Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2007
07/17/2007US7244326 Transfer assembly for manufacturing electronic devices
07/17/2007US7244315 Microelectronic device drying devices and techniques
07/17/2007US7244311 Heat transfer system for improved semiconductor processing uniformity
07/17/2007US7244310 Over-clocking in a microdeposition control system to improve resolution
07/17/2007US7244308 Method of manufacturing crystal of III-V compound of the nitride system, crystal substrate of III-V compound of the nitride system, crystal film of III-V compound of the nitride system, and method of manufacturing device
07/17/2007US7244168 Methods for reducing delamination during chemical mechanical polishing
07/17/2007US7244091 Robot arm mechanism
07/17/2007US7244088 FOUP door transfer system
07/17/2007US7244086 Apparatus for vacuum treating two dimensionally extended substrates and method for manufacturing such substrates
07/17/2007US7243911 Substrate treating apparatus
07/17/2007US7243776 Loading and extraction of modular belt carriers of electronic components
07/17/2007US7243610 Plasma device and plasma generating method
07/17/2007US7243571 Ultra-precision positioning system
07/17/2007US7243441 Method and apparatus for measuring depth of holes formed on a specimen
07/17/2007US7243421 Electrical connection of components
07/17/2007US7243420 Electronic component mounting method
07/17/2007CA2288758C Optical scanner and image reader for reading images and decoding optical information including one and two dimensional symbologies at variable depth of field
07/12/2007WO2007079500A2 Passivating layer for photovoltaic cells
07/12/2007WO2007079498A2 Passivating layer for flexible electronic devices
07/12/2007WO2007079411A2 Alignment, transportation and integration of nanowires using optical trapping
07/12/2007WO2007079399A2 Packaged semiconductor device with dual exposed surfaces and method of manufacturing
07/12/2007WO2007079372A2 An oxygen enhanced metastable silicon germanium film layer
07/12/2007WO2007079174A2 The fabricating method of single electron transistor (set) by employing nano-lithographical technology in the semiconductor process
07/12/2007WO2007078993A1 Bottom gate thin film transistors
07/12/2007WO2007078957A2 Method and structure for reducing the external resistance of a three-dimensional transistor through use of epitaxial layers
07/12/2007WO2007078892A2 A tensile strained nmos transistor using group iii-n source/drain regions
07/12/2007WO2007078802A2 Epitaxial deposition of doped semiconductor materials
07/12/2007WO2007078798A1 Corona etching
07/12/2007WO2007078790A1 Metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase
07/12/2007WO2007078716A1 Method for advanced solder bumping and system manufactured by said method
07/12/2007WO2007078714A2 Integrated capacitors in package-level structures, processes of making same, and systems containing same
07/12/2007WO2007078694A1 Reciprocating aperture mask system and method
07/12/2007WO2007078686A2 Method of polishing a semiconductor-on-insulator structure
07/12/2007WO2007078650A1 Integration of planar and tri-gate devices on the same substrate
07/12/2007WO2007078627A1 Nanostructure-based package interconnect
07/12/2007WO2007078614A1 Independently programmable memory segment within an nmos electrically erasable programmable read only memory array achived by p-well separation and methods for programming
07/12/2007WO2007078572A2 Apparatus and method for controlling plasma density profile
07/12/2007WO2007078472A1 Wafer level hermetic bond using metal alloy with raised feature
07/12/2007WO2007078407A1 Substrate carrier having an interior lining
07/12/2007WO2007078316A2 Tapered probe structures and fabrication
07/12/2007WO2007078306A1 HIGH K-GATE OXIDE TFTs BUILT ON TRANSPARENT GLASS OR TRANSPARENT FLEXIBLE POLYMER SUBSTRATE
07/12/2007WO2007078148A2 Flip chip mount type of bump, manufacturing method thereof, and bonding method for flip chip using non conductive adhesive
07/12/2007WO2007078065A1 Gallium nitride-based compound semiconductor
07/12/2007WO2007078023A1 Characterization of three-dimensional distribution of defects by x-ray topography
07/12/2007WO2007078011A1 Production method of multilayer interconnection and multilayer interconnection structure
07/12/2007WO2007077992A1 Method for cleaning/drying apparatus for transferring subject to be processed, cleaning/drying apparatus and storing medium
07/12/2007WO2007077926A1 Pattern forming method, pattern forming apparatus, exposure method, exposure apparatus and device manufacturing method
07/12/2007WO2007077925A1 Pattern formation method, pattern formation device, and device fabrication method
07/12/2007WO2007077920A1 Exposure device and fabrication method thereof
