H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2006
11/30/2006	US20060267099 Semiconductor device and manufacturing method of the same
11/30/2006	US20060267097 Method for forming a MOS transistor and structure thereof
11/30/2006	US20060267096 Method of designing semiconductor device, semiconductor device and recording medium
11/30/2006	US20060267087 Multi-silicide system in integrated circuit technology
11/30/2006	US20060267085 Trech-type vertical semiconductor device having gate electrode buried in rounded hump opening
11/30/2006	US20060267083 Power semiconductor device having a voltage sustaining region that includes doped columns formed with a single ion implantation step
11/30/2006	US20060267081 Semiconductor device and method of manufacturing the same by using atomic layer deposition
11/30/2006	US20060267078 Charge-trapping memory device
11/30/2006	US20060267077 Semiconductor memory element, semiconductor memory device and method of fabricating the same
11/30/2006	US20060267075 Multi-state memory cell
11/30/2006	US20060267074 Method for fabricating semiconductor device and semiconductor device
11/30/2006	US20060267073 Semiconductor memory cell and semiconductor memory device
11/30/2006	US20060267069 Nonvolatile semiconductor memory
11/30/2006	US20060267065 Semiconductor device using a conductive film and method of manufacturing the same
11/30/2006	US20060267062 Double sided container process used during the manufacture of a semiconductor device
11/30/2006	US20060267061 Mosfet having channel in bulk semiconductor and source/drain on insulator, and method of fabrication
11/30/2006	US20060267055 Ferroelectric polymer memory device having pyramidal electrode layer and method of forming same
11/30/2006	US20060267053 Snapshot CMOS image sensor with high shutter rejection ratio
11/30/2006	US20060267046 Semiconductor device and method of manufacturing the same
11/30/2006	US20060267045 Negative resistance field-effect element
11/30/2006	US20060267043 Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices
11/30/2006	US20060267042 Light emitting apparatus and method of manufacturing the same
11/30/2006	US20060267034 Semiconductor light-emitting device and method for fabricating the same
11/30/2006	US20060267033 Nitride-based semiconductor light emitting device and manufacturing method thereof
11/30/2006	US20060267020 Method of manufacturing a semiconductor device utilizing melt recrystallization of a semiconductor layer
11/30/2006	US20060267018 Thin film circuit
11/30/2006	US20060267016 Liquid crystal display and method of making the same
11/30/2006	US20060267014 Signal line for display device and thin film transistor array panel including the signal line
11/30/2006	US20060267012 Thin-film transistor and method of fabricating the same
11/30/2006	US20060267010 Semiconductor device, semiconductor device manufacturing method, and semiconductor device test method
11/30/2006	US20060267009 Method for local wafer thinning and reinforcement
11/30/2006	US20060267006 Electrode substrate, thin film transistor, display device and their production
11/30/2006	US20060267005 Transistor, circuit board, display and electronic equipment
11/30/2006	US20060266997 Methods for forming semiconductor structures with differential surface layer thicknesses
11/30/2006	US20060266990 Lateral phase change memory and method therefor
11/30/2006	US20060266736 Detecting particle agglomeration in chemical mechanical polishing slurries
11/30/2006	US20060266730 Microelectromechanical structure and a method for making the same
11/30/2006	US20060266478 Critical dimension reduction and roughness control
11/30/2006	US20060266437 Method for producing soi wafer
11/30/2006	US20060266393 Method and apparatus for wafer cleaning
11/30/2006	US20060266392 Method and apparatus for wafer cleaning
11/30/2006	US20060266389 Method and apparatus for wafer cleaning
11/30/2006	US20060266387 Method and apparatus for wafer cleaning
11/30/2006	US20060266382 Substrate processing method of and substrate processing apparatus for freezing and cleaning substrate
11/30/2006	US20060266291 Thin film forming device and thin film forming method
11/30/2006	US20060266282 Variable temperature deposition methods
11/30/2006	DE19925880B4 Avalanchefeste MOS-Transistorstruktur Avalanche Solid MOS transistor structure
11/30/2006	DE19819217B4 Leiterplatte für eine elektronische Komponente Circuit board for an electronic component
11/30/2006	DE19810579B4 Integrierte Halbleiterschaltungsvorrichtung A semiconductor integrated circuit device
11/30/2006	DE112005000168T5 Verfahren zur Herstellung eines Kunstharzformgehäuses, Alkoholkonzentrationssensor und Vorrichtung zum Messen einer Alkoholkonzentration A process for producing a synthetic resin molded casing, alcohol concentration sensor and apparatus for measuring a concentration of alcohol
11/30/2006	DE112004002478T5 Messung optischer Eigenschaften von strahlungsempfindlichen Materialien Measuring optical properties of radiation sensitive materials
11/30/2006	DE112004002401T5 Herstellung abrupter Übergänge in Bauelementen unter Anwendung des Dotierstoffschneepflugeffektes beim Silizidwachstum Producing abrupt transitions in devices using the Dotierstoffschneepflugeffektes the Silizidwachstum
11/30/2006	DE10335155B4 Verfahren zum Herstellen einer Anordnung eines elektrischen Bauelements auf einem Substrat A method of manufacturing an arrangement of an electrical component on a substrate
11/30/2006	DE10314172B4 Verfahren zum Betreiben einer Anordnung aus einem elektrischen Bauelement auf einem Substrat und Verfahren zum Herstellen der Anordnung A method of operating an arrangement comprising an electrical component on a substrate and method of manufacturing the arrangement
11/30/2006	DE10254473B4 Verfahren zum Herstellen einer integrierten Halbleiterschaltung A method of manufacturing a semiconductor integrated circuit
