| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 10/05/2006 | US20060219178 Device for applying semiconductor treatment to treatment subject substrate |
| 10/05/2006 | US20060219175 Oxide-like seasoning for dielectric low k films |
| 10/05/2006 | US20060219174 Hermetic cap layers formed on low-k films by plasma enhanced chemical vapor deposition |
| 10/05/2006 | US20060219171 Substrate processing apparatus |
| 10/05/2006 | US20060219169 Hdp-cvd seasoning process for high power hdp-cvd gapfil to improve particle performance |
| 10/05/2006 | US20060219167 Apparatus and method of vacuum metallic sintering for a semiconductor |
| 10/05/2006 | US20060218867 Polishing composition and polishing method using the same |
| 10/05/2006 | US20060218782 Method for manufacturing an electronic module |
| 10/05/2006 | US20060218781 Electronic-component alignment method and apparatus therefor |
| 10/05/2006 | US20060218762 System and method for detecting flow in a mass flow controller |
| 10/05/2006 | DE4447149B4 Vollständig eingeebneter Feldeffekttransistor und Verfahren an dessen Herstellung Fully leveled field effect transistor and method of its manufacture |
| 10/05/2006 | DE202006008303U1 Silicon semiconductor substrate surface treatment device for manufacturing semiconductor chip, has pressure chamber with separate opening for support plate position, where opening is sealed by plate during pressure build-up in chamber |
| 10/05/2006 | DE19937990B4 Integrierte Halbleiterschaltung für ein Elektret-Mikrofon A semiconductor integrated circuit for an electret microphone |
| 10/05/2006 | DE19929926B4 Verfahren zur Herstellung eines Speichers mit Mehrpegel-Quantenpunktstruktur A process for preparing a memory having multi-level quantum dot structure |
| 10/05/2006 | DE19904378B4 Verfahren zur Herstellung von Nitrid-Einkristallen A process for producing nitride crystals |
| 10/05/2006 | DE19781541B4 Vorrichtung aus einem III-V-Verbindungshalbleiter und Verfahren zur Herstellung der Vorrichtung A device comprising a III-V compound semiconductor and method for manufacturing the device |
| 10/05/2006 | DE19738149B4 Fest-Elektrolytkondensatoranordnung und Verfahren zur Herstellung derselbigen Solid electrolytic capacitor arrangement and method for producing the same |
| 10/05/2006 | DE19652030B4 Verfahren zum Einkapseln eines Infrarotsendeempfängers A method of encapsulating an infrared transceiver |
| 10/05/2006 | DE19633184B4 Verfahren zur Herstellung eines Halbleiterbauelements mit durch Ionenimplantation eingebrachten Fremdatomen A process for producing a semiconductor device with introduced by ion implantation impurity |
| 10/05/2006 | DE19610907B4 Ferroelektrisches Halbleiterspeicherbauelement und Verfahren zu seiner Herstellung A ferroelectric semiconductor memory device and method for its preparation |
| 10/05/2006 | DE112004002409T5 Verfahren zum Verbessern der Transistorleistung durch Reduzieren des Salizidgrenzflächenwiderstandes A method for improving transistor performance by reducing the Salizidgrenzflächenwiderstandes |
| 10/05/2006 | DE112004001958T5 Verfahren zum Sortieren von Kohlenstoffnanoröhren A method of sorting carbon nanotubes |
| 10/05/2006 | DE10352068B4 Ausbilden von Siliziumnitridinseln für eine erhöhte Kapazität Forming Siliziumnitridinseln for increased capacity |
| 10/05/2006 | DE10345394B4 Verfahren zum Herstellen von Speicherzellen A method of manufacturing of memory cells |
| 10/05/2006 | DE10322588B4 Verfahren zum Herstellen einer Widerstandsschicht A method of manufacturing a resistive layer |
| 10/05/2006 | DE10307561B4 Meßanordnung zur kombinierten Abtastung und Untersuchung von mikrotechnischen, elektrische Kontakte aufweisenden Bauelementen Measuring arrangement for combined sampling and analysis of micro-technical, electrical contacts having components |
| 10/05/2006 | DE10215365B4 Transistorstruktur unter Verwendung von Epitaxialschichten und Verfahren zur Herstellung derselben Transistor structure using epitaxial layers and methods of making the same |
| 10/05/2006 | DE102006014852A1 Semiconductor wafer used in integrated circuits, has first and second layers having different refractive indexes, such that laser hits first layer without passing through second layer to separate semiconductor components placed on wafer |
| 10/05/2006 | DE102006012416A1 Field effect transistor fabrication involves etching and annealing nano-wire channel region extended between source and drain regions |
| 10/05/2006 | DE102006011352A1 Verfahren zur Herstellung einer Drahtverbindung A process for producing a wire connection |
| 10/05/2006 | DE102006009961A1 Reverse-blocking semiconductor device manufacture for e.g. actuator, involves activating substrates by laser irradiation, where side wall of trench is formed with angle of inclination of seventy degree |
| 10/05/2006 | DE102006007714A1 Non-volatile integrated circuit memory device e.g. eraseable programmable read only memory, has separate insulating layer located on channel region, and extending between pair of memory cells along sidewalls of memory cell |
