Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
11/2006
11/30/2006WO2006126776A1 Antireflective hardmask composition and methods for using same
11/30/2006WO2006126761A1 Adhesive film for semiconductor
11/30/2006WO2006126728A1 Semiconductor device
11/30/2006WO2006126726A1 Semiconductor device and method for manufacturing same
11/30/2006WO2006126598A1 Method for continuously depositing high resistance buffer layer/window layer (transparent conductive film) of cis based thin film solar cell and continuous film deposition equipment for carrying out that method
11/30/2006WO2006126586A1 Circuit substrate connection structure and circuit substrate connection method
11/30/2006WO2006126583A1 Etchant for substrates having bpsg and sod layers
11/30/2006WO2006126576A1 Micro region imaging device and micro region imaging method
11/30/2006WO2006126569A1 Exposure method and lithography system
11/30/2006WO2006126536A1 Semiconductor device and method for fabricating the same
11/30/2006WO2006126522A1 Exposure method, exposure apparatus and device manufacturing method
11/30/2006WO2006126503A1 Electrostatic chuck
11/30/2006WO2006126460A1 Active matrix substrate, display device, and pixel defect correcting method
11/30/2006WO2006126444A1 Sensor calibration method, exposure method, exposure device, device fabrication method, and reflection type mask
11/30/2006WO2006126440A1 Method of film formation and computer-readable storage medium
11/30/2006WO2006126433A1 Positive resist composition and method for forming resist pattern
11/30/2006WO2006126432A1 Polishing composition for silicon wafer
11/30/2006WO2006126420A1 Method for detecting polishing end in cmp polishing device, cmp polishing device, and semiconductor device manufacturing method
11/30/2006WO2006126406A1 Polysilane compound-containing lower layer film forming composition for lithography
11/30/2006WO2006126363A1 Electrode for organic transistor, organic transistor, and semiconductor device
11/30/2006WO2006126361A1 Method of forming solder bump and method of mounting semiconductor device
11/30/2006WO2006126330A1 METHOD FOR GROWTH OF GaN SINGLE CRYSTAL, METHOD FOR PREPARATION OF GaN SUBSTRATE, PROCESS FOR PRODUCING GaN-BASED ELEMENT, AND GaN-BASED ELEMENT
11/30/2006WO2006126329A1 Positive photoresist composition, thick layered photoresist, process for producing thick resist pattern, and process for producing connecting terminal
11/30/2006WO2006126323A1 Semiconductor device, method for manufacturing such semiconductor device, and liquid crystal display device
11/30/2006WO2006126319A1 High-electron-mobility transistor, field-effect transistor, epitaxial substrate, method for manufacturing epitaxial substrate, and method for manufacturing group iii nitride transistor
11/30/2006WO2006126305A1 Modified polyurethane resin and adhesive composition using the same, method for connecting circuit member and connection structure of circuit member
11/30/2006WO2006126252A1 Mounting structure for ic tag and ic chip for mounting purpose
11/30/2006WO2006126245A1 Semiconductor device and method for manufacturing same
11/30/2006WO2006126218A1 Vacuum system for wafer handling
11/30/2006WO2006125993A1 Semiconductor device and method of manufacture
11/30/2006WO2006125744A1 Device and method for liquid treatment of wafer-shaped articles
11/30/2006WO2006125559A1 Device for the separation of substrates from a stack
11/30/2006WO2006125462A1 Cleaning solution for a semiconductor wafer
11/30/2006WO2006125461A1 Treatment solution and method of applying a passivating layer
11/30/2006WO2006125313A1 Method for preparing nanocrystalline silicon in sio2 and freestanding silicon nanoparticles
11/30/2006WO2006125272A1 Resonant defect enhancement of current transport in semiconducting superlattices
11/30/2006WO2006108007A3 Method for polysilicon-1 definition of flash memory device
11/30/2006WO2006094040A3 A method for pattern metalization of substrates
11/30/2006WO2006088689A3 Method for patterning submicron pillars
11/30/2006WO2006081304A3 Boron-doped diamond semiconductor
11/30/2006WO2006072871A3 Method for producing mixed stacked structures, different insulating areas and/or localised vertical electrical conducting areas
11/30/2006WO2006065776A3 Process sequence for doped silicon fill of deep trenches
11/30/2006WO2006057645A3 Enhancement of electron and hole mobilities in 110 under biaxial compressive strain
11/30/2006WO2006044745A3 Methods of optimization of implant conditions to minimize channeling and structures formed thereby
11/30/2006WO2006033681A3 Receiver circuit using nanotube-based switches and logic
11/30/2006WO2006023501A3 Direct liquid injection system and method for forming multi-component dielectric films
11/30/2006WO2005098084A3 Systems and methods for synthesis of extended length nanostructures
11/30/2006WO2004094702A3 Multi-chemistry plating system
11/30/2006US20060271907 Semiconductor circuit pattern design method for manufacturing semiconductor device or liquid crystal display device