11/30/2006	DE102005025116A1 Semiconductor structure e.g. dynamic random access memory unit, manufacturing method, involves utilizing carbon and fluorine containing gas as etching gas to etch oxide, which is directly adjacent to silicon nitride
11/30/2006	DE102005024431A1 Trägerplatte mit Klebstofffolie und Verfahren zur Herstellung von Halbleiterbauteilen unter Verwendung der Trägerplatte mit Klebstofffolie Carrier plate with adhesive film and process for producing semiconductor devices using the carrier plate with the adhesive film
11/30/2006	DE102005024430A1 Siliziumwafer mit einer lötbaren Beschichtung auf seiner Waferrückseite und Verfahren zum Herstellen desselben Of the same silicon wafer with a solderable coating on the wafer backside and methods for preparing
11/30/2006	DE102005024118A1 Process chamber for heating rotating semiconductor wafers, for dosing, has a dividing wall giving part-chambers for the wafer and the rotating unit with prevention of particle deposition on the wafer
11/30/2006	DE102005023949A1 Nutzen und Halbleiterbauteil aus einer Verbundplatte mit Halbleiterchips und Kunststoffgehäusemasse sowie Verfahren zur Herstellung derselben Benefits and semiconductor component of a composite plate with semiconductor chips and plastic housing composition and method of making same
11/30/2006	DE102005023736A1 Structural parameter e.g. line width, determining method for use in semiconductor manufacturing, involves analyzing formula for spectrum in partial formula so that partial formulas are newly computed during computation of spectrum
11/30/2006	DE102004045773B4 Halbleiterbauelement mit dielektrischer Schichtfolge und Herstellungsverfahren A semiconductor device comprising a dielectric layer sequence and production method
11/30/2006	DE102004041554B4 Verfahren zur Herstellung eines vertikalen MOS-Transistors und eies CMOS-Inverters A method for producing a vertical type MOS transistor and the CMOS inverter egg
11/30/2006	DE10153110B4 Speicherzelle Memory cell
11/30/2006	DE10060828B4 Halbleiterbauelement in Drain-up-Konfiguration A semiconductor device in drain-up configuration
11/30/2006	DE10054038B4 Verfahren zum Trennen eines plattenförmigen Körpers, insbesondere eines Halbleiterwafers, in Einzelstücke A method of separating a plate-shaped body, in particular a semiconductor wafer, into individual pieces
11/30/2006	DE10044841B4 Plasmaverkapselung für elektronische und mikroelektronische Bauelemente wie OLEDs sowie Verfahren zu dessen Herstellung Plasmaverkapselung for electronic and microelectronic devices such as OLEDs and to processes for the preparation thereof
11/30/2006	DE10005772B4 Trench-MOSFET Trench MOSFET
11/30/2006	CA2609602A1 Semiconductor device comprising a superlattice dielectric interface layer
11/30/2006	CA2609585A1 Semiconductor device including a superlattice having at least one group of substantially undoped layer
11/30/2006	CA2609537A1 Method for preparing nanocrystalline silicon in sio2 and freestanding silicon nanoparticles
11/30/2006	CA2570558A1 High electron mobility transistor, field-effect transistor, epitaxial substrate, method of manufacturing epitaxial substrate, and method of manufacturing group iii nitride transistor
11/29/2006	EP1727220A2 Conductive structure based on poly-3,4-alkenedioxythiophene (PEDOT) and polystyrenesulfonic acid (PSS)
11/29/2006	EP1727204A2 Method for embedding NROM
11/29/2006	EP1727200A2 Integrated circuits and interconnect structure for integrated circuits
11/29/2006	EP1727199A2 Integrated circuits and interconnect structure for integrated circuits
11/29/2006	EP1727197A2 Semiconductor device, method for fabricating the semiconductor device and method and computer programme for designing the semiconductor device
11/29/2006	EP1727196A1 Programmable logic device and its designing method
11/29/2006	EP1727195A2 Method for high topography patterning
11/29/2006	EP1727194A1 Method for high topography patterning
11/29/2006	EP1727193A2 Single thin plate storage container and shock-absorbing support members used therein
11/29/2006	EP1727192A1 Electronic substrate manufacturing method comprising embedding component in substrate by application of heat and pressure and wiring formation by ink jet printing
11/29/2006	EP1727191A1 Substrate processing equipment
11/29/2006	EP1727190A1 Semiconductor layer structure and method of fabricating it
11/29/2006	EP1727189A2 Method for producing a semiconductor device
11/29/2006	EP1727188A1 Exposure apparatus, supply method and recovery method, exposure method, and device producing method
11/29/2006	EP1727177A1 Process for producing layered member and layered member
11/29/2006	EP1726992A1 Negative resist composition
11/29/2006	EP1726968A2 A method for local wafer thinning and reinforcement
11/29/2006	EP1726690A2 In-situ profile measurement in an electroplating process
11/29/2006	EP1726608A1 Radiation-sensitive resin composition
11/29/2006	EP1726419A1 Process for producing ceramic sheet, ceramic substrate utilizing the same and use thereof
11/29/2006	EP1726402A1 Wafer polishing apparatus and method for polishing wafers
11/29/2006	EP1726374A2 Ultrasonic washing apparatus
11/29/2006	EP1726197A2 An element for carrying electronic components
11/29/2006	EP1726188A1 Highly efficient organic light-emitting device using substrate or electrode having nanosized half-spherical convex and method for preparing
11/29/2006	EP1726044A1 Trench field effect transistor and method of making it
11/29/2006	EP1726042A2 Reconfigurable processor module with stacked die elements
11/29/2006	EP1726041A2 Cmos silicide metal gate integration
11/29/2006	EP1726040A1 Integrated circuit chips utilizing carbon nanotube composite interconnection vias

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