H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2006
10/12/2006	US20060225638 Process for the low-temperature joining of bodies, and products produced in accordance with the process
10/12/2006	US20060225299 Method of transferring a substrate
10/12/2006	US20060225272 Method of fabricating semiconductor chip assemblies
10/12/2006	DE4422957B4 Isolierverfahren für eine Halbleitervorrichtung Isolation of a semiconductor device
10/12/2006	DE202006012740U1 Coating for semiconductor treatment chamber, has recess formed in outer surface of cylindrical body and slit arranged in recess and passing through body, where body is coated by yttrium or oxide of yttrium
10/12/2006	DE19954845B4 Nichtflüchtige ferroelektrische Speicherzelle vom NAND-Typ, sowie nichtflüchtiger ferroelektrischer Speicher unter Verwendung einer solchen A non-volatile ferroelectric memory cell of the NAND type, as well as non-volatile ferroelectric memory using such a
10/12/2006	DE19930781B4 Diode mit Metall-Halbleiterkontakt und Verfahren zu ihrer Herstellung Diode metal-semiconductor contact and procedures for their preparation
10/12/2006	DE19639515B4 Anordnung zum Kalibrieren eines Netzwerkanalysators für die On-Wafer-Messung an integrierten Mikrowellenschaltungen Arrangement for calibrating a network analyzer for on-wafer measurement of integrated microwave circuits
10/12/2006	DE10343255B4 Verfahren zum Herstellen elektrischer Verbindungen zwischen einem Halbleiterchip in einem BGA-Gehäuse und einer Leiterplatte A method of making electrical connections between a semiconductor chip in a BGA package and a printed circuit board
10/12/2006	DE10313127B4 Verfahren zur Behandlung von Substratoberflächen A method for the treatment of substrate surfaces
10/12/2006	DE10300949B4 Halbleitervorrichtung mit Herstellungsverfahren dafür Semiconductor device manufacturing method thereof
10/12/2006	DE10213885B4 Anlage zur Bearbeitung einer Halbleiterscheibe und Verfahren zum Betreiben einer solchen Anlage System for processing a semiconductor wafer and method for operating such a system
10/12/2006	DE10212661B4 Halbleitervorrichtung Semiconductor device
10/12/2006	DE102006015768A1 Forming chemical-mechanical polishing cushion comprises delivering polymer materials and micro-beads to premix producing tank, forming and injecting mixture in closed form tool, hardening polishing cushion and degassing tanks and from tool
10/12/2006	DE102006012645A1 Verpackung von integrierten Schaltungen auf Waferniveau Packaging of integrated circuits at the wafer level
10/12/2006	DE102006004420A1 Vorrichtung zur Umwandlung der elektrischen Energie A device for converting the electrical energy
10/12/2006	DE102005061304A1 Verfahren zum Herstellen einer Kontaktfleckelektrode, Verfahren zum Herstellen eines Flüssigkristalldisplays unter Verwendung derselben sowie durch dieses Verfahren hergestelltes Flüssigkristalldisplay A method for manufacturing a pad electrode, method of manufacturing a liquid crystal display using the same, as well as liquid crystal display produced by this method
10/12/2006	DE102005029246A1 Halbleiterchip mit einer Lötschichtenfolge und Verfahren zum Löten eines Halbleiterchips Semiconductor chip with a solder layer and the procedures for soldering a semiconductor chip
10/12/2006	DE102005020342A1 Verfahren zur Herstellung von Charge-trapping-Speicherbauelementen A process for the preparation of charge-trapping memory devices
10/12/2006	DE102005016411A1 Vorrichtung zur hochgenauen Oberflächenbearbeitung eines Werkstückes The high-precision surface machining of a workpiece
10/12/2006	DE102005015455A1 Kunststoffgehäuse und Halbleiterbauteil mit derartigem Kunststoffgehäuse sowie Verfahren zur Herstellung desselben The same plastic housing and the semiconductor device with such plastic housing and methods for preparing
