Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2007
07/17/2007US7245010 System and device including a barrier layer
07/17/2007US7245008 Ball grid array package, stacked semiconductor package and method for manufacturing the same
07/17/2007US7245006 Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication
07/17/2007US7245004 Semiconductor device
07/17/2007US7245002 Semiconductor substrate having a stepped profile
07/17/2007US7245001 Multi-layer integrated circuit package
07/17/2007US7244996 Structure of a field effect transistor having metallic silicide and manufacturing method thereof
07/17/2007US7244994 Laterally diffused metal oxide semiconductor device and method of forming the same
07/17/2007US7244990 Semiconductor device
07/17/2007US7244988 Semiconductor apparatus and method of manufacturing the same
07/17/2007US7244987 NROM flash memory devices on ultrathin silicon
07/17/2007US7244986 Two-bit cell semiconductor memory device
07/17/2007US7244984 Nonvolatile semiconductor memory including two memory cell columns sharing a single bit line
07/17/2007US7244983 Method and device for on-chip decoupling capacitor using nanostructures as bottom electrode
07/17/2007US7244982 Semiconductor device using a conductive film and method of manufacturing the same
07/17/2007US7244980 Line mask defined active areas for 8F2 DRAM cells with folded bit lines and deep trench patterns
07/17/2007US7244977 Longitudinal MISFET manufacturing method, longitudinal MISFET, semiconductor storage device manufacturing method, and semiconductor storage device
07/17/2007US7244976 EEPROM device with substrate hot-electron injector for low-power programming
07/17/2007US7244974 wideband gap power semiconductor device having a low on-resistance and having a high avalanche capability used for power control
07/17/2007US7244973 Field-effect semiconductor device and method for making the same
07/17/2007US7244972 Semiconductor devices and method for manufacturing the same
07/17/2007US7244967 Apparatus and method for attaching an integrating circuit sensor to a substrate
07/17/2007US7244963 Double gate field effect transistor with diamond film
07/17/2007US7244962 Method of manufacturing semiconductor devices
07/17/2007US7244960 Solutions of organic semiconductors that contain additives
07/17/2007US7244958 Integration of strained Ge into advanced CMOS technology
07/17/2007US7244957 Group III nitride compound semiconductor light-emitting device and method for producing the same
07/17/2007US7244954 Collector having unused region for illumination systems using a wavelength ≦193 nm
07/17/2007US7244938 Method of checking a laser processed deteriorated layer
07/17/2007US7244683 Integration of ALD/CVD barriers with porous low k materials
07/17/2007US7244682 Methods of removing metal-containing materials
07/17/2007US7244681 Methods for selective removal of material from wafer alignment marks
07/17/2007US7244680 Method of simultaneously fabricating isolation structures having rounded and unrounded corners
07/17/2007US7244679 Methods of forming silicon quantum dots and methods of fabricating semiconductor memory devices using the same
07/17/2007US7244678 Methods for planarization of Group VIII metal-containing surfaces using complexing agents
07/17/2007US7244677 Method for filling recessed micro-structures with metallization in the production of a microelectronic device
07/17/2007US7244676 Method for fabricating semiconductor device
07/17/2007US7244675 Electrical connection materials and electrical connection method
07/17/2007US7244674 Process of forming a composite diffusion barrier in copper/organic low-k damascene technology
07/17/2007US7244673 Integration film scheme for copper / low-k interconnect
07/17/2007US7244672 Selective etching of organosilicate films over silicon oxide stop etch layers
07/17/2007US7244671 Methods of forming conductive structures including titanium-tungsten base layers and related structures
07/17/2007US7244670 Enhanced step coverage of thin films on patterned substrates by oblique angle PVD
07/17/2007US7244669 Patterning of devices
07/17/2007US7244668 Methods of manufacturing semiconductor devices
07/17/2007US7244667 Method and device for the production of thin epitaxial semiconductor layers
07/17/2007US7244666 Multi-gate transistor formed with active patterns of uniform critical dimension
07/17/2007US7244665 Wafer edge ring structures and methods of formation
07/17/2007US7244664 Method for dicing and singulating substrates
07/17/2007US7244663 Wafer reinforcement structure and methods of fabrication
