| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/02/2006 | WO2005057280A3 Lithographic apparatus and device manufacturing method |
| 02/02/2006 | WO2005055288A3 Method and device for the alternating contacting of two wafers |
| 02/02/2006 | WO2005048301A3 Methods and apparatus for optimizing a substrate in a plasma processing system |
| 02/02/2006 | WO2005045901A8 METHOD AND STRUCTURE FOR FORMING STRAINED Si FOR CMOS DEVICES |
| 02/02/2006 | WO2005042160A3 Reaction system for growing a thin film |
| 02/02/2006 | WO2005034187A3 Monitoring system comprising infrared thermopile detector |
| 02/02/2006 | WO2005029180A3 Applications of semiconductor nano-sized particles for photolithography |
| 02/02/2006 | WO2004095510A3 Multilayered cap barrier in microelectronic, interconnect structures |
| 02/02/2006 | US20060025956 Semiconductor device fabrication method |
| 02/02/2006 | US20060025948 Inspection system setup techniques |
| 02/02/2006 | US20060025501 Semiconductor encapsulating epoxy resin Composition and semiconductor device |
| 02/02/2006 | US20060025500 No-flow underfill composition and method |
| 02/02/2006 | US20060025320 Seminconductor surface treatment and mixture used therein |
| 02/02/2006 | US20060024989 Helical microelectronic contact and method for fabricating same |
| 02/02/2006 | US20060024988 Interconnect assemblies and methods |
| 02/02/2006 | US20060024981 Method of manufacturing semiconductor device |
| 02/02/2006 | US20060024980 Silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device |
| 02/02/2006 | US20060024979 Fabrication method of semiconductor device |
| 02/02/2006 | US20060024978 Inclusion of nitrogen at the silicon dioxide-silicon carbide interface for passivation of interface defects |
| 02/02/2006 | US20060024977 Low dielectric constant carbon films |
| 02/02/2006 | US20060024976 Ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectrics |
| 02/02/2006 | US20060024975 Atomic layer deposition of zirconium-doped tantalum oxide films |
| 02/02/2006 | US20060024974 Surface treatment for oxidation removal in integrated circuit package assemblies |
| 02/02/2006 | US20060024973 Methods of etching a contact opening over a node location on a semiconductor substrate |
| 02/02/2006 | US20060024972 Silicon recess improvement through improved post implant resist removal and cleans |
| 02/02/2006 | US20060024971 Dry etching method using polymer mask selectively formed by CO gas |
| 02/02/2006 | US20060024970 Method for preparing a semiconductor substrate surface for semiconductor device fabrication |
| 02/02/2006 | US20060024969 Method for purifying silicon carbide coated structures |
| 02/02/2006 | US20060024968 Method for stripping photoresist from etched wafer |
| 02/02/2006 | US20060024967 Polishing composition for noble metals |
| 02/02/2006 | US20060024966 Manufacturing method of semiconductor device |
| 02/02/2006 | US20060024965 Method of etching cavities having different aspect ratios |
| 02/02/2006 | US20060024964 Method and apparatus of forming thin film using atomic layer deposition |
| 02/02/2006 | US20060024963 Metal-germanium physical vapor deposition for semiconductor device defect reduction |
| 02/02/2006 | US20060024962 Partial plate anneal plate process for deposition of conductive fill material |
| 02/02/2006 | US20060024961 Interlevel dielectric layer and metal layer sealing |
| 02/02/2006 | US20060024960 Method for producing thin semiconductor films by deposition from solution |
| 02/02/2006 | US20060024959 Thin tungsten silicide layer deposition and gate metal integration |
| 02/02/2006 | US20060024958 HSQ/SOG dry strip process |
| 02/02/2006 | US20060024957 Methods for forming contact hole, for manufacturing circuit board and for manufacturing electro-optical device |
| 02/02/2006 | US20060024956 Method of eliminating etch ridges in a dual damascene process |
| 02/02/2006 | US20060024955 Nitrogen-free ARC/capping layer and method of manufacturing the same |
| 02/02/2006 | US20060024954 Copper damascene barrier and capping layer |
| 02/02/2006 | US20060024953 Dual damascene diffusion barrier/liner process with selective via-to-trench-bottom recess |
| 02/02/2006 | US20060024952 Method of producing semiconductor device |
| 02/02/2006 | US20060024951 Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer |
| 02/02/2006 | US20060024950 Methods of forming metal contact structures and methods of fabricating phase-change memory devices using the same |
| 02/02/2006 | US20060024949 Method of manufacturing semiconductor device |
| 02/02/2006 | US20060024948 Method of fabricating dual damascene interconnection |
| 02/02/2006 | US20060024947 Electronic component comprising predominantly organic functional materials and a method for the production thereof |
| 02/02/2006 | US20060024946 Method for filling a contact hole and integrated circuit arrangement with contact hole |
| 02/02/2006 | US20060024945 Method for fabricating semiconductor device using amorphous carbon layer as sacrificial hard mask |
| 02/02/2006 | US20060024944 Metal pad of semiconductor device and method for bonding the metal pad |
