Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2006
02/02/2006US20060022290 Image sensor packaging structure and method of manufacturing the same
02/02/2006US20060022289 Electro-optical circuitry having integrated connector and methods for the production thereof
02/02/2006US20060022288 Semiconductor integrate device and method for manufacturing same
02/02/2006US20060022286 Ferromagnetic liner for conductive lines of magnetic memory cells
02/02/2006US20060022284 Semiconductor devices and methods for manufacturing the same
02/02/2006US20060022280 Formation of fully silicided metal gate using dual self-aligned silicide process
02/02/2006US20060022279 Semiconductor constructions
02/02/2006US20060022278 Method and structure for a low voltage CMOS integrated circuit incorporating higher-voltage devices
02/02/2006US20060022277 Planarizing a semiconductor structure to form replacement metal gates
02/02/2006US20060022275 Planar dual-gate transistor and method for fabricating a planar dual-gate transistor
02/02/2006US20060022269 Semiconductor substrate, semiconductor device, method for manufacturing semiconductor substrate and method for manufacturing semiconductor device
02/02/2006US20060022268 Semiconductor devices including stress inducing layers
02/02/2006US20060022267 Semiconductor device and method of manufacturing the semiconductor device
02/02/2006US20060022266 Manufacturable recessed strained rsd structure and process for advanced cmos
02/02/2006US20060022265 Semiconductor device having a lateral MOSFET and combined IC using the same
02/02/2006US20060022264 Method of making a double gate semiconductor device with self-aligned gates and structure thereof
02/02/2006US20060022263 Selective substrate thinning for power mosgated devices
02/02/2006US20060022261 Insulated gate semiconductor device and method of making the same
02/02/2006US20060022260 Semiconductor device and manufacturing method of semiconductor device
02/02/2006US20060022259 Nonvolatile semiconductor memory device and manufacturing method thereof
02/02/2006US20060022257 Semiconductor device and a method of manufacturing the same
02/02/2006US20060022251 Semiconductor device and method for manufacturing the same
02/02/2006US20060022250 Semiconductor device which includes a capacitor and an interconnection film coupled to each other and a manufacturing method thereof
02/02/2006US20060022249 Memory device and method for fabricating the same
02/02/2006US20060022247 Transparent amorphous carbon structure in semiconductor devices
02/02/2006US20060022242 Semiconductor device and method for fabricating the same
02/02/2006US20060022241 Semiconductor memory device having capacitor using dielectric film, and method of fabricating the same
02/02/2006US20060022240 Single transistor DRAM cell with reduced current leakage and method of manufacture
02/02/2006US20060022235 Solid-state imaging device, production method and drive method thereof, and camera
02/02/2006US20060022232 Image sensor with improved charge transfer efficiency and method for fabricating the same
02/02/2006US20060022231 Barrier regions for image sensors
02/02/2006US20060022230 Solid-state image sensing device and method for manufacturing the same
02/02/2006US20060022228 Method of manufacturing silicon nitride film, method of manufacturing semiconductor device, and semiconductor device
02/02/2006US20060022227 Novel buffer (seed) layer in a high performance magnetic tunneling junction MRAM
02/02/2006US20060022220 Spin-injection device and magnetic device using spin-injection device
02/02/2006US20060022216 Semiconductor light-emitting device and method of manufacturing the same
02/02/2006US20060022214 LED package methods and systems
02/02/2006US20060022209 Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads
02/02/2006US20060022208 Strontium silicate-based phosphor, fabrication method thereof, and led using the phosphor
02/02/2006US20060022207 Surface-emitting type wafer and method for manufacturing the same, and burn-in method for surface-emitting type wafers
02/02/2006US20060022205 Image sensor with improved charge transfer efficiency and method for fabricating the same
