| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 10/03/2006 | US7114312 Low temperature methods for hermetically sealing reservoir devices |
| 10/03/2006 | US7114251 Method of producing of circuit board; for semiconductor device |
| 10/03/2006 | US7114245 Component holding head, component mounting apparatus using same, and component mounting method |
| 10/03/2006 | US7114240 Forming silicon dioxide layer and a plurality of magnetoresistive layers above; ferromagnetic and/or nonmagnetic layers; etch stopping with titanium nitride; surrounding with an oxygen barrier comprising silicon nitride; etching; |
| 10/03/2006 | CA2171604C Switching circuit and charge transfer device using same |
| 09/28/2006 | WO2006102589A1 Flip-attached and underfilled semiconductor device and method |
| 09/28/2006 | WO2006102539A2 Method and system for electroprocessing conductive layers |
| 09/28/2006 | WO2006102389A1 High k stack for non-volatile memory |
| 09/28/2006 | WO2006102292A2 Nanogaps: methods and devices containing same |
| 09/28/2006 | WO2006102046A1 Method of forming self-passivating interconnects and resulting devices |
| 09/28/2006 | WO2006101947A2 Chemical-mechanical polishing endpoint detection |
| 09/28/2006 | WO2006101897A2 Method and apparatus for monitoring plasma conditions in an etching plasma processing facility |
| 09/28/2006 | WO2006101862A1 Multilayer circuit devices and manufacturing methods using electroplated sacrificial structures |
| 09/28/2006 | WO2006101857A2 A plasma enhanced atomic layer deposition system and method |
| 09/28/2006 | WO2006101856A2 A plasma enhanced atomic layer deposition system and method |
| 09/28/2006 | WO2006101769A2 Method of fabrication of ai/ge bonding in a wafer packaging environment and a product produced therefrom |
| 09/28/2006 | WO2006101768A2 Method for fabricating a wafer level package having through wafer vias for external package connectivity and related structure |
| 09/28/2006 | WO2006101695A1 Pitch reduced patterns relative to photolithography features |
| 09/28/2006 | WO2006101669A1 Methods of forming pluralities of capacitors |
| 09/28/2006 | WO2006101646A1 Method for forming a ruthenium metal layer on a patterned substrate |
| 09/28/2006 | WO2006101619A2 A deposition system and method |
| 09/28/2006 | WO2006101578A1 Vapor phase treatment of dielectric materials |
| 09/28/2006 | WO2006101458A1 Method for patterning ferrelectric/piezoelectric films |
| 09/28/2006 | WO2006101327A1 Probe card and method of manufacturing the same |
| 09/28/2006 | WO2006101315A1 Device and method for cleaning photomask |
| 09/28/2006 | WO2006101225A1 Free-standing substrate, manufacturing method thereof and semiconductor light-emitting device |
| 09/28/2006 | WO2006101199A1 Area mounting semiconductor device, and die bonding resin composition and sealing resin composition for use therein |
| 09/28/2006 | WO2006101192A1 Projection optical device |
| 09/28/2006 | WO2006101155A1 Electronic component mounting method and electronic circuit device |
| 09/28/2006 | WO2006101130A1 Film-forming apparatus and film-forming method |
| 09/28/2006 | WO2006101129A1 Substrate treatment method, film-forming method, film-forming device, and computer program |
| 09/28/2006 | WO2006101124A1 Heating device, reflow device, heating method, and bump forming method |
| 09/28/2006 | WO2006101120A1 Exposure apparatus, exposure method and method for manufacturing device |
| 09/28/2006 | WO2006101091A1 Laser machining method |
| 09/28/2006 | WO2006101086A1 Exposure apparatus, exposure method and method for manufacturing microdevice |
| 09/28/2006 | WO2006101068A1 Semiconductor device and manufacturing method thereof |
| 09/28/2006 | WO2006101027A1 Precursor composition for porous membrane and process for preparation thereof, porous membrane and process for production thereof, and semiconductor device |
| 09/28/2006 | WO2006101024A1 Exposure method, exposure apparatus, device manufacturing method and exposure apparatus evaluating method |
| 09/28/2006 | WO2006101017A1 Organic thin film transistor and method for manufacturing same |
| 09/28/2006 | WO2006101010A1 Semiconductor device and its fabrication process |
| 09/28/2006 | WO2006100956A1 Process for producing thin nitride film on sapphire substrate and thin nitride film producing apparatus |
| 09/28/2006 | WO2006100953A1 Method of film formation and apparatus for film formation |
| 09/28/2006 | WO2006100932A1 Take up device and take up method |
| 09/28/2006 | WO2006100931A1 Film applying device and film applying method |
| 09/28/2006 | WO2006100900A1 Underbump metal film, method for forming same, and surface acoustic wave device |
| 09/28/2006 | WO2006100897A1 Group iii nitride semiconductor device and epitaxial substrate |
| 09/28/2006 | WO2006100862A1 Substrate processing method and recording medium |
| 09/28/2006 | WO2006100817A1 Pattern forming material, pattern forming apparatus, and pattern forming method |
| 09/28/2006 | WO2006100795A1 Semiconductor integrated circuit device formed by automatic layout wiring by use of standard cells and design method of fixing its well potential |
