H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2006
12/05/2006	US7144790 Shallow trench isolation type semiconductor device and method of forming the same
12/05/2006	US7144789 Method of fabricating complementary bipolar transistors with SiGe base regions
12/05/2006	US7144788 Method for manufacturing a transmitting optical sub-assembly with a thermo-electric cooler therein
12/05/2006	US7144787 Methods to improve the SiGe heterojunction bipolar device performance
12/05/2006	US7144786 Technique for forming a transistor having raised drain and source regions with a reduced number of process steps
12/05/2006	US7144785 Method of forming isolation trench with spacer formation
12/05/2006	US7144784 Method of forming a semiconductor device and structure thereof
12/05/2006	US7144783 Reducing gate dielectric material to form a metal gate electrode extension
12/05/2006	US7144782 Simplified masking for asymmetric halo
12/05/2006	US7144781 Manufacturing method of a semiconductor device
12/05/2006	US7144780 Semiconductor device and its manufacturing method
12/05/2006	US7144779 Method of forming epitaxial silicon-comprising material
12/05/2006	US7144778 Self aligned method of forming a semiconductor memory array of floating gate memory cells with buried bit-line and raised source line
12/05/2006	US7144777 Non-volatile memory and manufacturing method thereof
12/05/2006	US7144776 Charge-trapping memory device
12/05/2006	US7144775 Low-voltage single-layer polysilicon eeprom memory cell
12/05/2006	US7144774 Method of fabricating non-volatile memory
12/05/2006	US7144772 Semiconductor devices having capacitors of metal-insulator-metal structure with coextensive oxidation barrier pattern and lower electrode bottom and methods of forming the same
12/05/2006	US7144771 Methods of forming electronic devices including dielectric layers with different densities of titanium
12/05/2006	US7144770 Memory cell and method for fabricating it
12/05/2006	US7144769 Method to achieve increased trench depth, independent of CD as defined by lithography
12/05/2006	US7144768 Fabrication of titanium and titanium alloy anode for dielectric and insulated films
12/05/2006	US7144767 NFETs using gate induced stress modulation
12/05/2006	US7144766 Method of manufacturing semiconductor integrated circuit device having polymetal gate electrode
12/05/2006	US7144765 Semiconductor device with Schottky electrode including lanthanum and boron, and manufacturing method thereof
12/05/2006	US7144764 Method of manufacturing semiconductor device having trench isolation
12/05/2006	US7144763 light emitting diode; curable silicone with pendant epoxy groups, a hydroxyl-containing compound or silicone, anhydride curing agent, ancillary curing catalyst; radiation transparent, UV stability, clear; packaging
12/05/2006	US7144762 Semiconductor device with pins and method of assembling the semiconductor device
12/05/2006	US7144761 Semiconductor device and method for fabricating the same
12/05/2006	US7144760 Semiconductor device, method of manufacturing the same, circuit board, and electronic equipment
12/05/2006	US7144759 Technology partitioning for advanced flip-chip packaging
12/05/2006	US7144758 Manufacturing method of semiconductor device, including differently spaced bump electrode arrays
12/05/2006	US7144757 Circuit suitable for vertical integration and method of producing same
12/05/2006	US7144756 Structure and material for assembling a low-K Si die to achieve a low warpage and industrial grade reliability flip chip package with organic substrate
12/05/2006	US7144755 Fabrication method of semiconductor integrated circuit device
12/05/2006	US7144754 Device having resin package and method of producing the same
12/05/2006	US7144753 Boron-doped nanocrystalline diamond
12/05/2006	US7144752 Method of manufacturing organic electroluminescent display device and organic electroluminescent display device, and display device equipped with organic electroluminescent display device
12/05/2006	US7144751 Back-contact solar cells and methods for fabrication
12/05/2006	US7144750 Method of fabricating silicon-based MEMS devices
12/05/2006	US7144749 Method of etching a semiconductor device
12/05/2006	US7144748 Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
12/05/2006	US7144747 Method for thermally treating a substrate that comprises several layers
12/05/2006	US7144746 Method for monitoring implantation depth of impurity
12/05/2006	US7144745 Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced
12/05/2006	US7144744 Magnetoresistive random access memory device structures and methods for fabricating the same
12/05/2006	US7144685 Includes transparent support and shading member having pattern of at least two apertures with different widths not greater than wavelength of light from light source; transferring photoresist pattern onto silicon substrate by etching
12/05/2006	US7144682 non-polarized exposure light from a light source is projected onto an exposure mask having a light blocking film and a plurality of rectangular openings formed in the light blocking film; small-opening pattern
12/05/2006	US7144662 Photoresist composition having a high heat resistance
12/05/2006	US7144655 Thin-film battery having ultra-thin electrolyte
