Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2008
01/16/2008CN100362662C Semiconductor device and electronic device
01/16/2008CN100362660C Semiconductor device and its production
01/16/2008CN100362658C Ultraviolet blocking layer
01/16/2008CN100362656C Semiconductor die package including drain clip
01/16/2008CN100362651C Method for manufacturing diode subassemblies used in rectifier assemblies of engine driven generators
01/16/2008CN100362650C Semiconductor device having electrical contact from opposite sides and method therefor
01/16/2008CN100362649C Method for preventing clearance generation between different materials in semiconductor device
01/16/2008CN100362648C Semiconductor device and manufacturing method thereof
01/16/2008CN100362647C Novel process to improve programming of memory cells
01/16/2008CN100362646C Semiconductor device, dram integrated circuit device, and method of producing the same
01/16/2008CN100362645C Thimble device
01/16/2008CN100362644C Electrostatic chuck
01/16/2008CN100362643C Substrate suction device
01/16/2008CN100362642C Detecting structure for simultaneously detecting hot carriers of multiple metal-oxide-semiconductor device
01/16/2008CN100362641C Heating device for automatic anode linkage of MEMS high-temperature pressure sensor
01/16/2008CN100362640C Method for preventing semiconductor assembly pin welding from shorting circuit
01/16/2008CN100362639C Semiconductor packer and production for godown chip
01/16/2008CN100362638C Method for removing lattice defect in pad area of semiconductor device
01/16/2008CN100362637C Method of manufacture of raised source drain MOSFET and device manufactured thereby
01/16/2008CN100362636C Method for producing a bipolar transistor comprising a polysilicon emitter
01/16/2008CN100362635C Laser radiation method, laser radiation device and semiconductor device manufacture
01/16/2008CN100362634C Ozone processing device
01/16/2008CN100362633C Plasma cleaning method for removing silicon chip surface particle after etching process
01/16/2008CN100362632C Dry etching apparatus and dry etching method
01/16/2008CN100362631C Laser machining using an active assist gas
01/16/2008CN100362630C Polishing body, polishing device, semiconductor device, and method of manufacturing semiconductor device
01/16/2008CN100362629C Method for cleaning semiconductor wafer
01/16/2008CN100362628C Self-aligning method for outskirt state phase shifting light shade
01/16/2008CN100362627C Semiconductor device with self-aligning section contact hole and its producing method
01/16/2008CN100362626C Barrier for capacitor over plug structures
01/16/2008CN100362625C Substrate processing apparatus and substrate processing method
01/16/2008CN100362624C Device for controlling D.C. bias on wafer
01/16/2008CN100362623C Silicon chip process test method
01/16/2008CN100362622C Lower-extraction type etching device
01/16/2008CN100362621C Device and method for reducing thin-film type capacitance vacuum gauge zero-point drift
01/16/2008CN100362620C Loading umloading device of semiconductor processing piece and its loading and unloading method
01/16/2008CN100362619C RF matching coupling network for vacuum reaction chamber and its configuration method
01/16/2008CN100362618C A semiconductor device and making method thereof
01/16/2008CN100362617C Forming folded-stack packaged device using progressive folding tool
01/16/2008CN100362591C Method of making magnetic memory device
01/16/2008CN100362552C Electric current driven luminous display device
01/16/2008CN100362431C Photoetching device, device manufacturing method and manufactured device by it
01/16/2008CN100362413C Method for making electronic apparatus
01/16/2008CN100362402C Aligning apparatus
01/16/2008CN100362398C 显示器件 Display Devices
01/16/2008CN100362358C Scatterometry structure with embedded ring oscillator, and methods of using same
01/16/2008CN100362068C Abrasive-free chemical mechanical polishing compositions and methods relating thereto
01/16/2008CN100361879C Wafer box with radially pivoting latch elements
01/16/2008CN100361784C Method and apparatus for heating polishing pad
01/15/2008US7320062 Apparatus, method, system and executable module for configuration and operation of adaptive integrated circuitry having fixed, application specific computational elements
01/15/2008US7319944 Method for a predicting a pattern shape by using an actual measured dissolution rate of a photosensitive resist
