Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
12/2006
12/05/2006US7145252 Configuration for testing the bonding positions of conductive drops and test method for using the same
12/05/2006US7145251 Colored conductive wires for a semiconductor package
12/05/2006US7145250 LSI package, LSI element testing method, and semiconductor device manufacturing method
12/05/2006US7145246 Method of fabricating an ultra-narrow channel semiconductor device
12/05/2006US7145245 Low-k dielectric film with good mechanical strength that varies in local porosity depending on location on substrate—therein
12/05/2006US7145244 Hardening of copper to improve copper CMP performance
12/05/2006US7145243 Photo-thermal induced diffusion
12/05/2006US7145242 Highly integrated and reliable DRAM
12/05/2006US7145241 Semiconductor device having a multilayer interconnection structure and fabrication process thereof
12/05/2006US7145240 Semiconductor device having a capacitor and method of manufacturing the same
12/05/2006US7145237 Electrode employing nitride-based semiconductor of III-V group compound, and producing method thereof
12/05/2006US7145236 Semiconductor device having solder bumps reliably reflow solderable
12/05/2006US7145235 Hermetic passivation structure with low capacitance
12/05/2006US7145230 Semiconductor device with a solder creep-up prevention zone
12/05/2006US7145224 Semiconductor device
12/05/2006US7145221 Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
12/05/2006US7145220 Fin semiconductor device and method for fabricating the same
12/05/2006US7145219 Vertical integrated circuits
12/05/2006US7145218 Thin-film resistor and method of manufacturing the same
12/05/2006US7145215 Semiconductor device with a cavity therein and a method of manufacturing the same
12/05/2006US7145214 Substrate for stressed systems and method of making same
12/05/2006US7145213 MEMS RF switch integrated process
12/05/2006US7145212 Method for manufacturing device substrate with metal back-gate and structure formed thereby
12/05/2006US7145210 Semiconductor device
12/05/2006US7145209 Thin film transistor and fabrication method thereof
12/05/2006US7145208 MOS transistor having a work-function-dominating layer
12/05/2006US7145206 MOS field effect transistor with reduced parasitic substrate conduction
12/05/2006US7145205 Semiconductor device
12/05/2006US7145202 Semiconductor device and method for manufacturing the same
12/05/2006US7145201 Semiconductor component
12/05/2006US7145200 Nonvolatile semiconductor memory device
12/05/2006US7145199 Nonvolatile semiconductor memory
12/05/2006US7145198 Compositions for thin-film capacitance device, high-dielectric constant insulating film, thin-film capacitance device, and thin-film multilayer capacitor
12/05/2006US7145196 Asymmetric field effect transistor
12/05/2006US7145195 Semiconductor memory device and method of manufacturing the same
12/05/2006US7145194 Semiconductor integrated circuit device and a method of manufacturing the same
12/05/2006US7145193 Semiconductor integrated circuit device and process for manufacturing the same
12/05/2006US7145192 MOS transistor and method of manufacturing the same
12/05/2006US7145187 Substrate independent multiple input bi-directional ESD protection structure
12/05/2006US7145184 Nitride semiconductor element
12/05/2006US7145183 Method for producing a vertically emitting laser
12/05/2006US7145182 Integrated emitter devices having beam divergence reducing encapsulation layer
12/05/2006US7145180 Method of fabricating a light emitting device, and light emitting device
12/05/2006US7145179 Magnetic attachment method for LED light engines
12/05/2006US7145177 Light emitting device
12/05/2006US7145176 Active matrix display device
12/05/2006US7145175 Semiconductor circuit and method of fabricating the same
12/05/2006US7145173 Semiconductor integrated circuit
12/05/2006US7145172 Thin film transistor array substrate
12/05/2006US7145171 Probe unit and its manufacturing method
12/05/2006US7145169 Field-effect transistor, semiconductor device, and photo relay
12/05/2006US7145168 Semiconductor device
12/05/2006US7145167 High speed Ge channel heterostructures for field effect devices
12/05/2006US7145156 Image processing method, image processing apparatus and semiconductor manufacturing method
12/05/2006US7145152 Storage capacitor design for a solid state imager
12/05/2006US7145140 Method of determining whether a conductive layer of a semiconductor device is exposed through a contact hold