| 02/02/2006 | US20060024943 Prevention and control of intermetallic alloy inclusions that form during reflow of Pb free, Sn rich, solders in contacts in microelectronic packaging in integrated circuit contact structures where electroless Ni(P) metallization is present |
| 02/02/2006 | US20060024942 Semiconductor constructions comprising multi-level patterns of radiation-imageable material; and methods of forming wire bonds for semiconductor constructions |
| 02/02/2006 | US20060024941 Method of forming metal interconnect of semiconductor device |
| 02/02/2006 | US20060024940 Borderless contact structures |
| 02/02/2006 | US20060024939 Method of fabricating robust nucleation/seed layers for subsequent deposition/fill of metallization layers |
| 02/02/2006 | US20060024938 Method for reducing metal silicide excessive encroachment defects in the manufacture of a semiconductor device having silicided source/drain regions |
| 02/02/2006 | US20060024937 Methods for forming wiring and electrode |
| 02/02/2006 | US20060024936 Nanostructured electrodes |
| 02/02/2006 | US20060024935 Metal silicide induced lateral excessive encroachment reduction by silicon <110> channel stuffing |
| 02/02/2006 | US20060024934 Chemical treatment to retard diffusion in a semiconductor overlayer |
| 02/02/2006 | US20060024933 Semiconductor processing methods of forming integrated circuitry and semiconductor processing methods of forming dynamic random access memory (DRAM) circuitry |
| 02/02/2006 | US20060024932 Methods of forming semiconductor devices including removing a thickness of a polysilicon gate layer |
| 02/02/2006 | US20060024931 Dual SIMOX hybrid orientation technology (HOT) substrates |
| 02/02/2006 | US20060024930 Method of implanting using a shadow effect |
| 02/02/2006 | US20060024929 Method of forming a well in a substrate of a transistor of a semiconductor device |
| 02/02/2006 | US20060024928 Methods for controlling dopant concentration and activation in semiconductor structures |
| 02/02/2006 | US20060024927 Methods of forming a P-well in an integrated circuit device |
| 02/02/2006 | US20060024926 Method of forming a controlled and uniform lightly phosphorous doped silicon film |
| 02/02/2006 | US20060024925 Crystalline semiconductor film, method of manufacturing the same, and semiconductor device |
| 02/02/2006 | US20060024924 Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks |
| 02/02/2006 | US20060024923 Deep alignment marks on edge chips for subsequent alignment of opaque layers |
| 02/02/2006 | US20060024922 Method for cutting wafer |
| 02/02/2006 | US20060024921 [method of relieving wafer stress] |
| 02/02/2006 | US20060024920 Method for positioning dicing line of wafer |
| 02/02/2006 | US20060024919 Method and apparatus for micro-electro mechanical system package |
| 02/02/2006 | US20060024918 Semiconductor memory device and manufacturing method of the same |
| 02/02/2006 | US20060024917 Method and system for fabricating strained layers for the manufacture of integrated circuits |
| 02/02/2006 | US20060024916 Modification of electrical properties for semiconductor wafers |
| 02/02/2006 | US20060024915 Method for manufacturing soi wafer |
| 02/02/2006 | US20060024914 Wet etching method of removing silicon from a substrate and method of forming trench isolation |
| 02/02/2006 | US20060024913 Methods for manufacturing shallow trench isolation layers of semiconductor devices |
| 02/02/2006 | US20060024912 Method for manufacturing device isolation film of semiconductor device |
| 02/02/2006 | US20060024911 Method to design for or modulate the CMOS transistor inverse narrow width effect (INWE) using shallow trench isolation (STI) |
| 02/02/2006 | US20060024910 Method to engineer the inverse narrow width effect (INWE) in CMOS technology using shallow trench isolation (STI) |
| 02/02/2006 | US20060024909 Shallow trench isolation method |
| 02/02/2006 | US20060024908 Method of reducing the surface roughness of a semiconductor wafer |
| 02/02/2006 | US20060024907 Method of forming a capacitor |
| 02/02/2006 | US20060024906 Semiconductor device and a method of manufacturing the same |
| 02/02/2006 | US20060024905 Metal capacitor stacked with a MOS capacitor to provide increased capacitance density |
| 02/02/2006 | US20060024904 Methods of forming a capacitors - |
| 02/02/2006 | US20060024903 Methods of forming capacitors |
| 02/02/2006 | US20060024902 Metal insulator metal (MIM) capacitor fabrication with sidewall barrier removal aspect |
| 02/02/2006 | US20060024901 Method for fabricating a high-frequency and high-power semiconductor module |
| 02/02/2006 | US20060024900 Interposer including at least one passive element at least partially defined by a recess formed therein, method of manufacture, system including same, and wafer-scale interposer |
| 02/02/2006 | US20060024899 Metal insulator metal (MIM) capacitor fabrication with sidewall spacers and aluminum cap (ALCAP) top electrode |
| 02/02/2006 | US20060024898 Increased drive current by isotropic recess etch |
| 02/02/2006 | US20060024897 Method of manufacturing lateral MOSFET structure of an integrated circuit having separated device regions |