02/02/2006US20060022204 Electroluminescent display devices
02/02/2006US20060022203 Substrate for display, method of manufacturing the same and display having the same
02/02/2006US20060022200 Method for producing semiconductor substrate and method for fabricating field effect transistor and semiconductor substrate and field effect transistor
02/02/2006US20060022192 Inexpensive organic solar cell and method of producing same
02/02/2006US20060022191 Nanostructure, electronic device having such nanostructure and method of preparing nanostructures
02/02/2006US20060022149 Ion implantation apparatus and method for implanting ions by using the same
02/02/2006US20060022139 Composite structure providing steady-state non-equilibrium distribution of free carriers and IR system using same for photon energy up-conversion
02/02/2006US20060022134 Method of removing particle of photomask using atomic force microscope
02/02/2006US20060022019 Bonding apparatus
02/02/2006US20060021992 Cover body device and vacuum vessel device
02/02/2006US20060021974 Method and composition for polishing a substrate
02/02/2006US20060021970 Method and apparatus for non-invasive measurement and analysis of semiconductor process parameters
02/02/2006US20060021969 Method for controlling the temperature of a gas distribution plate in a process reactor
02/02/2006US20060021966 Production process and production system of magnetic recording medium
02/02/2006US20060021965 Method of double-sided etching
02/02/2006US20060021904 Thin plate storage container
02/02/2006US20060021853 Transporting apparatus
02/02/2006US20060021734 Heat sink and heat spreader bonding structure
02/02/2006US20060021704 Method and apparatus for etching Si
02/02/2006US20060021702 Cluster tool and method for process integration in manufacture of a gate structure of a field effect transistor
02/02/2006US20060021647 Molecular photovoltaics, method of manufacture and articles derived therefrom
02/02/2006US20060021582 Heat treatment apparatus
02/02/2006US20060021575 Method for carrying object to be processed
02/02/2006US20060021570 Reduction in size of hemispherical grains of hemispherical grained film
02/02/2006US20060021568 Shower head structure and treating device
02/02/2006US20060021214 Methods for making device enclosures and devices with an integrated battery
02/02/2006DE69633713T2 Verfahren und Vorrichtung zur Prüfung von integrierten Schaltungen Method and device for testing of integrated circuits
02/02/2006DE19945140B4 Verfahren zur Herstellung einer Maskenschicht mit Öffnungen verkleinerter Breite A process for producing a mask layer with a reduced width openings
02/02/2006DE19861329B4 Semiconductor device with interlayer insulating film - based on silicon atoms, each bonded to oxygen and carbon atoms
02/02/2006DE19828391B4 Flüssigkristallanzeige Liquid-crystal display
02/02/2006DE19827237B4 Leiterplattensubstrat für Halbleiterbauelementgehäuse und ein dasselbe verwendende Halbleiterbauelementgehäuse sowie Herstellungsverfahren für diese PCB substrate for semiconductor device package and a semiconductor device the same housing and manufacturing method used for this
02/02/2006DE19730347B4 Statische Halbleitervorrichtung, die eine variable Stromversorgungsspannung, die an eine Speicherzelle angelegt wird, abhängig von dem Status im Gebrauch aufweist, und Verfahren zum Testen derselben Static semiconductor device, which, depending has a variable power supply voltage, which is applied to a memory cell from the state in use, and methods of testing same
02/02/2006DE19718398B4 Handhabungsvorrichtung Handling device
02/02/2006DE19617470B4 Fadenzuführung Thread feed
02/02/2006DE19612407B4 Halbleiterspeichereinrichtung A semiconductor memory device
02/02/2006DE19536005B4 Vorrichtung zum hochgenauen Erfassen und Positionieren von Mikrobauelementen Apparatus for highly accurate sensing and positioning of micro devices
02/02/2006DE112004000395T5 Halbleiterwafer mit nichtrechteckig geformten Chips Semiconductor wafer with non-rectangular shaped chips
02/02/2006DE112004000333T5 Silesquioxan-Harz, Positiv-Resist-Zusammensetzung, Resist-Laminat und Methode zur Bildung eines Resist-Musters Silsesquioxane resin, positive resist composition, the resist laminate and method for forming a resist pattern
