Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2006
10/03/2006US7115498 Method of ultra-low energy ion implantation to form alloy layers in copper
10/03/2006US7115497 Method for forming storage node contact plug of DRAM (dynamic random access memory)
10/03/2006US7115496 Method for protecting the redistribution layer on wafers/chips
10/03/2006US7115495 Methods of making projected contact structures for engaging bumped semiconductor devices
10/03/2006US7115494 Method and system for controlling the presence of fluorine in refractory metal layers
10/03/2006US7115493 Antifuse structures, methods, and applications
10/03/2006US7115492 Technique for elimination of pitting on silicon substrate during gate stack etch using material in a non-annealed state
10/03/2006US7115491 Method for forming self-aligned contact in semiconductor device
10/03/2006US7115490 Apparatus and method for interlocking a power supply to ion implantation equipment, method and apparatus for generating an interlocking signal, method and apparatus for interrupting an ion implantation process, and an interlocking system
10/03/2006US7115489 Methods of growing epitaxial silicon
10/03/2006US7115488 Method of manufacturing semiconductor device
10/03/2006US7115487 Crystalline thin film and process for production thereof, element employing crystalline thin film, circuit employing element, and device employing element or circuit
10/03/2006US7115486 Semiconductor base and its manufacturing method, and semiconductor crystal manufacturing method
10/03/2006US7115485 Method for processing wafer
10/03/2006US7115484 Method of dicing a wafer
10/03/2006US7115483 Stacked chip package having upper chip provided with trenches and method of manufacturing the same
10/03/2006US7115482 Method of manufacturing semiconductor device
10/03/2006US7115481 Method for concurrently producing at least a pair of semiconductor structures that each include at least one useful layer on a substrate
10/03/2006US7115480 Micromechanical strained semiconductor by wafer bonding
10/03/2006US7115479 Sacrificial annealing layer for a semiconductor device and a method of fabrication
10/03/2006US7115478 Method of fabricating a semiconductor device and a method of generating a mask pattern
10/03/2006US7115477 Gate with dual gate dielectric layer and method of fabricating the same
10/03/2006US7115476 Semiconductor manufacturing method and semiconductor device
10/03/2006US7115475 Method of manufacturing semiconductor device
10/03/2006US7115474 Nonvolatile semiconductor memory and method of manufacturing the same
10/03/2006US7115473 Method of fabrication of non-volatile memory
10/03/2006US7115472 Process for manufacturing a dual charge storage location memory cell
10/03/2006US7115471 Method of manufacturing semiconductor device including nonvolatile memory
10/03/2006US7115470 Methods of fabricating flash memory cell having split-gate structure using spacer oxidation process
10/03/2006US7115469 Integrated ONO processing for semiconductor devices using in-situ steam generation (ISSG) process
10/03/2006US7115468 Semiconductor device and method for fabricating the same
10/03/2006US7115467 Metal insulator metal (MIM) capacitor fabrication with sidewall barrier removal aspect
10/03/2006US7115466 Bipolar transistor with graded base layer
10/03/2006US7115465 Method for manufacturing a bipolar transistor
10/03/2006US7115464 Semiconductor device having different metal-semiconductor portions formed in a semiconductor region and a method for fabricating the semiconductor device
10/03/2006US7115463 Patterning SOI with silicon mask to create box at different depths
10/03/2006US7115462 Processes providing high and low threshold p-type and n-type transistors
10/03/2006US7115461 High permittivity silicate gate dielectric
10/03/2006US7115460 Standard cell back bias architecture
10/03/2006US7115459 Method of fabricating SiGe Bi-CMOS device
10/03/2006US7115458 Gate coupling in floating-gate memory cells
10/03/2006US7115457 Method for crystallizing semiconductor with laser beams
10/03/2006US7115456 Sequential lateral solidification device and method of crystallizing silicon using the same
10/03/2006US7115455 Method of fabricating polysilicon film
10/03/2006US7115454 Thin film semiconductor device, polycrystalline semiconductor thin film production and process and production apparatus
10/03/2006US7115453 Semiconductor device and manufacturing method of the same
10/03/2006US7115452 Method of making semiconductor device
10/03/2006US7115451 Methods of forming semiconductor circuitry
10/03/2006US7115450 Approach to improve line end shortening including simultaneous trimming of photosensitive layer and hardmask
10/03/2006US7115449 Method for fabrication of polycrystalline silicon thin film transistors
