| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/07/2008 | US20080029903 Chip-stacked package structure |
| 02/07/2008 | US20080029901 Post vertical interconnects formed with silicide etch stop and method of making |
| 02/07/2008 | US20080029900 Semiconductor device and method of manufacturing the same |
| 02/07/2008 | US20080029899 Method of fabricating a semiconductor device and semiconductor device fabricated thereby |
| 02/07/2008 | US20080029896 Sip semiconductor device and method for manufacturing the same |
| 02/07/2008 | US20080029895 Carrier board structure with embedded semiconductor chip and fabrication method thereof |
| 02/07/2008 | US20080029894 Flip-chip package substrate and a method for fabricating the same |
| 02/07/2008 | US20080029892 Method of fabricating semiconductor device |
| 02/07/2008 | US20080029891 Semiconductor Device and Method for Fabricating the Same |
| 02/07/2008 | US20080029889 Method to create flexible connections for integrated circuits |
| 02/07/2008 | US20080029888 Solder Interconnect Joints For A Semiconductor Package |
| 02/07/2008 | US20080029881 Circuit board with cooling function |
| 02/07/2008 | US20080029879 Structure and method of making lidded chips |
| 02/07/2008 | US20080029878 Method and Device For Secure, Insulated and Electrically Conductive Assembling Of Treated Semiconductor Wafers |
| 02/07/2008 | US20080029874 Integrated Circuit Component with a Surface-Mount Housing and Method for Producing the Same |
| 02/07/2008 | US20080029873 Integrated circuit package system with molding vents |
| 02/07/2008 | US20080029872 Plate structure having chip embedded therein and the manufacturing method of the same |
| 02/07/2008 | US20080029870 Wafer-leveled chip packaging structure and method thereof |
| 02/07/2008 | US20080029869 Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability |
| 02/07/2008 | US20080029865 Electronic Device and Method For Producing the Same |
| 02/07/2008 | US20080029857 Semiconductor device comprising an excess resin portion, manufacturing method thereof, and apparatus for manufacturing semiconductor device comprising a excess resin portion |
| 02/07/2008 | US20080029852 Semiconductor device and method of manufacturing the same |
| 02/07/2008 | US20080029850 Electrical through contact |
| 02/07/2008 | US20080029845 On-Chip Magnetic Components |
| 02/07/2008 | US20080029836 Structure and method for making high density mosfet circuits with different height contact lines |
| 02/07/2008 | US20080029835 Method of Removing Refractory Metal Layers and of Siliciding Contact Areas |
| 02/07/2008 | US20080029828 Fin field effect transistors including oxidation barrier layers |
| 02/07/2008 | US20080029826 Semicondutor memory device and method of manufacturing the same |
| 02/07/2008 | US20080029825 Semiconductor device and method of manufacturing the same |
| 02/07/2008 | US20080029822 Semiconductor device and method for manufacturing the same |
| 02/07/2008 | US20080029821 Semiconductor Device and Method for Production Thereof |
| 02/07/2008 | US20080029818 Selective silicon-on-insulator isolation structure and method |
| 02/07/2008 | US20080029817 Process for manufacturing a semiconductor wafer having SOI-insulated wells and semiconductor wafer thereby manufactured |
| 02/07/2008 | US20080029816 Process for integrating on an inert substrate a device comprising at least a passive element and an active element and corresponding integrated device |
| 02/07/2008 | US20080029815 Semiconductor-on-insulator (SOI) strained active area transistor |
| 02/07/2008 | US20080029813 Semiconductor device and method of manufacturing the same |
| 02/07/2008 | US20080029811 Vertical Twin-Channel Transistors and Methods of Fabricating the Same |
| 02/07/2008 | US20080029810 Methods of fabricating semiconductor devices having buried gates and related semiconductor devices |
| 02/07/2008 | US20080029806 Semiconductor device including nonvolatile memory and method for fabricating the same |
| 02/07/2008 | US20080029805 Semiconductor device and manufacturing method of the same |
| 02/07/2008 | US20080029804 Flash Memory Device and Method of Manufacturing the Same |
| 02/07/2008 | US20080029801 Semiconductor device and method of forming the same |
| 02/07/2008 | US20080029799 Capacitor device with a layer structure disposed in a meander-shaped |
| 02/07/2008 | US20080029791 Semiconductor Device and Method of Fabricating the Same |
