Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2007
07/19/2007US20070163714 Etch chamber
07/19/2007US20070163713 Gas supply system and processing system
07/19/2007US20070163712 Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties
07/19/2007US20070163711 Apparatus for treating substrate
07/19/2007US20070163677 Copper cmp slurry composition
07/19/2007US20070163621 Cleaning member for semiconductor apparatus and process for producing the same
07/19/2007US20070163617 Method for cleaning treatment chamber iIn substrate treating apparatus and method for detecting endpoint of cleaning
07/19/2007US20070163504 Vapor phase growth apparatus
07/19/2007US20070163503 Thin film preparation apparatus
07/19/2007US20070163502 Substrate processing apparatus
07/19/2007US20070163501 Plasma processing apparatus
07/19/2007US20070163488 Method of growing oxide thin films
07/19/2007US20070163377 Handling apparatus
07/19/2007US20070163066 Core for washing sponge roller
07/19/2007DE19944012B4 Grabenkondensator mit Kondensatorelektroden und entsprechendes Herstellungsverfahren Grave capacitor capacitor electrode and method of manufacture
07/19/2007DE10355666B4 Dünnschichttransistor-Matrixsubstrat sowie Verfahren zu dessen Herstellung Thin film transistor array substrate as well as method for its preparation
07/19/2007DE10345393B4 Verfahren zur Abscheidung eines leitfähigen Materials auf einem Substrat und Halbleiterkontaktvorrichtung A process for depositing a conductive material on a substrate and semiconductor contact device
07/19/2007DE10309899B4 Verfahren zum Füllen einer Polysiliziumfuge A method of filling a Polysiliziumfuge
07/19/2007DE10262103B4 Doping process used in the production of a transistor, IGBT, thyristor or diode comprises preparing a semiconductor body, producing crystal defects in the body, introducing hydrogen ions into the body, and heat treating
07/19/2007DE10228517B4 Schutzschaltung und -verfahren gegen elektrostatische Entladung in einem TFT-LCD Protection circuit and method against electrostatic discharge in a TFT-LCD
07/19/2007DE102007003197A1 Halbleiterbauelement vom Grabenisolationstyp und Herstellungsverfahren The semiconductor device of grave insulation type and production methods
07/19/2007DE102006059736A1 Ätzbeständige Wafer-Verarbeitungsvorrichtung und Verfahren zum Herstellen derselben Etch wafer processing apparatus and method for manufacturing the same
07/19/2007DE102006058536A1 Laserstrahlbearbeitungsmaschine Laser beam processing machine
07/19/2007DE102006002381B3 Power semiconductor component for e.g. alternating current-direct current converter, has chips arranged adjacent to each other and attached on flat conductor by diffusion solder connection, where another chip is attached on chips
07/19/2007DE102006001935A1 Bearbeiten von Wafern in einer Aufspannung Processing wafers in one setting
07/19/2007DE102005063131A1 Verfahren zum Reduzieren von Leckströmen, die durch eine Fehljustierung einer Kontaktstruktur hervorgerufen werden, durch Erhöhen einer Fehlertoleranz des Kontaktstrukturierungsprozesses A method for reducing leakage currents, which are caused by a misalignment of a contact structure, by increasing an error tolerance of the contact patterning process
07/19/2007DE102005063092B3 Halbleiterbauelement mit einer Kontaktstruktur mit erhöhter Ätzselektivität Semiconductor component having a contact structure with improved etch selectivity
07/19/2007DE102005048447B4 Halbleiterleistungsbauelement mit Ladungskompensationsstruktur und Verfahren zur Herstellung desselben Of the same semiconductor power device having charge compensation structure and method for producing
07/19/2007DE102004039763B4 Verfahren zum Bestimmen der Dicke einer Schicht A method for determining the thickness of a layer
07/19/2007DE102004022884B4 Halbleiterbauteil mit einem Umverdrahtungssubstrat und Verfahren zur Herstellung desselben Of the same semiconductor device with a rewiring substrate and methods for preparing
07/19/2007DE10146933B4 Integrierte Halbleiteranordnung mit Abstandselement und Verfahren zu ihrer Herstellung An integrated semiconductor arrangement with spacer and methods for their preparation
07/19/2007DE10042123B9 Vorrichtung zur Durchführung von optischen Messungen an einer Probe in einer Vakuumkammer Device for carrying out optical measurements on a sample in a vacuum chamber
07/19/2007CA2635774A1 Laser annealing method and laser annealing device
07/19/2007CA2533225A1 A tunable semiconductor component provided with a current barrier
07/18/2007EP1809083A2 Multilayer printed circuit board
07/18/2007EP1808954A2 IGBT-module
07/18/2007EP1808890A1 Method of producing a monocrystalline layer on a dielectric layer
07/18/2007EP1808889A2 Decoupled chamber body
07/18/2007EP1808888A2 System and method for Uniform Multi-Plane Silicon Oxide Layer Formation for Optical Applications
07/18/2007EP1808887A1 Production method of semiconductor wafer, and semiconductor wafer