11/30/2006US20060271897 Semiconductor device
11/30/2006US20060271896 Semiconductor device
11/30/2006US20060271221 Manufacturing apparatus, processing method and device manufacturing method
11/30/2006US20060270864 To produce photoresist resist material and pattern forming in a vacuum ultraviolet wavelength region
11/30/2006US20060270792 A polysiloxane with di-/trivinylsilanol end groups; polyhydrogensiloxane, aluminum chelate catalyst; platinum catalyst and tackifier; semiconductor packaging; high bonding strength for thermoplastic resins (polyphthalamide) and liquid crystal polymers and to metal electrodes; transparent; encapsulation
11/30/2006US20060270787 Stability to moisture and oxygen; organohydrosiloxanes stabilized with one or more antioxidant compounds such as 3-methoxyphenol, 2-methoxyphenol, 4-ethoxyphenol, 4-propoxyphenol, 4-butoxyphenol
11/30/2006US20060270575 Cleaning solution and cleaning method of a semiconductor device
11/30/2006US20060270574 Photoresist stripping agent
11/30/2006US20060270573 Cleaning solution for substrate for semiconductor device and cleaning method
11/30/2006US20060270328 Method of producing polishing cloth
11/30/2006US20060270325 Polishing pad and chemical mechanical polishing apparatus using the same
11/30/2006US20060270323 Polishing apparatus
11/30/2006US20060270265 Insert and electronic component handling apparatus provided with the same
11/30/2006US20060270249 Semiconductor device and method of fabricating the same
11/30/2006US20060270248 Solvent Management Methods for Gel Production
11/30/2006US20060270247 Hi-k dielectric layer deposition methods
11/30/2006US20060270246 Method of manufacturing a semiconductor device
11/30/2006US20060270245 BILAYER CAP STRUCTURE INCLUDING HDP/bHDP FILMS FOR CONDUCTIVE METALLIZATION AND METHOD OF MAKING SAME
11/30/2006US20060270244 Method of fabricating a structure with an oxide layer of a desired thickness on a Ge or SiGe substrate
11/30/2006US20060270243 Alignment shield for evaporator used in thin film deposition
11/30/2006US20060270242 Cleaning method and solution for cleaning a wafer in a single wafer process
11/30/2006US20060270241 Method of removing a photoresist pattern and method of manufacturing a semiconductor device using the same
11/30/2006US20060270240 Protection in integrated circuits
11/30/2006US20060270239 Reverse ALD
11/30/2006US20060270238 Semiconductor device and method for manufacturing the same
11/30/2006US20060270237 Apparatus and method for pre-conditioning CMP polishing pad
11/30/2006US20060270236 Semiconductor device and manufacturing method thereof
11/30/2006US20060270235 Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers
11/30/2006US20060270234 Method and composition for preparing a semiconductor surface for deposition of a barrier material
11/30/2006US20060270233 Vapor deposition of benzotriazole (BTA) for protecting copper interconnects
11/30/2006US20060270232 Copper foil surface treatment step of forming an oxide film on surface of copper foil, a laser via machining step, an alkali treatment step, a molten and scattered copper etching step, a de-smearing treatment after the molten and scattered copper etching
11/30/2006US20060270231 Systems and methods for removing wafer edge residue and debris using a residue remover mechanism
11/30/2006US20060270230 Critical dimension control for integrated circuits
11/30/2006US20060270229 Anodized aluminum oxide nanoporous template and associated method of fabrication
11/30/2006US20060270228 Method of forming metal pattern using selective electroplating process
11/30/2006US20060270227 Hillock reduction in copper films
11/30/2006US20060270226 Reflective mask blank, reflective mask, and method for manufacturing semiconductor device
11/30/2006US20060270225 Silicon carbide semiconductor device fabrication method
11/30/2006US20060270224 Methods for forming metal-silicon layer using a silicon cap layer
11/30/2006US20060270223 Systems and methods for forming metal-containing layers using vapor deposition processes
11/30/2006US20060270222 Method of Depositing CVD Thin Film
11/30/2006US20060270221 Heated gas feedthrough for cvd chambers
11/30/2006US20060270220 Plasma processing apparatus and method
11/30/2006US20060270219 Reducing stress in coatings produced by physical vapour deposition technical field
11/30/2006US20060270218 Method of forming contact plug in semiconductor device
11/30/2006US20060270217 Integration process for fabricating stressed transistor structure
11/30/2006US20060270216 Phase change memory cell defined by a pattern shrink material process
11/30/2006US20060270215 Semiconductor device and method of manufacturing the same
11/30/2006US20060270214 Semiconductor device and method for fabricating the same
11/30/2006US20060270213 Organic electroluminescenst display panel and manufacturing method therefor
11/30/2006US20060270212 Method of forming bit line of flash memory device