Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2007
07/24/2007US7247534 Silicon device on Si:C-OI and SGOI and method of manufacture
07/24/2007US7247533 Method of fabricating semiconductor device using selective epitaxial growth
07/24/2007US7247532 High voltage transistor and method for fabricating the same
07/24/2007US7247531 Field-effect-transistor multiplexing/demultiplexing architectures and methods of forming the same
07/24/2007US7247530 Ultrathin SOI transistor and method of making the same
07/24/2007US7247529 Method for manufacturing display device
07/24/2007US7247528 Methods of fabricating semiconductor integrated circuits using selective epitaxial growth and partial planarization techniques
07/24/2007US7247527 Method for manufacturing semiconductor device, and laser irradiation apparatus
07/24/2007US7247526 Process for fabricating an integrated circuit package
07/24/2007US7247525 Method for manufacturing a semiconductor device
07/24/2007US7247524 Manufacturing method of wiring substrate
07/24/2007US7247523 Two-sided wafer escape package
07/24/2007US7247521 Semiconductor assembly encapsulation mold and method for forming same
07/24/2007US7247520 Microelectronic component assemblies and microelectronic component lead frame structures
07/24/2007US7247519 Method for making a semiconductor multi-package module having inverted bump chip carrier second package
07/24/2007US7247518 Semiconductor device and method for manufacturing same
07/24/2007US7247517 Method and apparatus for a dual substrate package
07/24/2007US7247516 Method for fabricating a leadless chip carrier
07/24/2007US7247515 Frame for semiconductor package
07/24/2007US7247513 Dissociation of silicon clusters in a gas phase during chemical vapor deposition homo-epitaxial growth of silicon carbide
07/24/2007US7247511 Thin film phase-change memory
07/24/2007US7247510 Magnetic recording medium and magnetic memory apparatus
07/24/2007US7247509 Method for manufacturing solid-state imaging devices
07/24/2007US7247508 Semiconductor device with intermediate connector
07/24/2007US7247507 Method for forming LOCOS layer in semiconductor device
07/24/2007US7247506 Method for producing magnetic memory device
07/24/2007US7247505 Magnetic memory device having magnetic shield layer, and manufacturing method thereof
07/24/2007US7247504 Ferroelectric capacitor, process for production thereof and semiconductor device using the same
07/24/2007US7247503 Method of laser annealing to form an epitaxial growth layer
07/24/2007US7247410 Complementary division mask, method of producing mask, and program
07/24/2007US7247381 used to bond and fix a semiconductor chip to a substrate
07/24/2007US7247363 Supported greensheet structure and method in MLC processing
07/24/2007US7247267 Mold and method of molding semiconductor devices
07/24/2007US7247256 Treating an aluminum film with a slurry of a polishing agent, an oxidant, a pH control additive, and an oxide film removal retarder; a first CMP which removes a part of the aluminum film; stopping the first CMP when a predetermined thickness of the aluminum, a second CMP with a defect prevention agent
07/24/2007US7247252 Method of avoiding plasma arcing during RIE etching
07/24/2007US7247246 Vertical integration of a MEMS structure with electronics in a hermetically sealed cavity
07/24/2007US7247222 Electrochemical processing cell
07/24/2007US7247218 Plasma density, energy and etch rate measurements at bias power input and real time feedback control of plasma source and bias power
07/24/2007US7247209 Dual outlet nozzle for the combined edge bead removal and backside wash of spin coated wafers
07/24/2007US7247208 Microelectronic cleaning compositions containing ammonia-free fluoride salts
07/24/2007US7247207 Vacuum processing apparatus
07/24/2007US7247179 Abrasive, hybrid organic/inorganic particles and alkyne having at least one hydroxyl substituent; preventing dishing and defects to dielectric during removal of such as tungsten
07/24/2007US7247176 Apparatus for removing fine particles during fabrication of a portable camera module
07/24/2007US7247083 Polishing apparatus
07/24/2007US7247082 Polishing composition
07/24/2007US7246985 Work-piece processing system
07/24/2007US7246984 Method and apparatus for transferring an article to be processed and processing apparatus
07/24/2007US7246800 Sealing mechanism for sealing a vacuum chamber
07/24/2007US7246796 Carburetor, various types of devices using the carburetor, and method of vaporization
07/24/2007US7246646 Method for production and apparatus for production of adhesive wafer
07/24/2007US7246445 Alignment device
07/24/2007US7246432 Method of manufacturing semiconductor device
