H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2006
11/28/2006	US7141123 Method of and apparatus for removing contaminants from surface of a substrate
11/28/2006	US7141121 An organic acid ammonium (NH4) salt added to a mixed solution of ammonium hydroxide, hydrogen peroxide and water.
11/28/2006	US7141120 Manufacturing apparatus of semiconductor device having introducing section and withdrawing section
11/28/2006	US7141080 Method and apparatus for assembling an array of micro-devices
11/28/2006	US7140955 Polishing apparatus
11/28/2006	US7140951 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing semiconductor wafer
11/28/2006	US7140883 Contact carriers (tiles) for populating larger substrates with spring contacts
11/28/2006	US7140866 Self-alignment stage for compression-forming machines
11/28/2006	US7140529 Wire bonding method and apparatus
11/28/2006	US7140512 Interlocking lid for wet bench
11/28/2006	US7140384 Substrate processing equipment having mass flow controller
11/28/2006	US7140374 System, method and apparatus for self-cleaning dry etch
11/28/2006	US7140321 Plasma processing apparatus and method
11/28/2006	US7140102 Via electrical current, thermal stresses, and/or mechanical force; surfaces that mirror one another may be created without the need for a sacrificial layer; triodes
11/28/2006	US7140096 Method of manufacturing a magnetoresistance effect device
11/28/2006	CA2362798C Method and device for treating substrates
11/27/2006	CA2546194A1 Micro-contact-printing engine
11/25/2006	WO2008036062A2 Method for making a semiconductor device including band-engineered superlattice using intermediate annealing
11/25/2006	CA2611283A1 Method for making a semiconductor device including band-engineered superlattice using intermediate annealing
11/23/2006	WO2006125206A2 Method and apparatus for rfid device assembly
11/23/2006	WO2006125135A1 Forming of local and global wiring for semiconductor product
11/23/2006	WO2006125069A2 A high resistivity silicon structure and a process for the preparation thereof
11/23/2006	WO2006125040A2 Lattice-mismatched semiconductor structures with reduced dislocation defect densities related methods for device fabrication
11/23/2006	WO2006124982A1 Interface between conveyor and semiconductor process tool load port
11/23/2006	WO2006124967A2 Low temperature plasma deposition process for carbon layer deposition
11/23/2006	WO2006124966A2 Low temperature absorption layer deposition and high speed optical annealing system
11/23/2006	WO2006124965A1 A semiconductor junction formation process including low temperature plasma deposition of an optical absorption layer and high speed optical annealing
11/23/2006	WO2006124683A2 Modular terminal for high-throughput amhs
11/23/2006	WO2006124681A2 Oral drug delivery system and methods of use thereof
11/23/2006	WO2006124637A1 Ultraschallanalysator fur chemisch-mechanisches polierkissen
11/23/2006	WO2006124625A2 Use of nanoparticles in film formation and as solder
11/23/2006	WO2006124472A2 Method and apparatus for vertical transfer of semiconductor substrates in a cleaning module
11/23/2006	WO2006124321A2 Treatment of substrate using fuctionalizing agent in supercritical carbon dioxide
11/23/2006	WO2006124295A2 Backside method and system for fabricating semiconductor components with conductive interconnects
11/23/2006	WO2006124261A1 Methods of etching oxide, reducing roughness, and forming capacitor constructions
11/23/2006	WO2006124241A2 Electronic device including a trench field isolation having combination shallow and deep depth and a process for forming the same
11/23/2006	WO2006124216A1 Methods of forming devices associated with semiconductor constructions
11/23/2006	WO2006124201A2 Selective wet etching of oxides
11/23/2006	WO2006124183A2 High voltage silicon carbide devices having bi-directional blocking capabilities and methods of fabricating the same
11/23/2006	WO2006124182A1 Method for fabricating soi device
11/23/2006	WO2006124174A2 High voltage silicon carbide mos-bipolar devices having bi-directional blocking capabilities and methods of fabricating the same
11/23/2006	WO2006124172A1 Method chemical-mechanical polishing and planarizing corundum, gaas, gap and gaas/gap alloy surfaces
11/23/2006	WO2006124157A1 Polar fluid removal from surfaces using supercritical fluids
11/23/2006	WO2006124131A2 Substrates including a capping layer on electrically conductive regions
11/23/2006	WO2006124067A1 Controlled polarity group iii-nitride films and methods of preparing such films
11/23/2006	WO2006123870A1 Apparatus for chemical vapor deposition with shower head and method therof
11/23/2006	WO2006123857A1 Phase shift mask for preventing haze
11/23/2006	WO2006123825A1 Manufacturing method of semiconductor device
11/23/2006	WO2006123815A1 Process of forming a curved profile on a semiconductor substrate