07/17/2007US7244662 Method for manufacturing semiconductor integrated circuit
07/17/2007US7244661 Method for forming a buried diffusion layer with reducing topography in a surface of a semiconductor substrate
07/17/2007US7244660 Method for manufacturing a semiconductor component
07/17/2007US7244659 Integrated circuits and methods of forming a field effect transistor
07/17/2007US7244658 Low stress STI films and methods
07/17/2007US7244657 A semiconductor device containing a porous film inside, the porous film being formed by using a zeolite sol having an average particle diameter of 3 to 15 nm, wherein the zeolite sol is prepared by hydrolyzing and condensing in the presence
07/17/2007US7244656 Thin film circuit board device and method for manufacturing the same
07/17/2007US7244655 Method of manufacturing semiconductor device capable of suppressing impurity concentration reduction in doped channel region arising from formation of gate insulating film
07/17/2007US7244654 Drive current improvement from recessed SiGe incorporation close to gate
07/17/2007US7244653 Method and structure in the manufacture of mask read only memory
07/17/2007US7244652 Method of forming a split programming virtual ground SONOS memory
07/17/2007US7244651 Fabrication of an OTP-EPROM having reduced leakage current
07/17/2007US7244650 Transistor and method for manufacturing the same
07/17/2007US7244649 Method of manufacturing a capacitor having improved capacitance and method of manufacturing a semiconductor device including the capacitor
07/17/2007US7244648 Methods of forming semiconductor constructions
07/17/2007US7244647 Embedded capacitor structure in circuit board and method for fabricating the same
07/17/2007US7244646 Pixel design to improve photodiode capacitance and method of forming same
07/17/2007US7244645 Methods of forming electronic devices including high-k dielectric layers and electrode barrier layers and related structures
07/17/2007US7244644 Undercut and residual spacer prevention for dual stressed layers
07/17/2007US7244643 Semiconductor device and manufacturing method thereof
07/17/2007US7244642 Method to obtain fully silicided gate electrodes
07/17/2007US7244641 Process sequence and mask layout to reduce junction leakage for a dual gate MOSFET device
07/17/2007US7244640 Method for fabricating a body contact in a Finfet structure and a device including the same
07/17/2007US7244638 Semiconductor memory device and method of production
07/17/2007US7244637 Chip on board and heat sink attachment methods
07/17/2007US7244636 Semiconductor assembly for improved device warpage and solder ball coplanarity
07/17/2007US7244635 Semiconductor device and method of manufacturing the same
07/17/2007US7244634 Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same
07/17/2007US7244633 Chip carrier substrate with a land grid array and external bond terminals
07/17/2007US7244632 Complementary metal oxide semiconductor image sensor and method for fabricating the same
07/17/2007US7244631 MEMS surface modification for passive control of charge accumulation
07/17/2007US7244630 A1InGaP LED having reduced temperature dependence
07/17/2007US7244629 Vertical cavity surface emitting laser diode and method for manufacturing the same
07/17/2007US7244628 Method for fabricating semiconductor devices
07/17/2007US7244626 Semiconductor devices shared element(s) apparatus and method
07/17/2007US7244625 Plasma processing method and plasma processing device
07/17/2007US7244623 Method of manufacturing semiconductor device and apparatus of automatically adjusting semiconductor pattern
07/17/2007US7244544 Oxime derivatives and the use thereof as latent acids
07/17/2007US7244542 For microelectronics; relief imaging
07/17/2007US7244534 Device manufacturing method
07/17/2007US7244520 Substrate for nitride semiconductor growth
07/17/2007US7244499 Bonded structure including a carbon nanotube
07/17/2007US7244495 Dicing/die bonding adhesion tape
07/17/2007US7244475 Plasma treatment apparatus and control method thereof
07/17/2007US7244367 Metal alloy elements in micromachined devices
07/17/2007US7244347 Method and system to provide electrical contacts for electrotreating processes
07/17/2007US7244346 Concentration measuring mechanism, exposure apparatus, and device production method
07/17/2007US7244336 Temperature controlled hot edge ring assembly for reducing plasma reactor etch rate drift
07/17/2007US7244335 Substrate processing system and substrate processing method
07/17/2007US7244332 Smart label web and a method for its manufacture