Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2007
07/12/2007US20070161178 Cylindrical capacitor and method of fabricating the same
07/12/2007US20070161177 Semiconductor device having increased capacitance of capacitor for data storage and method of manufacturing semiconductor device
07/12/2007US20070161176 Method for producing a planar spacer, an associated bipolar transistor and an associated bicmos circuit arrangement
07/12/2007US20070161175 Method for forming a gate insulating layer of a semiconductor device
07/12/2007US20070161174 Manufacturing of memory array and periphery
07/12/2007US20070161173 Process to integrate fabrication of bipolar devices into a CMOS process flow
07/12/2007US20070161172 Method for fabricating a recessed-gate mos transistor device
07/12/2007US20070161171 Process for forming an electronic device including a fin-type structure
07/12/2007US20070161170 Transistor with immersed contacts and methods of forming thereof
07/12/2007US20070161169 Field effect transistors with dielectric source drain halo regions and reduced miller capacitance
07/12/2007US20070161168 Method for fabricating a semiconductor device having a multi-bridge-channel
07/12/2007US20070161167 Fabrication method of display device
07/12/2007US20070161166 Method for manufacturing a semiconductor device
07/12/2007US20070161165 Systems and methods involving thin film transistors
07/12/2007US20070161164 Method of Manufacturing Semiconductor Device
07/12/2007US20070161163 Manufacturing method of thin-film transistor, thin-film transistor sheet, and electric circuit
07/12/2007US20070161162 Three-dimensional TFT nanocrystal memory device
07/12/2007US20070161161 Staggered source/drain and thin-channel TFT structure and fabrication method thereof
07/12/2007US20070161160 Structure of thin film transistor array and method for fabricating the same
07/12/2007US20070161159 Method for manufacturing thin film integrated circuit, and element substrate
07/12/2007US20070161158 Method for wafer level packaging and fabricating cap structures
07/12/2007US20070161157 Semiconductor device package and method for manufacturing same
07/12/2007US20070161156 Semiconductor device and method of manufacturing the same
07/12/2007US20070161155 Wafer level chip scale packaging structure
07/12/2007US20070161154 Manufacturing method for electronic device
07/12/2007US20070161153 Method for fabricating a flip chip system in package
07/12/2007US20070161152 Method for fabricating semiconductor device and apparatus for fabricating the same
07/12/2007US20070161151 Packaged semiconductor device with dual exposed surfaces and method of manufacturing
07/12/2007US20070161150 Forming ultra dense 3-D interconnect structures
07/12/2007US20070161148 Manufacturing CCDS in a conventional CMOS process
07/12/2007US20070161147 Method of manufacturing CMOS image sensor
07/12/2007US20070161146 Method for Manufacturing Image Sensor
07/12/2007US20070161145 Device for subtracting or adding charge in a charge-coupled device
07/12/2007US20070161144 Method for Manufacturing CMOS Image Sensor
07/12/2007US20070161143 Method of manufacturing a complementary metal oxide silicon image sensor
07/12/2007US20070161142 Method and apparatus for providing an integrated circuit having P and N doped gates
07/12/2007US20070161141 Shielding Layer outside the Pixel Regions of Optical Device and Method for Making the Same
07/12/2007US20070161140 Image sensor and method of manufacturing the same
07/12/2007US20070161139 Method for Singulating A Released Microelectromechanical System Wafer
07/12/2007US20070161138 Method for making an electronic device including a poled superlattice having a net electrical dipole moment
07/12/2007US20070161137 Methods of manufacturing light emitting diodes including barrier layers/sublayers
07/12/2007US20070161136 Pixel structure and the fabricating method thereof
07/12/2007US20070161135 Method for coating semiconductor device using droplet deposition
07/12/2007US20070161134 Method of using nanoparticles to fabricate an emitting layer of an optical communication light source on a substrate
07/12/2007US20070161133 Method for implanting carbon nanotube
07/12/2007US20070161132 System and Method for Detection of Spatial Signature Yield Loss
07/12/2007US20070161131 Measurement method for low-k material
07/12/2007US20070161130 Method for manufacturing semiconductor device, semiconductor inspection device, and program
07/12/2007US20070161129 Semiconductor device and manufacturing process thereof
07/12/2007US20070161128 Semiconductor device manufacturing apparatus and semiconductor device manufacturing method
07/12/2007US20070161127 Method for forming MRAM bit having a bottom sense layer utilizing electroless plating
