Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2007
06/06/2007CN1975998A Static cupule for vacuum processing device, vacuum processing device with the same, and its manufacturing method
06/06/2007CN1975997A Method for determining position of semiconductor wafer, and apparatus using the same
06/06/2007CN1975996A Methods and apparatus for transferring substrates during electronic device manufacturing
06/06/2007CN1975995A Device and method for transmitting single cut unit to collector
06/06/2007CN1975994A Method of detecting defect evoked by processing image
06/06/2007CN1975993A Method of making semiconductor package having exposed heat spreader
06/06/2007CN1975992A Semiconductor device fabrication method and electronic device fabrication method
06/06/2007CN1975991A Method for manufacturing semiconductor device
06/06/2007CN1975990A Semiconductor device and method of forming the same
06/06/2007CN1975989A Method of manufacturing semiconductor device using polycrystalline silicon annealed by solid-state laser
06/06/2007CN1975988A 电阻器元件及其制造方法 A resistor element and its manufacturing method
06/06/2007CN1975987A Filament lamp
06/06/2007CN1975986A Filming method and device
06/06/2007CN1975985A Apparatus and methods for a substrate carrier having an inflatable seal
06/06/2007CN1975984A Configurable die detachment apparatus
06/06/2007CN1975983A Substrate processing device, substrate processing method and substrate manufacture method
06/06/2007CN1975982A Method for making double-side technology
06/06/2007CN1975946A Process of forming variable capacitor
06/06/2007CN1975944A Thin-film laminate, and electronic parts
06/06/2007CN1975741A System and method for product yield prediction
06/06/2007CN1975585A Substrate processing method and substrate processing apparatus
06/06/2007CN1975584A Structure, system and method for analyzing dimensionally unstable layer for forming pattern
06/06/2007CN1975583A Method and system to restore transverse magnetic wave contrast in lithographic processing
06/06/2007CN1975582A Lithographic apparatus and device manufacturing method
06/06/2007CN1975581A Radiation system and lithographic apparatus
06/06/2007CN1975580A System and method to increase surface tension and contact angle in immersion lithography
06/06/2007CN1975579A Lithographic apparatus and device manufacturing method that compensates for reticle induced CDU
06/06/2007CN1975578A Coating and developing system and coating and developing method
06/06/2007CN1975577A 光敏组合物 The photosensitive composition
06/06/2007CN1975571A Resist pattern thickening material and process for forming resist pattern, and semiconductor device and method for manufacturing the same
06/06/2007CN1975570A Substrate for pattern forming, negative-tone photoresist composition, method of forming resist pattern, and semiconductor device
06/06/2007CN1975568A Pattern forming method using photomask
06/06/2007CN1975567A Phase shift mask
06/06/2007CN1975544A Method for producing liquid crystal display device substrate
06/06/2007CN1975543A Picture element array structure of liquid crystal display and producing method thereof
06/06/2007CN1975517A Display substrate, method of manufacturing the same and display panel having the same
06/06/2007CN1975449A Method and an integrated circuit for performing a test
06/06/2007CN1975448A Thermoelectric power generating component performance measuring device and method thereof
06/06/2007CN1975439A Probe card transfer assist apparatus and inspection equipment using same
06/06/2007CN1975345A Test method of microsctructure body and micromachine
06/06/2007CN1975277A Fan filter unit control system
06/06/2007CN1974697A Organic anti-reflective coating polymer, anti-reflective coating composition and method of preparation thereof
06/06/2007CN1974636A Chemical mechanical polishing method and pulp, and method of manufacturing semiconductor device
06/06/2007CN1974472A Composition for thin-film capacitive device, insulating film, thin-film capacitive device, and capacitor
06/06/2007CN1974459A Solution recovery system
06/06/2007CN1974168A 切削装置 Cutting device
06/06/2007CN1974165A Process to separate pieces from a substrate
06/06/2007CN1974129A Polishing method
06/06/2007CN1974124A Voltage mode current control method and system
06/06/2007CN1974104A Laser beam processing machine
06/06/2007CN1974028A Apparatus and method for substrate coating
06/06/2007CN1320847C Liquid crystal polymers for flexible circuits