10/03/2006US7115448 Thin film transistor, liquid crystal display device and method of fabricating the thin film transistor
10/03/2006US7115447 Manufacturing semiconductor device including forming LDD region using conductive layer as mask
10/03/2006US7115446 Flip chip bonding method for enhancing adhesion force in flip chip packaging process and metal layer-built structure of substrate for the same
10/03/2006US7115445 Semiconductor package having reduced thickness
10/03/2006US7115444 Semiconductor device with improved heat dissipation, and a method of making semiconductor device
10/03/2006US7115443 Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method
10/03/2006US7115442 Ball grid array package with stacked center pad chips and method for manufacturing the same
10/03/2006US7115441 Semiconductor package with semiconductor chips stacked therein and method of making the package
10/03/2006US7115440 SO2 treatment of oxidized CuO for copper sulfide formation of memory element growth
10/03/2006US7115439 High photosensitivity CMOS image sensor pixel architecture
10/03/2006US7115438 Method for manufacturing a complementary metal-oxide semiconductor sensor
10/03/2006US7115437 Micromachined device having electrically isolated components and a method for making the same
10/03/2006US7115436 Integrated getter area for wafer level encapsulated microelectromechanical systems
10/03/2006US7115435 Manufacturing method for wiring substrates
10/03/2006US7115434 Method for precisely forming light emitting layers in a semiconductor device
10/03/2006US7115433 Contact structure of wiring and a method for manufacturing the same
10/03/2006US7115432 Base pattern forming material for electrode and wiring material absorption, electrode and wiring forming method, and method of manufacturing image forming apparatus
10/03/2006US7115431 Method of fabricating reflective liquid crystal display integrated with driving circuit
10/03/2006US7115430 Layer of an electroluminescent organic material dispersed in a matrix of a non-electroluminescent organic polymer and an electroluminescent organic material with electrodes
10/03/2006US7115429 Method of fabricating image display unit
10/03/2006US7115428 Method for fabricating light-emitting devices utilizing a photo-curable epoxy
10/03/2006US7115427 Red light-emitting device and method for preparing the same
10/03/2006US7115426 Method and apparatus for addressing thickness variations of a trench floor formed in a semiconductor substrate
10/03/2006US7115425 Integrated circuit process monitoring and metrology system
10/03/2006US7115424 Method for manufacturing semiconductor device
10/03/2006US7115355 Positioning deformable photoresist on substrate; masking; using hydrophilic stamp to print waveguides; polydimethylsiloxane
10/03/2006US7115344 Photomask and pattern forming method employing the same
10/03/2006US7115214 Method of forming barrier layer
10/03/2006US7115211 Endpoint detection using laser interferometry
10/03/2006US7115207 For an integrated circuit chip interconnect solder bump; simultaneously etching both sides of a very thick molybdenum foil coated on each side by a photoresist using a very low etchant spray pressure, and undercutting said photoresist adjacent to opening to form an unsupported edge
10/03/2006US7115196 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus
10/03/2006US7115194 Magnetron sputtering apparatus
10/03/2006US7115186 Liquid material evaporation apparatus for semiconductor manufacturing
10/03/2006US7115184 Plasma processing device
10/03/2006US7115182 Anodic bonding process for ceramics
10/03/2006US7115167 Method of growing a semiconductor multi-layer structure
10/03/2006US7115166 Systems and methods for forming strontium- and/or barium-containing layers
10/03/2006US7115047 Golf club head with customizable center of gravity
10/03/2006US7115026 Polishing apparatus
10/03/2006US7115021 Abrasive, method of polishing target member and process for producing semiconductor device
10/03/2006US7114939 Encapsulating brittle substrates using transfer molding
10/03/2006US7114938 Lithographic apparatus for molding ultrafine features
10/03/2006US7114907 Transfer robot
10/03/2006US7114903 Apparatuses and method for transferring and/or pre-processing microelectronic workpieces
10/03/2006US7114802 Pattern formation method and substrate manufacturing apparatus
10/03/2006US7114693 Stable cell platform
10/03/2006US7114669 Vaporizer includes nozzle with liquid exit and inlet; actuating seal adapted to engage liquid inlet to regulate a flow; andactuating a positive shut-off valve; carrier gas inlet coupled to body and a plurality of peltier cells coupled to the body
10/03/2006US7114532 Liner for use in processing chamber
10/03/2006US7114424 Wire sawing device
10/03/2006US7114404 System and method for detecting flow in a mass flow controller