11/23/2006	WO2006123772A1 Wafer inspecting sheet-like probe and application thereof
11/23/2006	WO2006123739A1 Method and apparatus for flattening solid surface
11/23/2006	WO2006123700A1 Photoresist composition
11/23/2006	WO2006123680A1 Electrostatic holding apparatus and electrostatic tweezers using same
11/23/2006	WO2006123673A1 Process for producing silicon compound
11/23/2006	WO2006123643A1 Material for protective film formation for liquid immersion exposure process, and method for photoresist pattern formation using the same
11/23/2006	WO2006123592A1 Aligning stage, bump forming apparatus and bump forming method using such aligning stage
11/23/2006	WO2006123580A1 Nitride semiconductor device and method for manufacturing same
11/23/2006	WO2006123562A1 Process for producing composition for polishing
11/23/2006	WO2006123559A1 Polishing pad
11/23/2006	WO2006123554A1 Flip-chip mounting body and flip-chip mounting method
11/23/2006	WO2006123540A1 Group 3-5 nitride semiconductor multilayer substrate, method for manufacturing group 3-5 nitride semiconductor free-standing substrate, and semiconductor element
11/23/2006	WO2006123527A1 Method and apparatus for removing organic coating on surface of substrate
11/23/2006	WO2006123526A1 Plasma treatment apparatus
11/23/2006	WO2006123524A1 Plasma generating apparatus and plasma treatment apparatus
11/23/2006	WO2006123523A1 Positive resist composition and method of forming resist pattern
11/23/2006	WO2006123509A1 Adhering apparatus
11/23/2006	WO2006123508A1 Brittle member processing apparatus
11/23/2006	WO2006123496A1 Positive-working resist composition and method for resist pattern formation
11/23/2006	WO2006123487A1 Positive resist composition and method of forming resist pattern
11/23/2006	WO2006123478A1 Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body
11/23/2006	WO2006123463A1 Polishing pad, process for producing the same, and process for producing semiconductor device using said polishing pad
11/23/2006	WO2006123458A1 Semiconductor device and method for manufacturing same
11/23/2006	WO2006123447A1 Electron beam exposure device
11/23/2006	WO2006123437A1 Charged particle beam apparatus, contamination removing method and sample observing method
11/23/2006	WO2006123402A1 Substrate loading/unloading device and substrate loading/unloading method
11/23/2006	WO2006123105A2 Semiconductor device and method of forming a semiconductor device
11/23/2006	WO2006122957A2 Mos power device with high integration density and manufacturing process thereof
11/23/2006	WO2006122956A1 Fin field effect transistors (finfets) and methods for making the same
11/23/2006	WO2006122505A1 Integrated circuit packaging and method of making the same
11/23/2006	WO2006122467A1 A packaging substrate with flat bumps for ic or discrete device and method of manufacturing the same
11/23/2006	WO2006107569A3 Methods for rinsing microelectronic substrates utilizing cool rinse fluid within a gas environment including a drying enhancement substance
11/23/2006	WO2006107519B1 Bonding wire cleaning unit with a chamber and an energy source and method of wire bonding using such cleaning unit
11/23/2006	WO2006104817A3 Method for reducing dielectric overetch when making contact to conductive features
11/23/2006	WO2006101695B1 Pitch reduced patterns relative to photolithography features
11/23/2006	WO2006096749A3 Semiconductor device manufacture using a sidewall spacer etchback
11/23/2006	WO2006076208A3 Systems and methods for removing operating heat from a light emitting diode
11/23/2006	WO2006074352A3 Mems passivation with transition metals
11/23/2006	WO2006056999A3 Methods for manufacturing a sensor assembly
11/23/2006	WO2006053069A3 Low-k dielectric layer formed from aluminosilicate precursors
11/23/2006	WO2005121912A8 Method of controlling operation of a processing system
11/23/2006	WO2005104223A8 Process for the singulation of integrated devices in thin semiconductor chips
11/23/2006	WO2005089150A3 Thermally cured undercoat for lithographic application
11/23/2006	WO2005072302A3 Method for depositing high-quality microcrystalline semiconductor materials
11/23/2006	WO2005070007A3 Iii-nitride current control device and method of manufacture
11/23/2006	WO2005045509A3 Electro-optic displays
11/23/2006	WO2005024908A3 Laser transfer articles and method of making
11/23/2006	US20060265686 in photolithography to inspect respective overlays between the target layer and the underlying layers, control the alignment accuracy through computer data processing, transferring a pattern
11/23/2006	US20060265185 System for identification of defects on circuits or other arrayed products
11/23/2006	US20060265100 Sequential pulse deposition
11/23/2006	US20060265099 Semiconductor production system

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