06/06/2007CN1320846C Circuit board and its manufacturing method
06/06/2007CN1320736C Power generator, semiconductor and method for forming power generator
06/06/2007CN1320712C Semiconductor laser device and manufacturing method therefor
06/06/2007CN1320661C Semiconductor device and manufacturing method thereof
06/06/2007CN1320660C Follower, digital memory module and SRAM
06/06/2007CN1320659C Chip with covered silicon on multi-aspect insulating layer and its making method
06/06/2007CN1320658C Semiconductor structure with mesa isolation and recess resistant regions and its making method
06/06/2007CN1320657C Soi device with different silicon thicknesses
06/06/2007CN1320656C Capacitor and method of manufacture
06/06/2007CN1320655C Nonvolatile semiconductor memory and method for manufacturing same
06/06/2007CN1320654C Semiconductor device having multiple silicide types and a method for its fabrication
06/06/2007CN1320653C Semiconductor IC device
06/06/2007CN1320651C Chip with a plurality of internal functional blocks and method for power supply and noise reduction
06/06/2007CN1320650C Semiconductor device, system device using it, and manufacturing method of a semiconductor device
06/06/2007CN1320646C 半导体器件 Semiconductor devices
06/06/2007CN1320645C Semiconductor device and its making method
06/06/2007CN1320644C Wafer grade package, multiple package overlapping and its producing method
06/06/2007CN1320642C Method and structure for self healing cracks in under-fill material between an I/C chip and a substrate bonded together with solder balls
06/06/2007CN1320641C Methods for forming spacing layer and finfets field effect trabsistor
06/06/2007CN1320640C 半导体晶片 Semiconductor wafer
06/06/2007CN1320639C Hard mask process for memory device without bitline shorts
06/06/2007CN1320638C Semiconductor substrate, semiconductor circuits formed therein and manufacture thereof
06/06/2007CN1320637C Method for integration of silicide contacts and silicide gate metals
06/06/2007CN1320636C High performance semiconductor devices fabricated with strain-induced processes and methods for making same
06/06/2007CN1320635C Method for making device with transistors of different types
06/06/2007CN1320634C Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
06/06/2007CN1320633C Structure and producing method of back-fuse type memory assembly
06/06/2007CN1320632C Method of forming a catalyst containing layer over a patterned dielectric
06/06/2007CN1320631C Method for fabricating semiconductor device by forming damascene interconnections
06/06/2007CN1320630C Method of using ternary copper alloy to obtain a low resistance and large grain size interconnect
06/06/2007CN1320629C Method for repairing plasma damage after integrated circuit device forming isolator
06/06/2007CN1320628C Semiconductor device with tensile strain silicon introduced by compressive material in a buried oxide layer and its forming method
06/06/2007CN1320627C Decoupling of actuators for positioning an object
06/06/2007CN1320626C Receiving container body for object to be processed
06/06/2007CN1320625C Open wafer box before prevention of outgassing pollution and method for preventing outgassing pollution
06/06/2007CN1320624C Cluster tool and method for controlling transport
06/06/2007CN1320623C Method and apparatus for quantitatively quality checking of chip-like substrates
06/06/2007CN1320622C Semiconductor element and system, wafers, its use and measuring method
06/06/2007CN1320621C Delay time insertion based on event testing system
06/06/2007CN1320620C Semiconductor device and producing method thereof
06/06/2007CN1320619C Method for producing semiconductor and heat-resisting pressure-sensitive adhesive tape
06/06/2007CN1320618C Resin solidifying system
06/06/2007CN1320617C Semiconductor device chip scale surface assembling and packaging, and manufacturing method therefor
06/06/2007CN1320616C Surface passivation method for nuclear detector tellurium-zinc-cadmium wafer
06/06/2007CN1320615C Manufacturing method of semiconductor device
06/06/2007CN1320614C Composite spacer liner for improving transistor performance
06/06/2007CN1320613C Self-aligned compact bipolar junction transistor layout and method of making same
06/06/2007CN1320612C Schottky shielding diode with low straightforward voltage drop and its producing method
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