Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2007
06/07/2007US20070126085 Semiconductor device and method of manufacturing the same
06/07/2007US20070126084 Semiconductor device including fuse focus detector, fabrication method thereof and laser repair method using the fuse detector
06/07/2007US20070126082 Bipolar transistor, semiconductor apparatus having the bipolar transistor, and methods for manufacturing them
06/07/2007US20070126079 Nano-wire capacitor and circuit device therewith
06/07/2007US20070126076 Semiconductor optical devices and method for forming
06/07/2007US20070126075 Method for packaging semiconductor device and package structure thereof
06/07/2007US20070126072 Surface acoustic wave pressure sensors
06/07/2007US20070126071 Process for manufacturing thick suspended structures of semiconductor material
06/07/2007US20070126068 Microcomponent comprising a hermetically-sealed cavity and a plug, and method of producing one such microcomponent
06/07/2007US20070126067 Angled implantation for removal of thin film layers
06/07/2007US20070126063 Semiconductor device and semiconductor device manufacturing method
06/07/2007US20070126062 Semiconductor device and manufacturing method thereof
06/07/2007US20070126044 Circuit device having capacitor and field effect transistor, and display apparatus therewith
06/07/2007US20070126041 Dielectric film capacitor and method of manufacturing the same
06/07/2007US20070126035 Field-effect microelectronic device, capable of forming one or several transistor channels
06/07/2007US20070126034 Semiconductor substrate, semiconductor device and process for producing semiconductor substrate
06/07/2007US20070126029 Integrated circuit devices having fuse structures including buffer layers
06/07/2007US20070126023 Growth of reduced dislocation density non-polar gallium nitride
06/07/2007US20070126014 Light-emitting element with heterojunction structure
06/07/2007US20070126013 Light emitting device and method for fabricating the same
06/07/2007US20070126009 Group-III nitride semiconductor device
06/07/2007US20070126005 Thin film transistor array panels for a liquid crystal display and a method for manufacturing the same
06/07/2007US20070126003 Thin Film Transistor, Display Device and Their Production
06/07/2007US20070125996 Crystal firm, crystal substrate, and semiconductor device
06/07/2007US20070125956 Particle-optical projection system
06/07/2007US20070125750 Method for removing post-etch residue from wafer surface
06/07/2007US20070125749 Apparatus and method for removing protective film on article
06/07/2007US20070125748 Method for controlling a thickness of a first layer and method for adjusting the thickness of different first layers
06/07/2007US20070125747 Process for polishing glass substrate
06/07/2007US20070125645 Sputtering target with few surface defects, and surface processing method thereof
06/07/2007US20070125494 Method and apparatus for an improved bellows shield in a plasma processing system
06/07/2007US20070125491 Method of removing particle on substrate, apparatus therefor, and coating and development apparatus
06/07/2007US20070125423 Liquid supply method and apparatus
06/07/2007US20070125160 Short and thin silicon cantilever with tip and fabrication thereof
06/07/2007US20070124932 Probe with trapezoidal contactor and device based on application thereof, and method of producing them
06/07/2007US20070124928 Circuit substrates, semiconductor devices, semiconductor manufacturing apparatuses, methods for manufacturing circuit substrates, and methods for manufacturing semiconductor devices
06/07/2007US20070124926 Circuit board and method for manufacturing the same
06/06/2007EP1793429A1 Semiconductor light emitting device having a reflection layer comprising silver
06/06/2007EP1793428A1 Semiconductor light emitting device having reflection layers comprising silver with improved ohmic contact
06/06/2007EP1793426A2 Semiconductor device having a via hole and its manufacturing method
06/06/2007EP1793421A2 Semiconductor device, substrate for mounting a semiconductor chip, process for their production, adhesive, and double-sided adhesive film
06/06/2007EP1793420A2 Attaching and removing unit of lid for wafer carrier
06/06/2007EP1793419A1 Method and system for processing frozen adhesive particles
06/06/2007EP1793418A1 Etching method and system
06/06/2007EP1793417A1 Substrate cleaning method and developing apparatus
06/06/2007EP1793416A2 Capacitor and method for manufacturing the same
06/06/2007EP1793415A1 Apparatus and Method of separating a semiconductor wafer from a support
06/06/2007EP1793414A1 Configurable die detachment apparatus
06/06/2007EP1793413A1 Heating device of the light irradiation type
06/06/2007EP1793400A2 Method of forming MRAM devices
06/06/2007EP1793274A2 Resist pattern thickening material and process for forming resist pattern, and semiconductor device and method for manufacturing the same
06/06/2007EP1793267A1 Stacked storage capacitor structure for a LTPS TFT-LCD
06/06/2007EP1793021A2 Method for semiconductor processing using silicon carbide article
06/06/2007EP1793017A1 Plating apparatus and plating liquid removing method
06/06/2007EP1792872A2 Method for producing nanowires using a porous template