10/12/2006	DE102005014793A1 Technik zur CD-Messung auf der Grundlage der Bestimmung von Flächenanteilen Technique for CD measurement on the basis of the determination of surface portions
10/12/2006	DE102005014744A1 Trench transistor, has field formed between trenches and having drift field and body field with body contact and source fields, where breakthrough is formed in field for increasing avalanche rigidity in depth lying in area of trench bottom
10/12/2006	DE10164606B4 Flip-Chip-Halbleitereinrichtung mit außerhalb von Energiezufuhranschlussflächen angeordneten Signalanschlussflächen Flip-chip semiconductor device having arranged outside of power supply pads signal pads
10/12/2006	CA2603477A1 Semiconductor device including a superlattice with regions defining a semiconductor junction
10/12/2006	CA2603407A1 Semiconductor device including a superlattice and adjacent semiconductor layer with doped regions defining a semiconductor junction
10/12/2006	CA2603393A1 Compositions for cleaning ion implanted photoresist in front end of line applications
10/11/2006	EP1710848A1 Electrode of n-type nitride semiconductor and semiconductor device having the electrode
10/11/2006	EP1710842A1 Method for fabricating a bipolar transistor and a MISFET semiconductor device
10/11/2006	EP1710841A2 Gallium nitride based semiconductor device and method of manufacturing same
10/11/2006	EP1710836A1 Method for manufacturing soi wafer
10/11/2006	EP1710835A1 Stacked device and method for stacking integrated circuit devices
10/11/2006	EP1710834A2 Double trench for isolation of semiconductor devices
10/11/2006	EP1710833A1 Semiconductor manufacturing apparatus and semiconductor manufacturing method using same
10/11/2006	EP1710832A2 Electronic assembly with a noflow underfill
10/11/2006	EP1710831A1 Semiconductor device
10/11/2006	EP1710830A2 Silicon on insulator structure having intrinsic gettering
10/11/2006	EP1710628A1 Positive resist composition and method of forming resist pattern
10/11/2006	EP1710624A2 Methods of fabricating nano-scale and micro-scale mold for nano-imprint, and mold usage on nano-imprinting equipment
10/11/2006	EP1710555A1 Substrate inspection device, substrate inspection method, and recovery tool
10/11/2006	EP1710328A2 Process for producing SOI substrate and process for regeneration of layer transferred wafer in the production
10/11/2006	EP1710048A1 Polishing pad surface shape measuring instrument, method of using polishing pad surface shape measuring instrument, method of measuring apex angle of cone of polishing pad, method of measuring depth of groove of polishing pad, cmp polisher, and method of manufacturing semiconductor device
10/11/2006	EP1710047A2 Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface during chemical mechanical polishing
10/11/2006	EP1709854A2 System and method for self-leveling heat sink for multiple height devices
10/11/2006	EP1709848A1 Partially etched dielectric film with conductive features
10/11/2006	EP1709700A1 Vertical field effect transistors incorporating semiconducting nanotubes grown in a spacer-defined passage
10/11/2006	EP1709695A1 Gallium nitride-based iii-v group compound semiconductor device and method of manufacturing the same
10/11/2006	EP1709689A1 Transistor with workfunction-induced charge layer
10/11/2006	EP1709688A1 Semiconductor device
10/11/2006	EP1709686A2 Apparatus incorporating small-feature-size and large-feature-size components and method for making same
10/11/2006	EP1709684A1 Pillar bumps for high power chip interconnection
10/11/2006	EP1709682A1 Pocket implant for complementary bit disturb improvement and charging improvement of sonos memory cell
10/11/2006	EP1709681A1 Semiconductor memory cell and corresponding method of producing the same
10/11/2006	EP1709680A2 Vertical gate cmos with lithography-independent gate length
10/11/2006	EP1709679A1 System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
