| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/06/2006 | WO2006070697A1 Current measuring apparatus and current measuring method |
| 07/06/2006 | WO2006070695A1 Material for forming resist protection films and method for resist pattern formation with the same |
| 07/06/2006 | WO2006070694A1 Acrylic copolymer |
| 07/06/2006 | WO2006070693A1 Switching element, switching element driving method, switching element manufacturing method, rewritable logic integrated circuit, and memory element |
| 07/06/2006 | WO2006070691A1 Current measuring apparatus and current measuring method |
| 07/06/2006 | WO2006070689A1 Semiconductor manufacturing apparatus, abnormality detection in such semiconductor manufacturing apparatus, method for specifying abnormality cause or predicting abnormality, and recording medium wherein computer program for executing such method is recorded |
| 07/06/2006 | WO2006070685A1 Method for nitriding tunnel oxide film, method for manufacturing non-volatile memory device, non-volatile memory device, control program and computer-readable recording medium |
| 07/06/2006 | WO2006070683A1 Switching element, production mehod for switching element, rewritable logical integrated circuit, and memory element |
| 07/06/2006 | WO2006070681A1 Switching device and rewritable logic integrated circuit |
| 07/06/2006 | WO2006070670A1 Semiconductor nano-wire, and semiconductor device provided with that nano-wire |
| 07/06/2006 | WO2006070652A1 Semiconductor device and method for manufacturing same, wiring board and method for manufacturing same, semiconductor package, and electronic device |
| 07/06/2006 | WO2006070630A1 Substrate processing apparatus and substrate transferring method |
| 07/06/2006 | WO2006070629A1 Polishing pad |
| 07/06/2006 | WO2006070623A1 Opposing target type sputter device |
| 07/06/2006 | WO2006070621A1 Method of development processing and development processing apparatus |
| 07/06/2006 | WO2006070607A1 Silicon wafer polishing method and silicon wafer producing method, apparatus for polishing disc-like work and silicon wafer |
| 07/06/2006 | WO2006070580A1 Optical integrator, illumination optical device, photolithograph, photolithography, and method for fabricating device |
| 07/06/2006 | WO2006070564A1 Plasma processing apparatus |
| 07/06/2006 | WO2006070556A1 Epitaxial wafer manufacturing method and epitaxial wafer |
| 07/06/2006 | WO2006070555A1 Beam recording method and device |
| 07/06/2006 | WO2006070553A1 Method for manufacturing semiconductor device |
| 07/06/2006 | WO2006070552A1 Temperature adjusting method, heat treatment equipment and semiconductor device manufacturing method |
| 07/06/2006 | WO2006070498A1 Benzoxazole resin precursor, polybenzoxazole resin, resin film, and semiconductor device |
| 07/06/2006 | WO2006070475A1 Semiconductor device |
| 07/06/2006 | WO2006070474A1 Process for producing semiconductor device |
| 07/06/2006 | WO2006070310A1 Method for the manufacture of a semiconductor device and a semiconductor device obtained through it |
| 07/06/2006 | WO2006070309A1 Semiconductor device having strip- shaped channel and method for manufacturing such a device |
| 07/06/2006 | WO2006070304A2 Soi device |
| 07/06/2006 | WO2006070220A1 Method for obtaining a thin layer having a low density of holes |
| 07/06/2006 | WO2006070167A1 Method for transferring a circuit to a grounding plane |
| 07/06/2006 | WO2006070160A1 Method for trimming a structure obtained by the assembly of two plates |
| 07/06/2006 | WO2006070154A1 Improved semiconductor thin-film transistor structure |
| 07/06/2006 | WO2006070140A1 Double-sided electronic module for hybrid smart card |
| 07/06/2006 | WO2006069945A1 Method for treating the surface of a wafer |
| 07/06/2006 | WO2006069855A1 Arrangement of an electrical component and a two-phase cooling device |
| 07/06/2006 | WO2006057826A3 Topotactic anion exchange oxide films and method of producing the same |
| 07/06/2006 | WO2006047061A3 Use of defined compounds for the manufacture of a medicament for preventing/ treating diseases resulting from somatic mutation |
| 07/06/2006 | WO2006045201A3 Alkaline fluoride dope molecular films and applications for p-n junction and field-effect transistor devices |
| 07/06/2006 | WO2006026610A3 LOW TEMPERATURE GROWN LAYERS WITH MIGRATION ENHANCED EPITAXY ADJACENT TO AN InGaAsN(Sb) BASED ACTIVE REGION |
| 07/06/2006 | WO2006018415A3 Sonotrode conveying unit for treating ultrasonic workpieces and method for operating a sonotrode conveying unit |
| 07/06/2006 | WO2005119802A3 Adaptive shape substrate support system and method |
| 07/06/2006 | WO2005115104A3 Methods for stable and repeatable plasma ion implantation |
| 07/06/2006 | WO2005065179B1 Method of manufacturing a superjunction device |
| 07/06/2006 | WO2004096491A3 Apparatus and method of securing a workpiece during high-pressure processing |
| 07/06/2006 | WO2004088571A3 Attachment of rfid modules to antennas |
| 07/06/2006 | US20060149521 Modulating nuclear receptor coactivator binding |
| 07/06/2006 | US20060149500 Semiconductor device having a mode of functional test |