07/12/2007WO2007077917A1 Semiconductor device manufacturing method and substrate processing apparatus
07/12/2007WO2007077909A1 Semiconductor device manufacturing method
07/12/2007WO2007077901A1 Exposure system, device manufacturing system, exposure method and device manufacturing method
07/12/2007WO2007077886A1 Metal polishing liquid and method for polishing film to be polished
07/12/2007WO2007077884A1 Wiring structure and electronic device designed according to electronic pulsation and particle durability
07/12/2007WO2007077878A1 Gas pressure control actuator, gas bearing mechanism for the gas pressure control actuator, and minute displacement output device using the gas pressure control actuator
07/12/2007WO2007077877A1 Soldering method, soldering apparatus and method for manufacturing semiconductor device
07/12/2007WO2007077875A1 Exposure apparatus, exposure method, and device production method
07/12/2007WO2007077814A1 Semiconductor device and process for producing the same
07/12/2007WO2007077765A1 Stage apparatus and plasma processing apparatus
07/12/2007WO2007077743A1 Probe card
07/12/2007WO2007077718A1 Substrate treatment method and substrate treatment apparatus
07/12/2007WO2007077688A1 Soldering method and semiconductor module manufacturing method
07/12/2007WO2007077666A1 Field effect transistor, and multilayered epitaxial film for use in preparation of field effect transistor
07/12/2007WO2007077648A1 Thin film field effect transistor and method for manufacturing same
07/12/2007WO2007077623A1 Method for arranging shield line in semiconductor integrated circuit, semiconductor integrated circuit design device, and semiconductor integrated circuit design program
07/12/2007WO2007077598A1 Semiconductor device and process for producing the same
07/12/2007WO2007077540A1 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
07/12/2007WO2007077277A1 Self-supporting, photovoltaic passive refrigerator module
07/12/2007WO2007077194A1 Production of a transistor gate on a multibranch channel structure and means for isolating this gate from the source and drain regions
07/12/2007WO2007077171A2 Method and device for converting metallic precursors into chalcopyrite layers of cigss solar cells
07/12/2007WO2007077125A1 Complementary metal oxide semiconductor
07/12/2007WO2007076922A1 Cleaning of sawn silicon sheets
07/12/2007WO2007076849A1 Monolithic ceramic component and production method
07/12/2007WO2007076791A1 Method for the production of a compound semiconductor field effect transistor comprising a fin structure, and compound semiconductor field effect transistor comprising a fin structure
07/12/2007WO2007076739A2 Coating installation for wafers
07/12/2007WO2007076576A1 Method and structure for a high performance semiconductor device
07/12/2007WO2007061189A3 Occupancy based pattern generation method for maskless lithography
07/12/2007WO2007058845A3 Vertical diode doped with antimony to avoid or limit dopant diffusion
07/12/2007WO2007056014A3 Method of manufacturing flash memory cards
07/12/2007WO2007055863A3 Fine pitch interconnect and method of making
07/12/2007WO2007053383A3 Methods and apparatus for flip-chip-on-lead semiconductor package
07/12/2007WO2007047627A3 Process development and optimization of embedded thin film resistor on body
07/12/2007WO2007047571A3 Integrated cmos-mems technology for wired implantable sensors
07/12/2007WO2007046936A3 P-n junction diode and method of manufacturing the same
07/12/2007WO2007044934A3 Methods for characterizing semiconductor material using optical metrology
07/12/2007WO2007038558A3 Shape memory device
07/12/2007WO2007038365A3 Field-effect semiconductor device including superlattice regions
07/12/2007WO2007036793A3 Power mosfets and methods of making same
07/12/2007WO2007032867A3 Data representation relating to a non-sampled workpiece
07/12/2007WO2007030522B1 Selectivity etch of films with high dielectric constant with h2 addition
07/12/2007WO2007023011B1 Dual port gain cell with side and top gated read transistor
07/12/2007WO2007021520A3 Substrate support for increasing substrate temperature in plasma reactors
07/12/2007WO2007019277A3 Method of forming semiconductor layers on handle substrates
07/12/2007WO2007018678A3 Damage-free ashing process and system for post low-k etch
07/12/2007WO2007016446A3 Dielectric isolated body biasing of silicon on insulator
07/12/2007WO2007005461A3 Exhaust apparatus pressure control system
07/12/2007WO2006118982A3 Semiconductor substrate with exposed upper and lower sides
07/12/2007WO2006091288A3 Method of forming a semiconductor device and an optical device and structure thereof
07/12/2007WO2006081149A3 Novel polishing slurries and abrasive-free solutions having a multifunctional activator
07/12/2007WO2006078920A3 High-speed, precise, laser-based material processing method and system