07/12/2007US20070161126 Ferroelectric capacitor and method for fabricating the same
07/12/2007US20070160936 Adhesion method using gray-scale photolithography
07/12/2007US20070160932 Electron beam lithography apparatus
07/12/2007US20070160927 Radiation-sensitive resin composition, process for producing the same and process for producing semiconductor device therewith
07/12/2007US20070160918 irradiating illumination light onto a mask to transfer (offset) mask patterns to a semiconductor substrate; narrow spacing; reduce the dimensional variation of the outmost pattern
07/12/2007US20070160846 Irradiating a thermotropic liquid crystal polymer exhibiting optical anisotropy and having a melting point of 250-350 degrees C. with a pulsed laser to evaporate the polymer, and depositing and solidifying the evaporant on a surface; protects organic electronic device from oxygen and moisture
07/12/2007US20070160838 Semiconductor nanocrystal and outer layer including oligomeric polydentate ligand bound to nanocrystal by three or more donor groups, each group independently selected from P, N, P .dbd. O, and N .dbd. O, where each monomeric unit includes donor groups, linking groups, and functional groups; luminescence
07/12/2007US20070160774 Method for producing silicon nitride films and silicon oxynitride films by chemical vapor deposition
07/12/2007US20070160762 forming a patterned thin film structure on a substrate is disclosed. A pattern is printed with a material, such as a masking coating or an ink, on the substrate, the pattern being such that, in one embodiment, the desired thin film structures will be formed in the areas where the printed material
07/12/2007US20070160757 Processing method
07/12/2007US20070160747 Method for fabricating an inorganic nanocomposite
07/12/2007US20070160448 Receipt and delivery control system for front opening unified and reticle storage pods
07/12/2007US20070160447 Semiconductor treating device
07/12/2007US20070160099 Multiple anneal induced disordering
07/12/2007US20070159901 Semiconductor Integrated circuit device
07/12/2007US20070159874 Semiconductor memory device
07/12/2007US20070159610 Exposure apparatus, device manufacturing method, maintenance method, and exposure method
07/12/2007US20070159609 Exposure apparatus and device manufacturing method
07/12/2007US20070159608 Exposure apparatus and device manufacturing method
07/12/2007US20070159583 Electro-optical device
07/12/2007US20070159568 Liquid crystal display device and fabrication method thereof
07/12/2007US20070159545 Managed memory component
07/12/2007US20070159353 Film-like article and method for manufacturing the same
07/12/2007US20070159335 Semiconductor device
07/12/2007US20070159244 Gain control methods and systems in an amplifier assembly
07/12/2007US20070159154 Voltage regulator circuit arrangement
07/12/2007US20070158861 Method for fabricating semiconductor package with build-up layers formed on chip
07/12/2007US20070158853 Device with novel conductive via structure
07/12/2007US20070158852 Circuit Board with Conductive Structure and Method for Fabricating the same
07/12/2007US20070158851 Method to Improve Time Dependent Dielectric Breakdown
07/12/2007US20070158838 Circuit board, method for manufacturing the same, semiconductor device, and method for manufacturing the same
07/12/2007US20070158832 Electronic device and method of manufacturing the same
07/12/2007US20070158831 Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby
07/12/2007US20070158829 Connecting module having passive components
07/12/2007US20070158819 Semiconductor device and a method of manufacturing the same
07/12/2007US20070158817 Semiconductor device
07/12/2007US20070158816 Contact spring application to semiconductor devices
07/12/2007US20070158813 Integrated circuit package-in-package system
07/12/2007US20070158811 Low profile managed memory component
07/12/2007US20070158806 Integrated circuit package system including honeycomb molding
07/12/2007US20070158802 High density memory card system and method
07/12/2007US20070158801 Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates
07/12/2007US20070158798 Wafer with optical control modules in ic fields
07/12/2007US20070158786 Compound semiconductor device and method of producing the same
07/12/2007US20070158784 Semiconductor Device and Manufacturing Method Thereof
07/12/2007US20070158777 High voltage field effect device and method
07/12/2007US20070158775 Methods for implementation of a switching function in a microscale device and for fabrication of a microscale switch
07/12/2007US20070158774 Solid image-pickup device and method for manufacturing the solid image pickup device
07/12/2007US20070158768 Electrical contacts formed of carbon nanotubes