| 07/06/2006 | US20060149403 System and method for processing a substrate and program therefor |
| 07/06/2006 | US20060148667 Cmp polishing compound and polishing method |
| 07/06/2006 | US20060148384 Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method |
| 07/06/2006 | US20060148382 Polishing apparatus |
| 07/06/2006 | US20060148381 Pad assembly for electrochemical mechanical processing |
| 07/06/2006 | US20060148275 Method of forming an alignment mark and manufacturing a semiconductor device using the same |
| 07/06/2006 | US20060148274 Device for fabricating a mask by plasma etching a semiconductor substrate |
| 07/06/2006 | US20060148273 Method using TEOS ramp-up during TEOS/ozone CVD for improved gap-fill |
| 07/06/2006 | US20060148272 Fabrication of light emitting film coated fullerenes and their application for in-vivo light emission |
| 07/06/2006 | US20060148271 Silicon source reagent compositions, and method of making and using same for microelectronic device structure |
| 07/06/2006 | US20060148270 High density plasma and bias RF power process to make stable FSG with less free F and SiN with less H to enhance the FSG/SiN integration reliability |
| 07/06/2006 | US20060148269 Semiconductor devices and methods for depositing a dielectric film |
| 07/06/2006 | US20060148268 In-situ thin-film deposition method |
| 07/06/2006 | US20060148267 Apparatus and method for single-or double-substrate processing |
| 07/06/2006 | US20060148266 Pattern formation method |
| 07/06/2006 | US20060148265 After deposition method of thinning film to reduce pinhole defects |
| 07/06/2006 | US20060148264 Method of fabricating semiconductor device |
| 07/06/2006 | US20060148263 Dry etching apparatus having particle removing device and method of fabricating phase shift mask using the same |
| 07/06/2006 | US20060148262 Method for fabricating microelectromechanical optical display devices |
| 07/06/2006 | US20060148261 Methods and apparatus for polishing control |
| 07/06/2006 | US20060148260 Selective polish for fabricating electronic devices |
| 07/06/2006 | US20060148259 Method for manufacturing semiconductor device |
| 07/06/2006 | US20060148258 Method of planarizing an inter-metal insulation film |
| 07/06/2006 | US20060148257 Method of manufacturing a semiconductor device |
| 07/06/2006 | US20060148256 Method for forming patterns aligned on either side of a thin film |
| 07/06/2006 | US20060148255 Method for CuO reduction by using two step nitrogen oxygen and reducing plasma treatment |
| 07/06/2006 | US20060148254 Activated iridium oxide electrodes and methods for their fabrication |
| 07/06/2006 | US20060148253 Integration of ALD tantalum nitride for copper metallization |
| 07/06/2006 | US20060148252 Method for producing hydrogenated silicon-oxycarbide films |
| 07/06/2006 | US20060148251 Metal etching method for an interconnect structure and metal interconnect structure obtained by such method |
| 07/06/2006 | US20060148250 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
| 07/06/2006 | US20060148249 Method of eliminating boron contamination in annealed wafer |
| 07/06/2006 | US20060148248 Electrode structures and method to form electrode structures that minimize electrode work function variation |
| 07/06/2006 | US20060148247 Method of metal sputtering for integrated circuit metal routing |
| 07/06/2006 | US20060148246 Method of forming a diffusion barrier layer using a TaSiN layer and method of forming a metal interconnection line using the same |
| 07/06/2006 | US20060148245 Semiconductor devices and methods of manufacturing the same |
| 07/06/2006 | US20060148244 Method for cleaning a semiconductor substrate |
| 07/06/2006 | US20060148243 Method for fabricating a dual damascene and polymer removal |
| 07/06/2006 | US20060148242 Metallization method of semiconductor device |
| 07/06/2006 | US20060148241 System for and method of forming via holes by use of selective plasma etching in a continuous inline shadow mask deposition process |
| 07/06/2006 | US20060148240 System and method for filling openings in semiconductor products |
| 07/06/2006 | US20060148239 Method of manufacturing a semiconductor device |
| 07/06/2006 | US20060148238 Metallization method of semiconductor device |
| 07/06/2006 | US20060148237 Method for fabricating a semiconductor device |
| 07/06/2006 | US20060148236 Semiconductor device with a metal line and method of forming the same |
| 07/06/2006 | US20060148235 Devices and methods of preventing plasma charging damage in semiconductor devices |
| 07/06/2006 | US20060148234 Non-via method of connecting magnetoelectric elements with conductive line |
| 07/06/2006 | US20060148233 Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same |
| 07/06/2006 | US20060148232 Method for fabricating module of semiconductor chip |
| 07/06/2006 | US20060148231 Integrated die bumping process |
| 07/06/2006 | US20060148230 Method for manufacturing semiconductor device |
| 07/06/2006 | US20060148229 Phase change memory device and method of manufacturing |
| 07/06/2006 | US20060148228 Method for forming salicide layer in semiconductor device |