Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2008
01/16/2008CN101107090A Electroprocessing profile control
01/16/2008CN101106897A High-speed picker applying multi-header turning tower structure
01/16/2008CN101106173A Method of forming a phase change material layer and a phase change memory device so formed
01/16/2008CN101106169A LED encapsulation structure and its making method
01/16/2008CN101106161A Underlay material for GaN epitaxial growth and its making method
01/16/2008CN101106160A Vertical gate semiconductor device and method for manufacturing the same
01/16/2008CN101106159A Multi-grid electric crystal and its making method
01/16/2008CN101106158A Germanium silicon heterogeneous crystal transistor with elevated external base area and its making technology
01/16/2008CN101106156A Organic light emitting diode display and method for manufacturing thereof
01/16/2008CN101106153A Field effect transistor, organic thin-film transistor and manufacturing method of organic transistor
01/16/2008CN101106151A Phase change memory with diode unit selective connection and its making method
01/16/2008CN101106146A MOS solid-state image pickup device and manufacturing method thereof
01/16/2008CN101106145A Image sensor and its making method
01/16/2008CN101106144A An image sensor and method for forming semiconductor part
01/16/2008CN101106142A Display substrate, method of manufacturing thereof and display apparatus having the same
01/16/2008CN101106141A Semiconductor-on-insulator (SOI) structure and its making method
01/16/2008CN101106140A Non-volatile memory devices including dummy word lines and related structures and methods
01/16/2008CN101106139A Nonvolatile memory having raised source and drain regions
01/16/2008CN101106138A Nonvolatile memory array having modified channel region interface
01/16/2008CN101106136A Nonvolatile memory unit IC and its making method
01/16/2008CN101106133A Memory part, its making method and operation method
01/16/2008CN101106131A Semiconductor structure and its forming method
01/16/2008CN101106130A Power system inhibit method and device and structure therefor
01/16/2008CN101106125A Composite assembly that incorporates multiple devices that use different wavelengths of light and method for making the composite assembly
01/16/2008CN101106124A Direct insertion LED and its making method
01/16/2008CN101106123A Wafer and semiconductor device testing method
01/16/2008CN101106122A Buried bitline with reduced resistance
01/16/2008CN101106121A Wiring substrate, semiconductor device, and method of manufacturing the same
01/16/2008CN101106116A Semiconductor device and method of producing the same
01/16/2008CN101106115A Semiconductor device and method for manufacturing the same
01/16/2008CN101106114A Chip structure and its forming method
01/16/2008CN101106113A IC device package and its assembling method
01/16/2008CN101106112A Packaging structure of electronic part, and its packaging method
01/16/2008CN101106111A IC device package and its mounting method
01/16/2008CN101106110A Making method for flash memory separation grid
01/16/2008CN101106109A Making method for memory separation grid
01/16/2008CN101106108A Transistor and memory cell array and methods of making the same
01/16/2008CN101106107A Making method of CMOS part
01/16/2008CN101106106A Making method for semiconductor part
01/16/2008CN101106105A Making and detection method of silicon base LCD chip base plate
01/16/2008CN101106104A Making method for memory capacitor
01/16/2008CN101106103A Manufacturing method of light-emitting element
01/16/2008CN101106102A Compliant conductive interconnects
01/16/2008CN101106101A Single inlay structure and dual inlay structure and their open hole forming method
01/16/2008CN101106100A Method for reducing contact resistance in high depth ratio self alignment etching
01/16/2008CN101106099A Method for using oxide coated layer to improve channel filling equality
01/16/2008CN101106098A Ball filling device and method
01/16/2008CN101106097A Semiconductor part with protective compound layer and its making method
01/16/2008CN101106096A Method for forming conduction protruding block and its structure
01/16/2008CN101106095A Making method of solder protruding block
01/16/2008CN101106094A Built-in wafer encapsulation structure and its making process
01/16/2008CN101106093A Making method for base plate welding cover layer and its structure
