| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 05/04/2006 | DE102005049799A1 Halbleiterbauteil und Verfahren zu seiner Herstellung Semiconductor device and process for its preparation |
| 05/04/2006 | DE102005049202A1 Polierzusammensetzung und Polierverfahren unter Verwendung derselben Polishing composition and polishing method using the same |
| 05/04/2006 | DE102005047982A1 Waferunterteilungsverfahren Wafer dividing method |
| 05/04/2006 | DE102005045863A1 Non-volatile memory device comprises memory cell including stacked gate structure having floating gate, second insulation layer and first gate electrode, and second and third gate electrode spacers on opposite sidewalls of gate structure |
| 05/04/2006 | DE102005042518A1 Test access point structure implementing method for printed circuit board, involves connecting test access point with conductive path and presiding point by uncovered surface of printed circuit board to sound by test sensor |
| 05/04/2006 | DE102005040325A1 Ausbesserung von Kohlenstoffverarmung in low-k dielektrischen Filmen Repair of carbon depletion in low-k dielectric films |
| 05/04/2006 | DE102004060697A1 Halbleiterschaltungsanordung und Verfahren zum Herstellen einer Halbleiterschaltungsanordnung Halbleiterschaltungsanordung and method for fabricating a semiconductor circuit arrangement |
| 05/04/2006 | DE102004060667A1 Formation of isolation film of semiconductor device involves forming first high-density plasma oxide film in trench, performing etch-back process using mixture of dicarbon hexafluoride gas and oxygen gas, and forming second oxide film |
| 05/04/2006 | DE102004052648A1 Non-volatile (sic) resistive storage cell with solid electrolyte matrix (300) between first (1) and second (2) electrode as active layer useful in semiconductor technology has elements from groups IVb and Vb |
| 05/04/2006 | DE102004052645A1 Non-volatile (sic) resistive storage cell with solid electrolyte matrix between first and second electrode as active layer useful in semiconductor technology has elements from groups IVb and Vb and transition metals in active layer |
| 05/04/2006 | DE102004052644A1 Shadowing unit for the edge region of a semiconductor wafer, comprises a protective layer which is applied to the substrate |
| 05/04/2006 | DE102004052643A1 Lateral trench transistor has body region inside which a semiconductor region is provided which is electrically connected with source contact and its type of endowment corresponds to the type of endowment of body region |
| 05/04/2006 | DE102004052617A1 Halbleiterelement mit Halbleitergebieten, die unterschiedlich verformte Kanalgebiete aufweisen, und Verfahren zur Herstellung des Halbleiterelements Semiconductor element having semiconductor regions having different deformed channel regions, and methods for manufacturing the semiconductor element |
| 05/04/2006 | DE102004052611A1 Verfahren zur Herstellung einer mit einem Füllmaterial mindestens teilweise gefüllten Öffnung, Verfahren zur Herstellung einer Speicherzelle und Speicherzelle A process for the preparation of a filling material with an at least partially filled opening, method of manufacturing a memory cell and memory cell |
| 05/04/2006 | DE102004052581A1 CMOS-Gatestruktur mit einem vordotierten Halbleitergatematerial mit verbesserter Gleichförmigkeit der Dotierstoffverteilung und Verfahren zur Herstellung der Struktur CMOS gate structure having a pre-doped semiconductor gate material with improved uniformity of the dopant distribution and method for making the structure |
| 05/04/2006 | DE102004052577A1 Technik zur Herstellung einer dielektrischen Ätzstoppschicht über einer Struktur, die Leitungen mit kleinem Abstand enthält Contains technique for producing a dielectric etch stop layer on a structure, the wires at a small distance |
| 05/04/2006 | DE102004052388A1 Halbleiterbauelement sowie zugehöriges Herstellungsverfahren Semiconductor device and manufacturing method thereof |
| 05/04/2006 | DE102004052155A1 Justiervorrichtung zur hochgenauen Positionierung eines Objekts Adjusting device for highly accurate positioning of an object |
| 05/04/2006 | DE102004052039A1 Determination of melting depth during melting of a metal layer with one or more layer sites by means of a reflected test beam useful in metallurgical melting operations providing relaible and reproducible depth determination |
| 05/04/2006 | DE102004050391A1 Verfahren zum Herstellen einer Schicht-Anordnung und Schicht-Anordnung A method for producing a layer arrangement and layer arrangement |