01/15/2008US7319920 Method and apparatus for self-calibration of a substrate handling robot
01/15/2008US7319606 Memory
01/15/2008US7319605 Conductive structure for microelectronic devices and methods of fabricating such structures
01/15/2008US7319603 Semiconductor memory device layout comprising high impurity well tap areas for supplying well voltages to N wells and P wells
01/15/2008US7319598 Electronic component with a housing package
01/15/2008US7319530 System and method for measuring germanium concentration for manufacturing control of BiCMOS films
01/15/2008US7319517 Wafer chuck illumination device for use in semiconductor manufacturing equipment
01/15/2008US7319509 Attenuator for attenuating wavelengths unequal to a used wavelength
01/15/2008US7319507 Apparatus and method for removing contaminant on original, method of manufacturing device, and original
01/15/2008US7319506 Alignment system and method
01/15/2008US7319505 Exposure apparatus and device fabrication method
01/15/2008US7319445 Active matrix type organic electroluminescence device
01/15/2008US7319377 Method for making high-performance RF integrated circuits
01/15/2008US7319347 Bidirectional high voltage switching device and energy recovery circuit having the same
01/15/2008US7319339 Inspection apparatus to break the oxide of an electrode by fritting phenomenon
01/15/2008US7319335 Configurable prober for TFT LCD array testing
01/15/2008US7319295 High-frequency power supply structure and plasma CVD device using the same
01/15/2008US7319283 Moving apparatus, exposure apparatus, and device manufacturing method
01/15/2008US7319276 Substrate for pre-soldering material and fabrication method thereof
01/15/2008US7319275 Adhesion by plasma conditioning of semiconductor chip
01/15/2008US7319274 Methods for selective integration of airgaps and devices made by such methods
01/15/2008US7319270 Multi-layer electrode and method of forming the same
01/15/2008US7319269 Semiconductor device power interconnect striping
01/15/2008US7319262 MRAM over sloped pillar
01/15/2008US7319258 Semiconductor-on-insulator chip with<100>-oriented transistors
01/15/2008US7319257 Power semiconductor device
01/15/2008US7319255 Semiconductor device including a metal gate electrode formed in a trench and method of forming thereof
01/15/2008US7319254 Semiconductor memory device having resistor and method of fabricating the same
01/15/2008US7319252 Methods for forming semiconductor wires and resulting devices
01/15/2008US7319249 Light emitting element and method of making same
01/15/2008US7319248 High brightness light emitting diode
01/15/2008US7319243 Flat panel display device and method of manufacturing the same
01/15/2008US7319239 Substrate for display device having a protective layer provided between the pixel electrodes and wirings of the active matrix substrate, manufacturing method for same, and display device
01/15/2008US7319238 Semiconductor device and its manufacturing method
01/15/2008US7319237 Thin film transistor array
01/15/2008US7319236 Semiconductor device and electronic device
01/15/2008US7319235 Resistive semiconductor element based on a solid-state ion conductor
01/15/2008US7319081 As a gate insulation film of a semiconductor apparatus and an intermediate insulation film between a gate electrode and a floating gate, etc. other than the thin film dielectric film of a thin film capacity element
01/15/2008US7319076 Low resistance T-shaped ridge structure
01/15/2008US7319075 Etchant with selectivity for doped silicon dioxide over undoped silicon dioxide and silicon nitride, processes which employ the etchant, and structures formed thereby
01/15/2008US7319074 Method of defining polysilicon patterns
01/15/2008US7319073 Method of reducing silicon damage around laser marking region of wafers in STI CMP process
01/15/2008US7319072 Polishing medium for chemical-mechanical polishing, and method of polishing substrate member
01/15/2008US7319071 Methods for forming a metallic damascene structure
01/15/2008US7319070 Semiconductor device fabrication method
01/15/2008US7319069 Structure having pores, device using the same, and manufacturing methods therefor
01/15/2008US7319068 Method of depositing low k barrier layers
01/15/2008US7319067 Method of simultaneously controlling ADI-AEI CD differences of openings having different sizes and etching process utilizing the same method
01/15/2008US7319066 Semiconductor device and method for fabricating the same