| 02/07/2008 | US20080029790 ALD of silicon films on germanium |
| 02/07/2008 | US20080029789 Current Aperture Transistors and Methods of Fabricating Same |
| 02/07/2008 | US20080029785 Post passivation interconnection schemes on top of the IC chips |
| 02/07/2008 | US20080029779 Injection apparatus, semiconductor light emitting apparatus, manufacturing apparatus, and manufacturing method of semiconductor light emitting apparatus |
| 02/07/2008 | US20080029778 LED module and method of manufacturing the same |
| 02/07/2008 | US20080029777 Semiconductor optical device and manufacturing method therefor |
| 02/07/2008 | US20080029769 Provides two-block laser mask capable of preventing or minimizing a shot mark by sequential irradiation of each block with two different lasers; liquid crystal displays, light emitting diodes; Flat panel displays having a polycrystalline silicon thin film transistor as a switching device |
| 02/07/2008 | US20080029767 Display device and method of manufacturing the display device |
| 02/07/2008 | US20080029766 Laminated structure, production method of the same, multilayer circuit board, active matrix substrate, and electronic display |
| 02/07/2008 | US20080029764 Capacitor, method of producing the same, semiconductor device, and liquid crystal display device |
| 02/07/2008 | US20080029756 Semiconductor buffer architecture for III-V devices on silicon substrates |
| 02/07/2008 | US20080029752 Phase change memory and manufacturing method thereof |
| 02/07/2008 | US20080029497 Laser processing device |
| 02/07/2008 | US20080029487 comprising at least one of hydrogen fluoride, nitric acid, ammonium fluoride and ammonium chloride; makes fine treatment on multilayer film, including tungsten film and a silicon oxide film, possible by controlling the etching rate |
| 02/07/2008 | US20080029484 In-situ process diagnostics of in-film aluminum during plasma deposition |
| 02/07/2008 | US20080029478 Chemical mechanical polishing process for forming shallow trench isolation structure |
| 02/07/2008 | US20080029132 Ultrasonic cleaning apparatus |
| 02/07/2008 | US20080029032 Substrate support with protective layer for plasma resistance |
| 02/07/2008 | US20080029031 Methods and apparatus for forming thin films for semiconductor devices |
| 02/07/2008 | US20080029030 Plasma Generator |
| 02/07/2008 | US20080029029 Transfer chamber for cluster system |
| 02/07/2008 | DE60035318T2 Integrierte Halbleiterschaltung, Flüssigkristallvorrichtung, elektronisches Gerät und Verfahren zur integrierten Halbleiterschaltungsregelung A semiconductor integrated circuit, the liquid crystal device, electronic device and method for semiconductor integrated circuit control |
| 02/07/2008 | DE19829309B4 Verfahren zur Herstellung eines thermischen Oxidfilms auf Siliciumcarbid Process for the preparation of a thermal oxide film on silicon carbide |
| 02/07/2008 | DE19820147B4 Verfahren zur Bildung einer leitfähigen Schicht mittels eines atomaren Schichtdepositionsprozesses A method for forming a conductive layer by an atomic layer deposition process |
| 02/07/2008 | DE112006000816T5 Produktionsverfahren für Siliziumeinkristall, getemperter Wafer und Produktionsverfahren für getemperten Wafer Production process for silicon single crystal wafer annealed and annealed wafer production for |
| 02/07/2008 | DE112006000684T5 Optische Projektionsvorrichtung Optical projection apparatus |
| 02/07/2008 | DE112005003420T5 Haltering für CMP-Vorrichtung und Herstellungsverfahren dafür, und CMP-Vorrichtung Retaining ring for CMP apparatus and manufacturing method thereof, and CMP apparatus |
| 02/07/2008 | DE10336271B4 Siliciumscheibe und Verfahren zu deren Herstellung Silicon wafer and processes for their preparation |
| 02/07/2008 | DE10256911B4 Gruppe-III-Nitrid Transistorbauelement auf Siliziumsubstrat Group III-nitride transistor device on silicon substrate |
| 02/07/2008 | DE102007032503A1 Phasenänderungsmaterialschicht und -speicherbauelement sowie Verfahren zur Herstellung derselben Phase change material layer and -speicherbauelement as well as methods for producing the same |
| 02/07/2008 | DE102007004301A1 Semiconductor component i.e. film semiconductor component, or element group manufacturing method, involves forming semiconductor material with layer sequence, and arranging electrical connection area on side facing carrier layer |