| 05/04/2006 | DE102004050390A1 Individual chips are formed from numerous chips on a wafer by applying a mask, structuring the mask, etching troughs, applying a connection structure, and removing the wafer material |
| 05/04/2006 | DE102004050370B3 Liner layer thickness measuring device for semiconductor wafer, has electron detector detecting electrons in analyzer region and emitting signals for several positions of analyzer, and unit receiving signals to determine layer thickness |
| 05/04/2006 | DE102004047751B3 Verfahren zur Herstellung von Transistorstrukturen für DRAM-Halbleiterbauelemente Process for the preparation of transistor structures for semiconductor devices DRAM- |
| 05/04/2006 | DE102004036662B3 Verfahren zum Einringen von Durchbrechungen in eine Schablone oder Maske A method for out ahead of perforations in a stencil or mask |
| 05/04/2006 | DE102004026232B4 Verfahren zum Ausbilden einer integrierten Halbleiterschaltungsanordnung A method of forming a semiconductor integrated circuit arrangement |
| 05/04/2006 | DE102004019090B4 Trench capacitor used in a semiconductor memory cell comprises a trench formed in a semiconductor substrate, an insulating collar in the upper region of the trench, upper and lower capacitor electrodes and a dielectric layer |
| 05/04/2006 | DE102004015865B4 Verfahren zum Reinigen der Oberfläche eines Substrats A method for cleaning the surface of a substrate |
| 05/04/2006 | DE102004015091B4 Flächenhafter Verdrahtungsträger A laminar wiring support |
| 05/04/2006 | DE102004011035B4 Verfahren zur Prüfung der Dichtigkeit von Scheibenbondverbindungen und Anordnung zur Durchführung des Verfahrens Method for testing the tightness of bonding connections and disc arrangement for performing the method |
| 05/04/2006 | DE102004008824B4 Glaskeramik mit geringer Wärmeausdehnung sowie deren Verwendung Glass ceramics with low thermal expansion, and their use |
| 05/04/2006 | DE10200382B4 Chipmodul für Chipkarten Chip module for smart cards |
| 05/04/2006 | DE10157244B4 Verfahren und Vorrichtung zur Defektanalyse von Wafern Method and apparatus for fault analysis of wafers |
| 05/04/2006 | DE10147080B4 Verfahren zum Flüssigkeitsauftrag mittels diskret verpackter Einzelvolumina und deren Anwendung A method for liquid application using discrete packaged individual volumes and their application |
| 05/04/2006 | DE10140047B4 Verfahren zur Herstellung von Transistoren in integrierten Halbleiterschaltungen A process for the fabrication of transistors in integrated semiconductor circuits, |
| 05/04/2006 | DE10131237B4 Feldeffekttrasistor und Verfahren zu seiner Herstellung Feldeffekttrasistor and process for its preparation |
| 05/04/2006 | DE10130750B4 Verfahren und Vorrichtung zur abrasiven Bearbeitung von Oberflächen auf Halbleiter-Wafern Method and device for the abrasive machining of surfaces on semiconductor wafers |
| 05/04/2006 | DE10101875B4 Elektronisches Bauteil mit aufeinander gestapelten Halbleiterchips und Verfahren zu seiner Herstellung An electronic part having successive stacked semiconductor chips and process for its preparation |
| 05/04/2006 | CA2585532A1 A buffer zone for the prevention of metal migration |
| 05/03/2006 | EP1653516A2 Magneto-resistive RAM |
| 05/03/2006 | EP1653514A1 Semiconductor device and process for producing the same |
| 05/03/2006 | EP1653510A2 Semiconductor device and manufacturing method of the same |
| 05/03/2006 | EP1653508A2 Semiconductor device and manufacturing method of the same |
| 05/03/2006 | EP1653506A1 Flip chip mounting substrate |
| 05/03/2006 | EP1653505A2 Method for fabricating and connecting a semiconductor power switching device |
| 05/03/2006 | EP1653504A1 Composite structure with high thermal dissipation |
| 05/03/2006 | EP1653503A2 Semiconductor device, circuit board, electro-optic device, electronic device |
| 05/03/2006 | EP1653502A1 Semiconductor layer |
| 05/03/2006 | EP1653500A2 Driving mechanism for chip detachment apparatus |
| 05/03/2006 | EP1653473A2 Resistive memory device having array of probes and method of manufacturing the resistive memory device |
| 05/03/2006 | EP1653312A1 Semiconductor production system and semiconductor production process |
| 05/03/2006 | EP1653287A1 Micropattern formation material and method of micropattern formation |
| 05/03/2006 | EP1653285A2 Evaluation method of resist composition using immersion solvent |
| 05/03/2006 | EP1653284A2 Evaluation method of resist composition based on sensitivity |
| 05/03/2006 | EP1653283A2 Lithographic apparatus and device manufacturing method |