12/05/2006	US7144620 Chemical vapor deposition; low temperature oxidation; microelectronics
12/05/2006	US7144618 Multilayer composite and method for preparing the same
12/05/2006	US7144606 Exposing surface of silicon carbide or silicon oxycarbide to gas plasma of helium, argon, or inert gas such as a nitrous oxide (N2O); barrier, passivation, and dielectric layers; etch stops
12/05/2006	US7144601 Method of purging photoresist from semiconductor wafer coating apparatus
12/05/2006	US7144552 For preparing chemical solutions having high purity grades and used to fabricate electronic devices, such as semiconductor devices, from chemical gases having industrial chemical grades
12/05/2006	US7144539 Imprint method and device
12/05/2006	US7144538 Method for making a direct chip attach device and structure
12/05/2006	US7144521 High aspect ratio etch using modulation of RF powers of various frequencies
12/05/2006	US7144520 Etching method and apparatus
12/05/2006	US7144490 Forming a titanium-tungsten (TiW) layer over a passivation layer on a semiconductor substrate, the TiW layer further extending into an opening formed in the passivation layer for exposing the I/O pad, such that the TiW layer covers sidewalls of the opening and a top surface of the I/O pad
12/05/2006	US7144484 Ion mill shutter system
12/05/2006	US7144471 Bonding method and apparatus
12/05/2006	US7144459 Centrifugal swing arm spray processor
12/05/2006	US7144453 saccharide such as glucose or sucrose octabenzoate, a thermostable organic or inorganic matrix precursor such as cyclic siloxane monomers, and a solvent for dissolving the saccharide and precursor; evenly distributed nano-pores for semiconductors
12/05/2006	US7144301 Method and system for planarizing integrated circuit material
12/05/2006	US7144298 Method for manufacturing semiconductor device and apparatus for manufacturing thereof
12/05/2006	US7144245 Packages for semiconductor die
12/05/2006	US7144178 Mask, method of producing mask, and method of producing semiconductor device
12/05/2006	US7144160 Hydrodynamic bearing apparatus and stage apparatus using the same
12/05/2006	US7144056 Detection and handling of semiconductor wafers and wafers-like objects
12/05/2006	US7143887 Multi-position stop mechanism
12/05/2006	US7143660 Method and system for processing semiconductor wafers
12/05/2006	CA2415578C Filter member manufacturing method, filter member cutting method, filter chip cutting method, and filter chip manufacturing method
12/05/2006	CA2268903C Apparatus and method for recovering photoresist developers and strippers
11/2006
11/30/2006	WO2006128028A2 Wafer-level, polymer-based encapsulation for microstructure devices
11/30/2006	WO2006127988A1 Low inductance via structures
11/30/2006	WO2006127745A2 Apparatus and methods for maintaining integrated circuit performance at reduced power
11/30/2006	WO2006127669A2 Integrated circuit die attach using backside heat spreader
11/30/2006	WO2006127663A2 Wet electrolytic capacitors
11/30/2006	WO2006127586A2 Methods for forming arrays of small, closely spaced features
11/30/2006	WO2006127555A2 Multiprimary color subpixel rendering with metameric filtering
11/30/2006	WO2006127465A1 Integration process for fabricating stressed transistor structure
11/30/2006	WO2006127463A2 Method to increase tensile stress of silicon nitride films by using a post pecvd deposition uv cure
11/30/2006	WO2006127462A2 Method to increase the compressive stress of pecvd silicon nitride films
11/30/2006	WO2006127436A1 Method of forming passive electronic components on a substrate by direct write technique using shaped uniform laser beam
11/30/2006	WO2006127334A2 Integrated circuit with silicon oxycarbonitride interconnect
11/30/2006	WO2006127305A2 Method for changing threshold voltage of device in resist asher
11/30/2006	WO2006127291A2 Method for making a semiconductor device including a superlattice having at least one group of substantially undoped layers
11/30/2006	WO2006127269A2 Semiconductor device including a superlattice having at least one group of substantially undoped layer
11/30/2006	WO2006127227A2 Gallium nitride based structures including substrates and manufacturing methods thereof
11/30/2006	WO2006127225A2 Semiconductor device comprising a superlattice dielectric interface layer
11/30/2006	WO2006127215A1 Method for making a semiconductor device comprising a superlattice dielectric interface layer
11/30/2006	WO2006127200A1 Low-cost, low-voltage single-layer polycrystalline epprom memory cell integration into bicmos technology
11/30/2006	WO2006127163A2 Method of detachable direct bonding at low temperatures
11/30/2006	WO2006127157A2 Method of transferring a thin crystalline semiconductor layer
11/30/2006	WO2006127107A2 Semiconductor package and method for forming the same
11/30/2006	WO2006127093A2 Methods of fabricating silicon carbide devices having a smooth surface of the channel regions
11/30/2006	WO2006127054A1 Smart conditioner rinse station
11/30/2006	WO2006126998A1 Trench metal oxide semiconductor field effect transistor
11/30/2006	WO2006126968A1 A transflective liquid crystal device and method of manufacturing the same

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