06/06/2007EP1792348A1 Method for application of a zinc sulphide buffer layer to a semiconductor substrate by means of chemical bath deposition in particular on the absorber layer of a chalcopyrite thin-film solar cell
06/06/2007EP1792346A2 High-mobility bulk silicon pfet
06/06/2007EP1792345A1 A sonos memory device with optimized shallow trench isolation
06/06/2007EP1792343A2 Formation of metal-insulator metal capacitor simultaneously with aluminum metal wiring level using a hardmask
06/06/2007EP1792342A1 Semiconductor device and voltage regulator using the semiconductor device
06/06/2007EP1792341A1 Methods for forming interconnects in vias and microelectronic workpieces including such interconnects
06/06/2007EP1792340A1 Semiconductor-insulator-semiconductor structure for high speed applications
06/06/2007EP1792339A1 Method for obtaining a thin layer by implementing co-implantation and subsequent implantation
06/06/2007EP1792338A1 Thin layer transfer method wherein a co-implantation step is performed according to conditions avoiding blisters formation and limiting roughness
06/06/2007EP1792337A1 Transfer method with a treatment of a surface to be bonded
06/06/2007EP1792336A2 Programming and erasing structure for a floating gate memory cell and method of making
06/06/2007EP1792335A2 Semiconductor devices and methods of manufacture thereof
06/06/2007EP1792334A1 A method of evaluating characteristics of and forming of an insulating film for a semiconductor device
06/06/2007EP1792333A1 Formation of lattice-tuning semiconductor substrates
06/06/2007EP1792332A1 An electro-optic fibre or filament
06/06/2007EP1792331A1 Substrate processing system
06/06/2007EP1792330A1 A polishing pad and method of producing the same
06/06/2007EP1791799A1 Method for purifying silicon carbide structures
06/06/2007EP1638732A4 Methods and systems for processing microfeature workpieces with flow agitators and/or multiple electrodes
06/06/2007EP1575056B1 Non-volatile memory and write method thereof
06/06/2007EP1568076A4 Composite leadframe led package and method of making the same
06/06/2007EP1560890B1 Cmp method utilizing amphiphilic non-ionic surfactants
06/06/2007EP1556867B1 Self-aligned 2-bit "double poly cmp" flash memory cell
06/06/2007EP1552735A4 Heat sink made from longer and shorter graphite sheets
06/06/2007EP1552727A4 Inductively coupled plasma generator having lower aspect ratio
06/06/2007EP1478976A4 Critical dimension control using full phase and trim masks
06/06/2007EP1410429A4 Electromechanical memory array using nanotube ribbons and method for making same
06/06/2007EP1325516A4 Integrating metal with ultra low-k dielectrics
06/06/2007EP1319197B1 Antireflective composition
06/06/2007EP1282486A4 Self teaching robotic wafer handling system
06/06/2007EP1075652A4 A system and method for inspecting semiconductor wafers
06/06/2007EP1029359A4 Quantum ridges and tips
06/06/2007EP0760165B1 Electronic device comprising means for compensating an undesired capacitance
06/06/2007DE112005001676T5 Verfahren und System zum Charakterisieren von porösen Materialien A method and system for characterizing porous materials
06/06/2007DE112005001413T5 Poröse Keramikmaterialien als low-k dielektrische Schichten bei Halbleiterbauelementen Porous ceramic materials as low-k dielectric films in semiconductor devices
06/06/2007DE10348281B4 Vakuum-Behandlungsanlage für ebene rechteckige oder quadratische Substrate Vacuum treatment installation for flat rectangular or square substrates
06/06/2007DE10303925B4 Dielektrische Barrierenschicht für eine Kupfermetallisierungsschicht mit einer über die Dicke hinweg variierenden Siliziumkonzentration und Verfahren zu deren Herstellung Dielectric barrier layer for a copper metallization with a varying across the thickness of silicon concentration, and process for their preparation
06/06/2007DE10219398B4 Herstellungsverfahren für eine Grabenanordnung mit Gräben unterschiedlicher Tiefe in einem Halbleitersubstrat Manufacturing method of a grave arrangement with trenches of different depths in a semiconductor substrate
06/06/2007DE10201781B4 Hochfrequenz-Leistungsbauteil und Hochfrequenz-Leistungsmodul sowie Verfahren zur Herstellung derselben Radio frequency power device and high-frequency power module and method of producing same
06/06/2007DE102007006150A1 Method of producing a semiconductor wafer from a single crystal does not etch between lapping and smooth grinding stages and does not polish back side of the wafer
06/06/2007DE102006055131A1 Semiconductor component for power uses has super blocking arrangement having alternating first and second type dopant layers between substrate and channel
06/06/2007DE102006054735A1 Elektrische Kontakteinrichtung und elektrische Prüfvorrichtung für die Prüfung eines elektrischen Prüflings Electrical contact means and electrical test equipment for testing an electrical device under test
06/06/2007DE102006054734A1 Elektrische Prüfvorrichtung für die Prüfung eines elektrischen Prüflings sowie entsprechendes Verfahren Electrical test equipment for testing a device under test electrical and corresponding method
06/06/2007DE102006053596A1 Trennfolienrahmen Release film frame
06/06/2007DE102006051151A1 Verfahren zum Bilden von Mehrschicht-Bumps auf einem Substrat A method for forming multi-layer bumps on a substrate