| 05/03/2006 | EP1653280A1 Pattern exposing system and pattern exposing method |
| 05/03/2006 | EP1652957A2 Metal oxide layer formed on substrates and its fabrication methods |
| 05/03/2006 | EP1652890A1 Phosphorus-containing silazane composition, phosphorus-containing siliceous film, phosphorus-containing siliceous filler, method for producing phosphorus-containing siliceous film, and semiconductor device |
| 05/03/2006 | EP1652590A1 substrate comprising a thin film pattern, method for coating a device with a thin film pattern, electro-optic device, and electronic apparatus |
| 05/03/2006 | EP1652238A1 Nitride micro light emitting diode with high brightness and method of manufacturing the same |
| 05/03/2006 | EP1652237A2 Backside thinning of image array devices |
| 05/03/2006 | EP1652236A1 Eeprom with multi-member floating gate |
| 05/03/2006 | EP1652235A2 Fet channel having a strained lattice structure along multiple surfaces |
| 05/03/2006 | EP1652230A2 Method for obtaining a thin high-quality layer by co-implantation and thermal annealing |
| 05/03/2006 | EP1652229A1 Method of detaching a semiconductor layer |
| 05/03/2006 | EP1652228A2 Device for stabilising thin discs |
| 05/03/2006 | EP1652226A2 Surface preparation prior to deposition on germanium |
| 05/03/2006 | EP1652225A2 A semiconductor device having an organic anti-reflective coating (arc) and method therefor |
| 05/03/2006 | EP1652224A2 Controlled growth of highly uniform, oxide layers, especially ultrathin layers |
| 05/03/2006 | EP1652223A2 Methods of forming deuterated silicon nitride-containing materials |
| 05/03/2006 | EP1652222A1 Substrate processing apparatus, substrate processing method, and substrate holding apparatus |
| 05/03/2006 | EP1652221A2 Failure analysis methods and systems |
| 05/03/2006 | EP1652220A1 Fabrication of a feram capacitor using a noble metal hardmask |
| 05/03/2006 | EP1652219A2 Anchors for microelectromechanical systems having an soi substrate, and method of fabricating same |
| 05/03/2006 | EP1652218A2 System and process for producing nanowire composites and electronic substrates therefrom |
| 05/03/2006 | EP1652216A1 Convertible pad support for receiving at least two pads of different dimensions |
| 05/03/2006 | EP1652206A2 Langmuir-blodgett nanostructure monolayers |
| 05/03/2006 | EP1651948A1 Scanning probe inspection apparatus |
| 05/03/2006 | EP1651560A1 Stacked structure and production method thereof |
| 05/03/2006 | EP1602157A4 Light-emitting semiconductor device and a method of manufacturing it |
| 05/03/2006 | EP1593083A4 Methods and apparatus for data analysis |
| 05/03/2006 | EP1570516B1 Method for making a stressed structure designed to be dissociated |
| 05/03/2006 | EP1540721B1 Method for the production of electrodes on a II-VI semiconducting compound |
| 05/03/2006 | EP1449239A4 Magneto-resistive bit structure and method of manufacturing therefor |
| 05/03/2006 | EP1435110B1 A method for forming a layered semiconductor structure and corresponding structure |
| 05/03/2006 | EP1423558B1 Susceptor with epitaxial growth control devices and epitaxial reactor using the same |
| 05/03/2006 | EP1362424A4 Three terminal noninverting transistor switch background of the invention |
| 05/03/2006 | EP1330834B1 Parallel plate development with the application of a differential voltage |
| 05/03/2006 | EP1325513A4 Fluid pressure imprint lithography |
| 05/03/2006 | EP1297561B1 Method and device for cleaning and then bonding substrates |
| 05/03/2006 | EP1244731B1 Three dimensional array films |
| 05/03/2006 | EP1210650A4 Polymers containing oxygen and sulfur alicyclic units and photoresist compositions comprising same |
| 05/03/2006 | EP1145285B1 Hand tool for the assembly of small, notably electronic, components |
| 05/03/2006 | EP1145280B1 Door hinge with open-assist feature |
| 05/03/2006 | EP1105917B1 Elastomer bonded parts for plasma processes and method for manufacture and use thereof |
| 05/03/2006 | EP1057079B9 Apparatus used for extreme ultraviolet lithography comprising a filter for suppressing undesired atomic and microscopic particles from a radiation source and filter used in such an apparatus |
| 05/03/2006 | EP1014452B1 Method of detaching thin-film device |
| 05/03/2006 | EP0956585B1 Method for formation of thin film transistors on plastic substrates |
| 05/03/2006 | EP0809866B1 Magnetoresistive structure with alloy layer |
| 05/03/2006 | EP0745015B1 Multi-wavelength laser optic system for probe station and laser cutting |
| 05/03/2006 | CN2777758Y 集成电路晶体管 Integrated circuit transistor |