material for semiconductor package
01/11/2006EP0959719A4 A brush assembly apparatus
01/11/2006EP0942060B1 Thermally conductive pressure-sensitive adhesive, adhesive sheet containing the same, and method for fixing electronic part to heat-radiating member with the same
01/11/2006EP0839321B1 Contact tip structures for microelectronic interconnection elements and methods of making same
01/11/2006CN2751509Y Substrate for flip-chip (FC) packaging technology
01/11/2006CN2751478Y Generator and semiconductor device
01/11/2006CN2751447Y Multi-grid transistor
01/11/2006CN2751446Y Structure of multi-grid dielectric layer
01/11/2006CN2751445Y Memory cell
01/11/2006CN2751444Y Complementary MOS having strain channel
01/11/2006CN2751442Y 静电放电保护电路 Electrostatic discharge protection circuit
01/11/2006CN2751439Y Structure for isolating trench
01/11/2006CN2751438Y 半导体装置 Semiconductor device
01/11/2006CN1720621A Programmable semiconductor device
01/11/2006CN1720618A Self aligned shallow trench isolation with improved coupling coefficient in floating gate devices
01/11/2006CN1720617A Metal core substrate packaging
01/11/2006CN1720616A High performance embedded dram technology with strained silicon
01/11/2006CN1720615A Circuit layout structure
01/11/2006CN1720614A Method for the manufacture of a display
01/11/2006CN1720613A Semiconductor producing device using mini-environment system
01/11/2006CN1720612A Component-supplying head device, component-supplying device, comonent-mounting device, and method of moving mounting head portion
01/11/2006CN1720611A Spacer take-up device in processing mechanism of film carrier tape for mounting electronic component and method
01/11/2006CN1720610A Thin CaAs die with copper back-metal structure
01/11/2006CN1720609A Parts feeder
01/11/2006CN1720608A Composite leadframe LED package and method of making the same
01/11/2006CN1720607A Drain/source extension structure of a field effect transistor including doped high-k sidewall spacers
01/11/2006CN1720606A Semiconductor device and its manufacturing method
01/11/2006CN1720605A Manufacturing process for a multilayer structure
01/11/2006CN1720598A Method and apparatus for monitoring a plasma in a material processing system
01/11/2006CN1720588A Flash memory cell arrays having dual control gates per memory cell charge storage element
01/11/2006CN1720581A Exchange method and mechanism of magnetic head pard and hanger or head gimbal assembly for hard disk drive in producing process
01/11/2006CN1720537A Non-oriented optical character recognition of a wafer mark
01/11/2006CN1720532A Method and apparatus for monitoring a material processing system
01/11/2006CN1720485A Composition for forming antireflection coating
01/11/2006CN1720484A Positive type photoresist composition for LCD production and method of forming resist pattern
01/11/2006CN1720483A Local flare correction
01/11/2006CN1720457A Circuit pattern inspection instrument and pattern inspecting method
01/11/2006CN1720446A Methods and systems for process monitoring using X-ray emission
01/11/2006CN1720445A Methods and systems for process monitoring using X-ray emission
01/11/2006CN1720413A Raw solution feeding system for vaporizer and method of cleaning the raw solution feeding system
01/11/2006CN1720356A Fabrication method for crystalline semiconductor films on foreign substrates
01/11/2006CN1720353A Composition and method for copper chemical mechanical planarization