| 02/07/2008 | DE102006037751A1 Verfahren zur Ausbildung eines dotierten Abschnitts und eines Transistors A method of forming a doped portion and a transistor |
| 02/07/2008 | DE102006036728A1 Semiconductor chips contacting method for e.g. printed circuit board layer, involves applying conductive bumps on contact areas, where bumps penetrate one layer formed during connection of metal layer with surface of board layer |
| 02/07/2008 | DE102006036585A1 Verfahren und Vorrichtung zum Ermitteln von Messwerten Method and device for determining measured values, |
| 02/07/2008 | DE102006036544A1 Optoelektronisches Modul The optoelectronic module |
| 02/07/2008 | DE102006036098A1 Wiederprogrammierbare nichtflüchtige Speicherzelle Reprogrammable non-volatile memory cell |
| 02/07/2008 | DE102006036076A1 Kondensatorbauelement mit einer mäanderförmig angeordneter Schichtstruktur Capacitor device with a meandering arranged layer structure |
| 02/07/2008 | DE102006035876A1 Multi chip module e.g. sensor chip module, has chip connected with one of main surfaces with thermal contact surface of heat conductor, and has electrical connections connected with electrical contact surfaces of electrical conductors |
| 02/07/2008 | DE102006035668A1 Verfahren zum Herstellen einer Ätzindikatorschicht zur Reduzierung von Ätzungleichförmigkeiten A method of manufacturing a Ätzindikatorschicht to reduce etch non-uniformities |
| 02/07/2008 | DE102006035667A1 Verfahren zum Verbessern der Lithographieeigenschaften während der Gateelektrode in Halbleitern mit einer ausgeprägten Oberflächentopographie A method for improving the lithographic properties during the gate electrode in semiconductors with a pronounced surface topography |
| 02/07/2008 | DE102006035665A1 Feldeffekttransistor und Verfahren zur Herstellung eines Feldeffekttransistors Field effect transistor and method of manufacturing a field effect transistor |
| 02/07/2008 | DE102006035630A1 Verfahren zum Herstellen eines Halbleiterbauelements A method of manufacturing a semiconductor device |
| 02/07/2008 | DE102006031324B3 Verfahren zum Herstellen einer Kondensatorelektrodenstruktur A method for manufacturing a capacitor electrode structure |
| 02/07/2008 | DE102005055761B4 Leistungshalbleiterbauelement mit Halbleiterchipstapel in Brückenschaltung und Verfahren zur Herstellung desselben Power semiconductor component with the same semiconductor chip stack in a bridge circuit and methods for making |
| 02/07/2008 | DE102005053842B4 Halbleiterbauelement mit Verbindungselementen und Verfahren zur Herstellung desselben Of the same semiconductor device with connecting elements and methods for making |
| 02/07/2008 | DE102005052052B4 Ätzstoppschicht für Metallisierungsschicht mit verbesserter Haftung, Ätzselektivität und Dichtigkeit und Verfahren zur Herstellung eines dielektrischen Schichtstapels Etch stop layer for metallization having improved adhesion, etch selectivity and impermeability and methods for producing a dielectric layer stack |
| 02/07/2008 | DE102005018280B4 Verfahren zur Herstellung eines Halbleiterbauelements mit Bondhügelstrukturen und Halbleiterbauelement A process for producing a semiconductor device with bump structures and semiconductor component |
| 02/07/2008 | DE102004043282B4 Verfahren für die Justierung des Bondkopfs eines Die-Bonders A method for the adjustment of the bonding head of a die bonder |
| 02/07/2008 | DE102004035595B4 Verfahren zur Justage eines Projektionsobjektives Method for adjusting a projection objective |
| 02/07/2008 | DE102004031708B4 Verfahren zum Herstellen eines Substrats mit kristallinen Halbleitergebieten unterschiedlicher Eigenschaften A method for producing a substrate having crystalline semiconductor regions having different properties |
| 02/07/2008 | DE10008203B4 Verfahren zum Herstellen elektronischer Halbleiterbauelemente A method for producing electronic semiconductor devices |
| 02/06/2008 | EP1885168A1 Circuit substrate connection structure and circuit substrate connection method |
| 02/06/2008 | EP1885007A1 Laminated structure, production method of the same, multilayer circuit board, active matrix substrate, and electronic display |
| 02/06/2008 | EP1885000A2 Semiconductor devices including Schottky diodes with controlled breakdown and methods of fabricating same |
| 02/06/2008 | EP1884999A1 Semiconductor device and method for manufacturing same |
| 02/06/2008 | EP1884996A2 Substrate for electro-optical device, and electronic apparatus |