07/24/2007US7246430 Electronic component mounting apparatus and electronic component mounting method
07/24/2007US7246421 Method for manufacturing surface acoustic wave device
07/24/2007CA2489818C A system for dispensing a viscous material onto a substrate
07/24/2007CA2182452C Shadow sculpted thin films
07/19/2007WO2007082266A2 Semiconductor transistors with expanded top portions of gates
07/19/2007WO2007081880A2 Method and apparatus for providing an integrated circuit having p and n doped gates
07/19/2007WO2007081807A2 Iii-nitride power semiconductor with a field relaxation feature
07/19/2007WO2007081686A2 Gas switching section including valves having different flow coefficients for gas distribution system
07/19/2007WO2007081624A2 Notch stop pulsing process for plasma processing system
07/19/2007WO2007081605A2 Method for converting electrical components
07/19/2007WO2007081549A2 Monitoring photodetector for integrated photonic devices
07/19/2007WO2007081546A2 Clipless and wireless semiconductor die package and method for making the same
07/19/2007WO2007081528A2 Environmentally robust passivation structures for high-voltage silicon carbide semiconductor devices
07/19/2007WO2007081409A2 Super-elastic nanostructures and methods of fabrication thereof
07/19/2007WO2007081185A1 Heating apparatus for batch type reaction chamber
07/19/2007WO2007081089A1 Method of isolating dual-trench element and method of fabricating flash memory by etching active region
07/19/2007WO2007080986A1 Drive apparatus for substrate transfer robot having coolant circulating passage
07/19/2007WO2007080956A1 Pressure bonding device and mounting method
07/19/2007WO2007080944A1 Method of forming porous film and computer-readable recording medium
07/19/2007WO2007080934A1 Vacuum treating device and vacuum treating method
07/19/2007WO2007080881A1 Method for manufacturing aluminum nitride crystal, aluminum nitride crystal, aluminum nitride crystal substrate and semiconductor device
07/19/2007WO2007080848A1 Polishing pad
07/19/2007WO2007080785A1 Resin sealed semiconductor device whose upper portion is provided with heat dissipating body exposed to external and method for manufacturing such resin sealed semiconductor device
07/19/2007WO2007080779A1 Object conveyance apparatus, exposure apparatus, object temperature regulation apparatus, object conveyance method, and method of producing microdevice
07/19/2007WO2007080771A1 Contact probe
07/19/2007WO2007080742A1 Method of photoelement resin sealing/molding
07/19/2007WO2007080726A1 Detergent for lithography and method of forming resist pattern with the same
07/19/2007WO2007080707A1 Substrate cleaning apparatus, method of substrate cleaning, substrate treating system and recording medium
07/19/2007WO2007080706A1 Emission gas treating apparatus
07/19/2007WO2007080693A1 Laser annealing method and laser annealing apparatus
07/19/2007WO2007080672A1 Semiconductor device and display device
07/19/2007WO2007080662A1 Dust remover
07/19/2007WO2007080647A1 Method for manufacturing semiconductor device
07/19/2007WO2007080643A1 Carrier tape of integrated circuit chip
07/19/2007WO2007080545A1 Method of fabricating a semiconductor on insulator device having a frontside substrate contact
07/19/2007WO2007080523A1 Maglev object positioning apparatus and method for positioning an object and maintaining position with high stability
07/19/2007WO2007080165A1 Air break for improved silicide formation with composite caps
07/19/2007WO2007080048A1 Semiconductor device structure having low and high performance devices of same conductive type on same substrate
07/19/2007WO2007080013A1 Method and apparatus for treating bonded wafer semiconductor substrates
07/19/2007WO2007079769A1 Tool for picking up, placing or pressing a flat object, and use of the tool
07/19/2007WO2007079639A1 Ttl alignment system for projection exposure apparatus and alignment method
07/19/2007WO2007059027A3 Thermal processing system, components, and methods
07/19/2007WO2007038575A3 Process for integrating planar and non-planar cmos transistors on a bulk substrate and article made thereby
07/19/2007WO2007027311A3 Systems and methods for controlling ambient pressure during processing of microfeature workpieces, including during immersion lithography
07/19/2007WO2007015194A3 Semiconductor device and method of manufacturing such a device
07/19/2007WO2007014118A3 Process for forming an electronic device including discontinuous storage elements
07/19/2007WO2006110207A3 Integrated circuit transformer devices for on-chip millimeter-wave applications
07/19/2007WO2006110163A3 Epitaxial growth of aligned algainn nanowires by metal-organic chemical vapor deposition