01/16/2008CN101106092A Making method for IV-VI semiconductor single crystal film and the heterogeneous structure
01/16/2008CN101106091A Semiconductor part and its making method
01/16/2008CN101106090A An IMP method for effectively reducing high-voltage LDNMOS cut-off current and avoiding dual peak feature and its application
01/16/2008CN101106089A A compensation injection method for effectively reducing LDNMOS cut-off current and avoiding dual peak feature and its application
01/16/2008CN101106088A Making method for silicide damaged by low plasma inducing growth
01/16/2008CN101106087A Technique method for forming local metal silicide
01/16/2008CN101106086A Plasma etching method and computer-readable storage medium
01/16/2008CN101106085A Method of manufacturing semiconductor device
01/16/2008CN101106084A A new method for making low dielectric constant layer and its application
01/16/2008CN101106083A Processing method for silicon sheet surface
01/16/2008CN101106082A Method for the simultaneous double-side grinding of a plurality of semiconductor wafers, and semiconductor wafer having outstanding flatness
01/16/2008CN101106081A Method of producing group iii nitride substrate wafers and group iii nitride substrate wafers
01/16/2008CN101106080A Method of heating semiconductor wafer
01/16/2008CN101106079A A growth method of silicon germanium material
01/16/2008CN101106078A Method for forming nano single crystal silicon and making method of non volatile semiconductor memory
01/16/2008CN101106077A Method to improve metal defects in semiconductor device fabrication
01/16/2008CN101106076A A novel metal-insulation layer-metal capacitance and its making method
01/16/2008CN101106075A Film formation apparatus for semiconductor process and method for using the same
01/16/2008CN101106074A Plasma etch reactor
01/16/2008CN101106073A Heat treatment for stabilizing a gluing interface
01/16/2008CN101106072A Direct water-repellent gluing method of two substrates used in electronics, optics or optoelectronics
01/16/2008CN101106071A Apparatus and method for treating substrate
01/16/2008CN101106070A Process gas introducing mechanism and plasma processing device
01/16/2008CN101106069A Method for extending use life of reaction cavity in plasma etching system
01/16/2008CN101106068A Method for making semiconductor material form mutual built-in pattern
01/16/2008CN101106067A Separation method for semiconductor part and silicon underlay
01/16/2008CN101106066A Making method for semiconductor part removing residual polyester in etching
01/16/2008CN101105641A Correction of off-axis translation of optical elements in an optical zoom assembly
01/16/2008CN101105640A Lithographic apparatus and device manufacturing method
01/16/2008CN101105638A Reflective loop system producing incoherent radiation
01/16/2008CN101105634A Mask protection film removing device and its method
01/16/2008CN101105633A Optical approximate correction method and its photomask pattern
01/16/2008CN101105623A Method for manufacturing inclined line at light mask
01/16/2008CN101105591A Air-float type machine station touch alarming device
01/16/2008CN101105543A Microlens device and its making method
01/16/2008CN101105516A Device and method for testing semiconductor packages
01/16/2008CN101105504A 探针卡装置 Probe card device
01/16/2008CN101105468A Porous anode alumina humidity sensor and its preparing process
01/16/2008CN101104948A Crystalline thin film and process for manufacturing thereof, and element, circuit and device employing crystalline thin film
01/16/2008CN101104548A Low-resistance P-type tin dioxide thin film material doped with indium and aluminum and preparation method thereof
01/16/2008CN101104252A Polishing pad and chemical and mechanical polishing method
01/16/2008CN101104247A Chemical and mechanical grinding method
01/16/2008CN100362672C Single crystal gan substrate, method of growing same and method of producing same
01/16/2008CN100362669C Photothyristor device, bidirectional photothyristor device and electronic apparatus
01/16/2008CN100362667C Semiconductor element and its producing method
01/16/2008CN100362666C Packaging structure of optical sensing chip and producing method thereof
01/16/2008CN100362664C Non-volatile memory location and producing method thereof
01/16/2008CN100362663C Integration of two memory types