12/05/2006US7145120 Guided heating apparatus and method for using the same
12/05/2006US7145106 Heater module for semiconductor manufacturing equipment
12/05/2006US7145104 Silicon layer for uniformizing temperature during photo-annealing
12/05/2006US7144970 comprises dielectric polyarylene ethers; for use with multilayer semiconductors; heat/crack resistance
12/05/2006US7144968 Silicon-containing polymer, process for its production, resist composition employing it, pattern-forming method and electronic device fabrication method
12/05/2006US7144848 Cleaning compositions containing hydroxylamine derivatives and processes using same for residue removal
12/05/2006US7144829 Method for fabricating semiconductor device and semiconductor substrate
12/05/2006US7144828 He treatment to improve low-k adhesion property
12/05/2006US7144827 film dielectric itself is photopatternable like photoresist which eliminates several processing steps; hydrolysis and condensation of a fluoralkoxy-trihalosilane; inorganic backbone of silicon oxide three dimensional network with fluoro-organic substituents; low dielectric constant, direct patternabilit
12/05/2006US7144826 Method and apparatus for the production of process gas that includes water vapor and hydrogen formed by burning oxygen in a hydrogen-rich environment
12/05/2006US7144825 Multi-layer dielectric containing diffusion barrier material
12/05/2006US7144824 Method for controlling the properties of DARC and manufacturing DARC
12/05/2006US7144823 Thermal treatment apparatus
12/05/2006US7144822 High density plasma process for optimum film quality and electrical results
12/05/2006US7144820 Method of manufacturing a layer sequence and a method of manufacturing an integrated circuit
12/05/2006US7144819 Method for manufacturing a semiconductor device
12/05/2006US7144818 Semiconductor substrate and processes therefor
12/05/2006US7144817 For forming an opening in resin layer (polyimide) on the surface of a metal wiring of a flexible wiring board without toxic solvent
12/05/2006US7144816 Polysilicon opening polish
12/05/2006US7144815 Chemical mechanical polishing slurry
12/05/2006US7144814 Abrasive composition for the integrated circuits electronics industry
12/05/2006US7144813 Method and apparatus for thermally processing microelectronic workpieces
12/05/2006US7144812 Method of forming copper wire
12/05/2006US7144811 Method of forming a protective layer over Cu filled semiconductor features
12/05/2006US7144810 Methods for forming rough ruthenium-containing layers and structures/methods using same
12/05/2006US7144809 thin metal films by atomic layer deposition: tungsten nucleation layer over a silicon wafer; copper film from CuCl and triethylboron; vapor phase pulses in inert gas
12/05/2006US7144808 Integration flow to prevent delamination from copper
12/05/2006US7144807 Low resistivity titanium silicide on heavily doped semiconductor
12/05/2006US7144806 ALD of tantalum using a hydride reducing agent
12/05/2006US7144805 Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density
12/05/2006US7144804 Semiconductor device and method of manufacturing the same
12/05/2006US7144803 Methods of forming boron carbo-nitride layers for integrated circuit devices
12/05/2006US7144802 Vapor deposition of benzotriazole (BTA) for protecting copper interconnects
12/05/2006US7144801 Bumping process to increase bump height
12/05/2006US7144800 Multichip packages with exposed dice
12/05/2006US7144799 Method for pre-retaining CB opening
12/05/2006US7144798 Semiconductor memory devices having extending contact pads and related methods
12/05/2006US7144797 Semiconductor device having multiple-zone junction termination extension, and method for fabricating the same
12/05/2006US7144796 Method of fabricating semiconductor components through implantation and diffusion in a semiconductor substrate
12/05/2006US7144795 Method for forming a depletion-mode transistor that eliminates the need to separately set the threshold voltage of the depletion-mode transistor
12/05/2006US7144794 Ion source, ion implanting device, and manufacturing method of semiconductor devices
12/05/2006US7144793 Method of producing crystalline semiconductor material and method of fabricating semiconductor device
12/05/2006US7144792 Method and apparatus for fabricating and connecting a semiconductor power switching device
12/05/2006US7144791 Lamination through a mask