02/02/2006DE112004000258T5 Alternativer Entwurf für ein Flip Chip in Leaded Molded Package und Verfahren zur Herstellung Alternative design for a Flip Chip in Leaded Molded Package and method for producing
02/02/2006DE10394180T5 Integrierter Schaltungsbaustein und Verfahren zu seiner Herstellung Integrated circuit package and method for its preparation
02/02/2006DE10393870T5 Verfahren zum Reduzieren von Kontaktdefekten in Halbleiterzellen A method for reducing defects in contact semiconductor cells
02/02/2006DE10343503B3 SOI-Bauelement mit erhöhter Spannungsfestigkeit und verbesserter Wärmeableitung SOI device with high dielectric strength and improved heat dissipation
02/02/2006DE10255231B4 Hochdruckvorrichtung zum Verschließen eines Druckbehälters im Reinraum High-pressure device for closing a pressure vessel in the clean room
02/02/2006DE10201864B4 CMOS-Halbleitervorrichtung und Verfahren zur Herstellung derselben CMOS semiconductor device and method of manufacturing the same
02/02/2006DE102005029499A1 Lithographische Maske und Herstellungsverfahren hierfür Lithographic mask and manufacturing method thereof
02/02/2006DE102005005707B3 Radiation of object surface with melting in radiation active region useful for decontamination of an object with electrically conductive surface and production of high purity compositions, where melt is electrically conductive
02/02/2006DE102005001260A1 Optische Halbleiterbauteile und Herstellverfahren für diese Optical semiconductor devices and manufacturing methods for these
02/02/2006DE102004063519A1 Verfahren zur Bildung einer Verbindungsleitung in einem Halbleiterbauelement uner Verwendung einer Phasenverschiebungsfotomaske A method of forming a connection line in a semiconductor device using an unwanted phase shift photomask
02/02/2006DE102004049518B3 Verfahren zum tiefenaufgelösten Charakterisieren einer Schicht eines Trägers A method for depth-resolved characterization of a layer of a support
02/02/2006DE102004033879A1 Inspection, measurement and repair system for use in the semiconductor industry combines a manipulator with inspection, measurement and repair modules with the object under test handled using interfaces to the manipulator
02/02/2006DE102004033285A1 Functionality testing of electrical components and cable encapsulated in thermoplastic involves testing electrical properties of the component during the plastic encapsulation stage
02/02/2006DE102004033208A1 Vorrichtung zur Inspektion eines mikroskopischen Bauteils mit einem Immersionsobjektiv Apparatus for inspecting a microscopic component with an immersion lens
02/02/2006DE102004032706A1 Verfahren zur Herstellung eines elektrischen Bauelements und das Bauelement Process for the preparation of an electrical component and the component
02/02/2006DE102004031386A1 Testing adapter unit for verifying programming of current limiting of power supply unit, has measuring resistor between contact devices, and comparator outlet to output signal when reference voltage exceeds measuring voltage
02/02/2006DE102004030723A1 Mobile electrostatic substrate holder for wafer, has electrically conductive coating formed on back of holder within openings, where rear side metallization and continuation of contacts are applied within holder through openings
02/02/2006DE102004030552A1 Schicht-Anordnung, Feldeffekttransistor und Verfahren zum Herstellen einer Schicht-Anordnung Layer arrangement, the field-effect transistor and method for fabricating a layer arrangement,
02/02/2006DE102004019664B4 Versandfertige Verpackung für Halbleiterscheiben Complete, filled transport packaging for semiconductor wafers
02/02/2006DE102004012855B4 Herstellungsverfahren für einen Grabenkondensator mit Isolationskragen Manufacturing method of a grave capacitor insulation collar
02/02/2006DE10120408B4 Elektronisches Bauteil mit einem Halbleiterchip, elektronische Baugruppe aus gestapelten Halbleiterchips und Verfahren zu deren Herstellung Electronic component having a semiconductor chip, electronic assembly of stacked semiconductor chips and processes for their preparation