| 09/28/2006 | WO2006100765A1 Method of manufacturing semiconductor device and compression molding device |
| 09/28/2006 | WO2006100738A1 Semiconductor device and method for manufacturing same |
| 09/28/2006 | WO2006100737A1 Semiconductor device manufacturing method |
| 09/28/2006 | WO2006100640A1 Method of manufacturing a semiconductor device having a buried doped region |
| 09/28/2006 | WO2006100632A1 Side wall pore sealing for low-k dielectrics |
| 09/28/2006 | WO2006100559A1 Diamond based substrate for electronic devices |
| 09/28/2006 | WO2006100460A1 Treatment of items |
| 09/28/2006 | WO2006100301A1 Method of producing a hetero-structure comprising at least one thick layer of semiconductor material |
| 09/28/2006 | WO2006100186A1 Transistor device and methods of manufacture thereof |
| 09/28/2006 | WO2006099885A1 Method for linking a chip and a substrate |
| 09/28/2006 | WO2006099776A1 Preparing a single component metal nanowire directly by physical vapor phase method |
| 09/28/2006 | WO2006088766A3 Highly conductive shallow junction formation |
| 09/28/2006 | WO2006086265A3 Method and composition for polishing a substrate |
| 09/28/2006 | WO2006085681A9 Photosensitive composition removing liquid |
| 09/28/2006 | WO2006076151A3 Lithography and associated methods, devices, and systems |
| 09/28/2006 | WO2006057709A3 Method for deposition of metal layers from metal carbonyl precursors |
| 09/28/2006 | WO2006037526A3 Lateral dmos-transistor and method for the production thereof |
| 09/28/2006 | WO2006023219A3 Method and apparatus for mobility enhancement in a semiconductor device |
| 09/28/2006 | WO2006012048A3 Deposition apparatus for providing uniform low-k dielectric |
| 09/28/2006 | WO2006012021A3 Methods and apparatus for optimal temperature control in a plasma processing system |
| 09/28/2006 | WO2006007068A3 Integration of strained ge into advanced cmos technology |
| 09/28/2006 | WO2005094320A3 Method of separating layers of material using a laser beam |
| 09/28/2006 | WO2005062885A3 Selectivity control in a plasma processing system |
| 09/28/2006 | WO2005008849A3 Method of forming a scribe line on a passive electronic component substrate |
| 09/28/2006 | WO2004072694A3 Optical waveguide grating coupler incorporating reflective optical elements and anti-reflection elements |
| 09/28/2006 | US20060218519 Layout design method for semiconductor integrated circuit, and semiconductor integrated circuit |
| 09/28/2006 | US20060218518 Semiconductor integrated device and apparatus for designing the same |
| 09/28/2006 | US20060218216 Programmable logic devices with function-specific blocks |
| 09/28/2006 | US20060217896 Photometrically modulated delivery of reagents |
| 09/28/2006 | US20060217830 Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
| 09/28/2006 | US20060217487 Polyalkylsilazane containing tris(trimethylsilyl)phosphate in an organic solvent; dielectric interlayer having a specific permittivity of not more than 3.5 |
| 09/28/2006 | US20060217278 A mixture of solvents with no corrosion of copper properties and a corrosion inhibitor; during the photolithographic process, removing photoresist remaining after forming copper line |
| 09/28/2006 | US20060217049 Perforation and grooving for polishing articles |
| 09/28/2006 | US20060217040 Methods and apparatus for removing conductive material from a microelectronic substrate |
| 09/28/2006 | US20060217039 Polishing apparatus and method of polishing work piece |
| 09/28/2006 | US20060217038 Endpoint detection system for wafer polishing |
| 09/28/2006 | US20060216955 Laser-based termination of miniature passive electronic components |
| 09/28/2006 | US20060216954 Method for manufacturing semiconductor device |
| 09/28/2006 | US20060216953 Method of forming film and film forming apparatus |
| 09/28/2006 | US20060216952 Vapor phase treatment of dielectric materials |
| 09/28/2006 | US20060216951 Method of making an encapsulated sensitive device |
| 09/28/2006 | US20060216950 Film-forming apparatus and film-forming method |
| 09/28/2006 | US20060216949 Method for cleaning heat treatment apparatus |
| 09/28/2006 | US20060216948 Substrate processing system and method for manufacturing semiconductor device |
| 09/28/2006 | US20060216947 Methods and batch type atomic layer deposition apparatus for forming dielectric films and methods of manufacturing metal-insulator-metal capacitors including the dielectric films |
| 09/28/2006 | US20060216946 Method of fabricating a semiconductor device |
| 09/28/2006 | US20060216945 Methods of depositing materials over semiconductor substrates |
| 09/28/2006 | US20060216944 Method and apparatus for plasma nitridation of gate dielectrics using amplitude modulated radio-frequency energy |
| 09/28/2006 | US20060216943 Method for forming metal line |
| 09/28/2006 | US20060216942 Wafer carrier for minimizing contacting area with wafers |
| 09/28/2006 | US20060216941 Method for removing silicon oxide film and processing apparatus |