| 10/05/2006 | DE102006006203A1 Positioning device for chuck of substrate tester has transfer element with inner and outer parts opposite each other on closed tester housing wall with magnetic force connection between the parts |
| 10/05/2006 | DE102005063118A1 Capacitor fabricating method for dynamic random access memory, comprises forming capacitor lower electrode by patterning conductive layer using pattern as mask such that lower electrode includes cylindrical or donut-shaped pattern |
| 10/05/2006 | DE102005061959A1 Eliminierung von niederfrequenten Schwingungen bei Halbleiterschaltungsanordnungen Elimination of low-frequency vibrations in semiconductor circuitry |
| 10/05/2006 | DE102005038086A1 Semiconductor wafer, is provided with work test certificate e.g. certificate of compliance, in digital form on data medium, where certificate includes data for distinctive identity such as explicit number, which characterizes wafer |
| 10/05/2006 | DE102005021118A1 Halbleiterspeicher Semiconductor memory |
| 10/05/2006 | DE102005020059B3 Relining material`s thermal and mechanical characteristics improving method for carrier substrate and semiconductor chip arrangement, involves introducing material such that chip is positioned under substrate |
| 10/05/2006 | DE102005015454A1 Semiconductor sensor component comprises a cavity container and components arranged in a cavity of container, which exhibit a sensor chip with a sensor range, where cavity container exhibits opening and sensor range is turned to opening |
| 10/05/2006 | DE102005015335A1 Pressure tester for partial, contactless pressure measurement for pressure sensor, has heaters provided in gas conduit for heating measuring gas discharged towards chip to adjust temperature of chip on which pressure sensor is arranged |
| 10/05/2006 | DE102005015334A1 Prober for testing substrate of e.g. semiconductor chip, has chuck with retaining surface to retain and cool substrate and fixed on carrier such that it is thermally uncoupled from another chuck and connected to cold head by connecting unit |
| 10/05/2006 | DE102005015109A1 Semiconductor chip assembling method, involves lifting component region of chip from substrate such that region indirectly contacts substrate via soldering material and chip is assembled on substrate by flip-chip technique |
| 10/05/2006 | DE102005014794A1 Semiconductor sample testing method used in forming integrated circuits, involves scanning semiconductor sample for several times, computing cross-correlation between scannings to determine shift value, and overlaying and shifting scannings |
| 10/05/2006 | DE102005014748A1 Technique for electrochemical depositing of an alloy e.g., for microstructures, involves generating current between consumer electrode and surface |
| 10/05/2006 | DE102005014595A1 Visual inspection method for processed boundary edges of e.g. semiconductor wafers, involves taking picture of boundary area of disk-shaped object and showing image, enlarged view and total view of object in different display windows |
| 10/05/2006 | DE102005014594A1 Imperfect edge beads detecting method for disk shaped object e.g. wafer, involves specifying markings in boundary region of reference object, where inspection of object is limited to position of markings specified in object |
| 10/05/2006 | DE102005014593A1 Optical inspection system for disk-shaped objects e.g. semiconductor wafers, has inspection modules for performing macro-inspection and micro-inspection of structured surface, boundary area, extended edge and rear of disk-shaped objects |
| 10/05/2006 | DE102005014513A1 Vorrichtung und Verfahren zum Temperieren einen Substrats Apparatus and method for tempering a substrate |
| 10/05/2006 | DE102005014094A1 Integration device for semiconductor components, has interposer having recess with contact surfaces, in which semiconductor component is inserted into recess with contact points of semiconductor component engaged with contact surfaces |
| 10/05/2006 | DE102005013982A1 Verfahren zur Herstellung eines Bipolartransistors und nach einem derartigen Verfahren hergestellter Bipolartransistor A method of manufacturing a bipolar transistor and manufactured by such a method bipolar transistor |
| 10/05/2006 | DE102005013325A1 Connection method of integrated circuits to circuit module, involves using module carrier that has chip mounting area provided with guide mechanisms and connection mechanisms for guiding and electrical connection of semiconductor chips |
| 10/05/2006 | DE102005013323A1 Kontaktierungsvorrichtung zum Kontaktieren einer integrierten Schaltung, insbesondere eines Chips oder eines Wafers, mit einer Testervorrichtung, entsprechendes Testverfahren und entsprechendes Herstellungsverfahren A contacting device for contacting an integrated circuit, in particular a chip or a wafer having a tester apparatus corresponding test method and corresponding production method |