10/11/2006	EP1709678A1 Stress free etch processing in combination with a dynamic liquid meniscus
10/11/2006	EP1709677A1 Passivation of deep isolating separating trenches with sunk covering layers
10/11/2006	EP1709676A1 A method of fabricating a release substrate
10/11/2006	EP1709675A1 Wafer level super stretch solder
10/11/2006	EP1709674A1 Plasma processing method and method for fabricating electronic component module using the same
10/11/2006	EP1709673A1 Semiconductor device and method of manufacturing thereof
10/11/2006	EP1709672A1 Structure and method for low vss resistance and reduced dibl in a floating gate memory cell
10/11/2006	EP1709671A1 Method of forming thin sgoi wafers with high relaxation and low stacking fault defect density
10/11/2006	EP1709670A1 Group iii nitride semiconductor multilayer structure
10/11/2006	EP1709669A1 Co-doping for fermi level control in semi-insulating group iii nitrides
10/11/2006	EP1709646A1 Method and apparatus for hot carrier programmed one time programmable (otp) memory
10/11/2006	EP1709573A1 Semiconductor device
10/11/2006	EP1709518A1 Voltage regulator circuit arrangement
10/11/2006	EP1709213A2 Systems and methods for synthesis of extended length nanostructures
10/11/2006	EP1709130A2 Chemical-mechanical polishing of metals in an oxidized form
10/11/2006	EP1708958A1 Microcomponent comprising a hermetically-sealed cavity and a plug, and method of producing one such microcomponent
10/11/2006	EP1708775A1 Catheter tip
10/11/2006	EP1644862A4 Non-oriented optical character recognition of a wafer mark
10/11/2006	EP1606223B1 Method for producing individual microlenses or a microlens array
10/11/2006	EP1478681A4 Spin-on-glass anti-reflective coatings for photolithography
10/11/2006	EP1356510A4 Wafer scale molding of protective caps
10/11/2006	EP1313890B1 Barrier coating for vitreous materials
10/11/2006	EP1035569B1 Method for forming plasma films
10/11/2006	EP0958600B1 Method of forming a capacitor
10/11/2006	EP0939974B1 Manufacture of a semiconductor device with a mos transistor having an ldd structure
10/11/2006	EP0870325B1 Microelectronic mounting with multiple lead deformation
10/11/2006	EP0789071B1 Method for treating surface of substrate and surface treatment composition therefor
10/11/2006	CN2826699Y Germanium-silicon Schottky diode
10/11/2006	CN2826695Y 半导体衬底 A semiconductor substrate
10/11/2006	CN2826440Y IC testing module
10/11/2006	CN2825653Y Table base space adjusting device with multiple measure base
10/11/2006	CN2825651Y Liner for sediment chamber
10/11/2006	CN1846313A Structure and method for metal replacement gate of high performance device
10/11/2006	CN1846312A Electrode substrate, thin film transistor, display device and their production
10/11/2006	CN1846310A Nitride semiconductor device and manufacturing method thereof
10/11/2006	CN1846309A Integrated circuit having pairs of parallel complementary finfets
10/11/2006	CN1846308A Microelectronic package method and device
10/11/2006	CN1846307A Methods of processing thick ILD layers using spray coating or lamination for C4 wafer level thick metal integrated flow
10/11/2006	CN1846305A Method for integrating metals having different work functions to form cmos gates having a high-K dielectric and related structure
10/11/2006	CN1846304A Method for forming a semiconductor device having isolation regions
10/11/2006	CN1846303A Process for fabricating electronic components using liquid injection molding
10/11/2006	CN1846302A Integrated electronic chip and interconnect device and process for making the same
10/11/2006	CN1846301A Siliciding spacer in integrated circuit technology
10/11/2006	CN1846300A Plasma processing device
10/11/2006	CN1846299A Nitride semiconductor substrate and nitride semiconductor device using same

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