07/18/2007EP1808886A2 Method of adjusting the pressure of a substrate in a semi-conductor material
07/18/2007EP1808885A1 A semiconductor device and method of fabricating a semiconductor device
07/18/2007EP1808884A1 Exposure apparatus, exposure method and device manufacturing method
07/18/2007EP1808883A1 Measurement method, exposure method, and device manufacturing method
07/18/2007EP1808862A1 Magnetic device with magnetic tunnel junction, memory and read and write methods using this device
07/18/2007EP1808509A1 Ion beam sputtering equipment and method for forming multilayer film for reflective mask blank for euv lithography
07/18/2007EP1808480A1 pH buffered aqueous cleaning composition and method for removing photoresist residue
07/18/2007EP1808412A1 Method for purifying aqueous alkaline solution
07/18/2007EP1808407A1 Method of patterning self-organizing material, patterned substrate of self-organizing material and method of producing the same, and phosomask using patterned substrate of self-organizing material
07/18/2007EP1807868A2 Stacked die module
07/18/2007EP1807867A2 Method of forming a component having dielectric sub-layers
07/18/2007EP1807865A1 Polishing apparatus
07/18/2007EP1807864A2 Magnetoresistive random access memory device structures and methods for fabricating the same
07/18/2007EP1807863A2 Method and system for transferring a patterned material
07/18/2007EP1807556A2 METHOD FOR GROWING Si-Ge SEMICONDUCTOR MATERIALS AND DEVICES ON SUBSTRATES
07/18/2007EP1807555A2 Crystal growth method and apparatus
07/18/2007EP1658519A4 Solution to thermal budget
07/18/2007EP1608598B1 Silica glass containing tio2 and process for its production
07/18/2007EP1602007A4 A method of patterning photoresist on a wafer using a reflective mask with a multi-layer arc
07/18/2007EP1573795A4 A system and method for controlling plasma with an adjustable coupling to ground circuit
07/18/2007EP1553623B1 Anisotropic conductivity probe
07/18/2007EP1509642B1 Device for the production of crystal rods having a defined cross-section and column-shaped polycrystalline structure by means of floating-zone continuous crystallization
07/18/2007EP1497408A4 Method for making a molecularly smooth surface
07/18/2007EP1461825A4 Performance polymer film insert molding for fluid control devices
07/18/2007EP1444727A4 Process and apparatus for etching of thin, damage sensitive layers using high frequency pulsed plasma
07/18/2007EP1366495B1 High speed signal path and method
07/18/2007EP1366209A4 Processing materials inside an atmospheric-pressure radiofrequency nonthermal plasma discharge
07/18/2007EP1349969B1 Semiconductor stripping composition containing 1,3-dicarbonyl compounds
07/18/2007EP1262020A4 High sheet mos resistor method and apparatus
07/18/2007EP1230752A4 Virtual laser operator
07/18/2007EP1186052B1 Source-down power transistor
07/18/2007EP1135846B1 Displacement device
07/18/2007EP1087035B1 Method and apparatus for formation of thin film
07/18/2007EP0949668B1 Method for forming bump and semiconductor device
07/18/2007CN2924788Y Field effect tube lead forming tool
07/18/2007CN2924787Y Semiconduct or reaction chamber element fixing device
07/18/2007CN2924591Y Photomask box
07/18/2007CN2923739Y Back board heating device
07/18/2007CN1327539C Microelectronic components and electronic networks comprising DNA
07/18/2007CN1327535C Sucker type orientation mobile test platform controller for solar cell and its method
07/18/2007CN1327530C 薄膜晶体管及显示装置 A thin film transistor and a display device
07/18/2007CN1327528C Silicon carbide semiconductor device
07/18/2007CN1327526C Non-volatile memory array method of programming with electricity erasuring and programme
07/18/2007CN1327525C Structure and method for measuring capacitance
07/18/2007CN1327524C Semiconductor device and its making method
07/18/2007CN1327522C Semiconductor device with unloading circuit for removing defect part
07/18/2007CN1327517C Semiconductor device and method of manufacturing the same
07/18/2007CN1327515C Circuit board and method of manufacturing the same
07/18/2007CN1327514C Wiring substrate and method of manufacturing the same
07/18/2007CN1327513C Packaging baseplate having electrostatic discharge protection
07/18/2007CN1327512C Nanocrystal electron device
07/18/2007CN1327511C Method for fg. seiconductor device
07/18/2007CN1327510C Single supply level converter
07/18/2007CN1327509C Low dielectric semiconductor device and process for fabricating the same
07/18/2007CN1327508C Manufacture method for semiconductor device
07/18/2007CN1327507C Semiconductor device and its manufacturing method
07/18/2007CN1327506C Barrier layer free inner wiring technology and structure with multi-layer seed layers
07/18/2007CN1327505C Method for making stacked structure comprising thin film adhering to target substrate
07/18/2007CN1327504C Manufacture of semiconductor elements
07/18/2007CN1327503C Improvement for shallow slot separated structure height homogeneity