| 10/05/2006 | DE102005012992A1 Verfahren, Vorrichtung und System zum Bonden eines Halbleiterelementes A method, apparatus and system for bonding a semiconductor element |
| 10/05/2006 | DE102005012661A1 Semiconductor device e.g. fully depleted silicon-on-insulator FET, has electrically conductive gate adjoined to channel and placed in electrically conductive connection with gate contact area in contact position |
| 10/05/2006 | DE102005010513A1 Integrated coaxial conductor arrangement has coaxial conductors circularly enclosed and arranged in tubular conductor trench formed underneath top side of substrate |
| 10/05/2006 | DE102004031743B4 Verfahren zur Herstellung einer Epitaxieschicht für erhöhte Drain-und Sourcegebiete durch Entfernen von Oberflächendefekten der anfänglichen Kristalloberfläche A process for producing an epitaxial layer for increased drain and source regions by removing surface defects of the initial crystal surface |
| 10/05/2006 | DE10050052B4 Verfahren zur Herstellung eines Grabenkondensators A method for producing a capacitor grave |
| 10/05/2006 | CA2603678A1 Manufacturing ccds in a conventional cmos process |
| 10/04/2006 | EP1708284A1 Semiconductor light-emitting device |
| 10/04/2006 | EP1708277A1 Semiconductor device and manufacturing method thereof |
| 10/04/2006 | EP1708276A1 Vertical gate semiconductor device and process for fabricating the same |
| 10/04/2006 | EP1708275A2 Semiconductor device and fabrication method of the same |
| 10/04/2006 | EP1708273A2 Semiconductor device and fabrication process thereof |
| 10/04/2006 | EP1708270A2 Solid-state imaging device and manufacture thereof |
| 10/04/2006 | EP1708266A2 Integrated flash memory, peripheral circuit and manufacture method |
| 10/04/2006 | EP1708265A2 MOS capacitor with reduced capacitance |
| 10/04/2006 | EP1708257A1 Current injection magnetic domain wall moving element |
| 10/04/2006 | EP1708256A1 Cover attaching/detaching device of carry container |
| 10/04/2006 | EP1708255A2 Diamond substrate and manufacturing method thereof |
| 10/04/2006 | EP1708254A1 Process for producing monocrystal thin film and monocrystal thin film device |
| 10/04/2006 | EP1708253A2 Semiconductor device fabrication method |
| 10/04/2006 | EP1708252A1 Development device and development method |
| 10/04/2006 | EP1708251A1 Developing device and developing method |
| 10/04/2006 | EP1708250A2 Identification of a reference integrated circuit for a pick and place device |
| 10/04/2006 | EP1708249A2 Cleaning device and cleaning method |
| 10/04/2006 | EP1708027A1 Upper layer film forming composition for liquid immersion and method of forming photoresist pattern |
| 10/04/2006 | EP1708026A1 Photosensitive polymer composition, process for producing pattern, and electronic part |
| 10/04/2006 | EP1707967A1 Electric connecting device and contactor |
| 10/04/2006 | EP1707589A1 Silsesquioxane compound mixture, method of making, resist composition, and patterning process |
| 10/04/2006 | EP1707532A2 Probing card and inspection apparatus for microstructure |
| 10/04/2006 | EP1707314A1 Polishing apparatus |
| 10/04/2006 | EP1707298A1 Laser processing method and device |
| 10/04/2006 | EP1706906A1 Semi-conductor circuit and suitable production method therefor |
| 10/04/2006 | EP1706903A1 Isotopically pure silicon-on-insulator wafers and method of making same |
| 10/04/2006 | EP1706902A2 Plasma-excited chemical vapor deposition method, silicon/oxygen/nitrogen-containing material and layered assembly |
| 10/04/2006 | EP1706901A1 Integrated circuit comprising laterally dielectrically isolated active regions above an electrically contacted buried material, and method for producing the same |
| 10/04/2006 | EP1706900A2 A method for manufacturing a superjunction device with wide mesas |
| 10/04/2006 | EP1706899A2 Planarization method of manufacturing a superjunction device |
| 10/04/2006 | EP1706898A2 Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift |
| 10/04/2006 | EP1706897A2 Method of treating microelectronic substrates |
| 10/04/2006 | EP1706896A2 Method of correction for wafer crystal cut error in semiconductor processing |
| 10/04/2006 | EP1706895A2 Silicon carbide on diamond substrates and related devices and methods |
| 10/04/2006 | EP1706894A2 Integrated photonic devices |
| 10/04/2006 | EP1706893A2 Laser lift-off of sapphire from a nitride flip-chip |
| 10/04/2006 | EP1706892A2 Segmented radio frequency electrode apparatus and method for uniformity control |
| 10/04/2006 | EP1706891A2 Connection assembly for promoting electrical isolation |
| 10/04/2006 | EP1706889A2 Gas distribution plate assembly for plasma reactors |
| 10/04/2006 | EP1706771A1 Optical system with a cameras device for viewing several objects arranged remotely from each other |
| 10/04/2006 | EP1706750A2 Thermal protection for electronic components during processing |
| 10/04/2006 | EP1706704A1 Method and apparatus for measuring film thickness by means of coupled eddy sensors |