Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2008
02/12/2008US7329317 Method for producing silicon wafer
02/12/2008US7329312 Apparatus for supplying water containing dissolved gas
02/12/2008US7329171 Fixed abrasive article for use in modifying a semiconductor wafer
02/12/2008US7329079 Semiconductor wafer processing machine
02/12/2008US7329056 Device package and methods for the fabrication and testing thereof
02/12/2008US7329029 Optical device for LED-based lamp
02/12/2008US7328830 Structure and method for bonding to copper interconnect structures
02/12/2008US7328727 Substrate container with fluid-sealing flow passageway
02/12/2008US7328506 Method for forming a plated microvia interconnect
02/12/2008US7328490 Method for manufacturing a liquid jetting head
02/12/2008CA2467174C Differential stress reduction in thin films
02/12/2008CA2353479C Method and apparatus for low energy electron enhanced etching and cleaning of substrates
02/07/2008WO2008016851A1 Use of carbon co-implantation with millisecond anneal to produce ultra-shallow junctions
02/07/2008WO2008016818A2 System and method for manufacturing a thin-film device
02/07/2008WO2008016769A1 Method for fabricating an integrated gate dielectric layer for field effect transistors
02/07/2008WO2008016748A1 Bernoulli wand
02/07/2008WO2008016740A2 Interconnect structure and process of making the same
02/07/2008WO2008016514A2 Nand memory with silicon-rich charge storage layers and manufacturing method thereof using self-aligned shallow-trench isolation
02/07/2008WO2008016505A1 Method for forming a strained transistor by stress memorization based on a stressed implantation mask
02/07/2008WO2008016479A1 Flexible substrate with electronic devices formed thereon
02/07/2008WO2008016436A2 Wafer level package with cavities for active devices
02/07/2008WO2008016422A2 Methods and apparatuses for applying a protective material to an interconnect associated with a component
02/07/2008WO2008016376A2 Deletable nanotube circuit
02/07/2008WO2008016333A1 Integrated circuit package-on-package stacking system
02/07/2008WO2008016200A1 Plasma chamber cathode and outer ring made of silicon material
02/07/2008WO2008016143A1 Substrate processing apparatus and semiconductor device manufacturing method
02/07/2008WO2008016116A1 Annealing apparatus and annealing method
02/07/2008WO2008016110A1 Insulating layer, electronic device, field effect transistor, and polyvinylthiophenol
02/07/2008WO2008016061A1 Electronic circuit device and method for fabricating the same
02/07/2008WO2008016047A1 Film-forming method and film-forming apparatus
02/07/2008WO2008016044A1 Film-forming method and film-forming apparatus
02/07/2008WO2008016023A1 Gas supply device and board treatment apparatus
02/07/2008WO2008016004A1 Method for film formation, apparatus for film formation, computer program, and storage medium
02/07/2008WO2008015973A1 Defect detecting apparatus and defect detecting method
02/07/2008WO2008015962A1 Parallelism adjusting mechanism of probe card
02/07/2008WO2008015947A1 Organic transistor and active matrix display
02/07/2008WO2008015940A1 Semiconductor device and its fabrication method
02/07/2008WO2008015915A1 Heat treatment method and heat treatment apparatus
02/07/2008WO2008015914A1 Cvd film forming method and cvd film forming apparatus
02/07/2008WO2008015912A1 Substrate processing apparatus, program, recording medium and conditioning necessity determining method
02/07/2008WO2008015895A1 Cutting device, and cutting method
02/07/2008WO2008015881A1 Server device and program
02/07/2008WO2008015880A1 Server device and program
02/07/2008WO2008015876A1 Polymerizable compound having adamantane structure, process for production of the same, and resin composition
02/07/2008WO2008015853A1 Semiconductor device, and process and apparatus for manufacturing of electronic circuit
02/07/2008WO2008015852A1 Adhesive composition, and connection structure for circuit member
02/07/2008WO2008015848A1 Pattern forming method, metal oxide film forming material and method for using the metal oxide film forming material
02/07/2008WO2008015771A1 Support plate, method of detaching wafer, and method of thinning wafer
02/07/2008WO2008015766A1 Method for recovering forward voltage of bipolar semiconductor device, method for reducing lamination defect and bipolar semiconductor device
02/07/2008WO2008015765A1 Bipolar semiconductor device and process for producing the same
02/07/2008WO2008015759A1 Film adhesive, adhesive sheet, and semiconductor device using the same
02/07/2008WO2008015738A1 Substrate inspection and repair device, and substrate evaluation system
02/07/2008WO2008015658A2 Method and apparatus for determining measurement values
02/07/2008WO2008015649A1 Method of manufacturing a double gate transistor
02/07/2008WO2008015640A1 Process for fabricating an integrated electronic circuit incorporating a process requiring a voltage threshold between a metal layer and a substrate
02/07/2008WO2008015533A2 Porous dielectric layers obtained from pore -forming precursors
02/07/2008WO2008015500A1 Method and apparatus for improvements in chip manufacture and design
02/07/2008WO2008015230A1 Device for characterizing unique objects
02/07/2008WO2008015212A1 Novel hard mask structure for patterning features in semiconductor devices
02/07/2008WO2008015211A1 Effecting selectivity of silicon or silicon-germanium deposition on a silicon or silicon-germanium substrate by doping
02/07/2008WO2008014633A1 Apparatus, system, and method for wireless connection in integrated circuit packages
02/07/2008WO2008014630A1 Photosensitive materials and uses thereof
02/07/2008WO2007149210A3 Gas injection to etch a semiconductor substrate uniformly
02/07/2008WO2007145758A3 Selective epitaxial formation of semiconductor films
02/07/2008WO2007143025A3 Porous inorganic solids for use as low dielectric constant materials
02/07/2008WO2007142969B1 Isolation structures for integrated circuits and modular methods of forming the same
02/07/2008WO2007130710B1 Copper electrodeposition in microelectronics
02/07/2008WO2007126445A3 Method and system for patterning a dielectric film
02/07/2008WO2007118006A3 Method of forming mixed rare earth nitride and aluminum nitride films by atomic layer deposition
02/07/2008WO2007107757B1 Growth method using nanostructure compliant layers and hvpe for producing high quality compound semiconductor materials
02/07/2008WO2007096095A3 Etching solution and method for structuring a ubm layer system
02/07/2008WO2007024607A8 Multi-axis pick and place assembly
02/07/2008WO2006101578A8 Vapor phase treatment of dielectric materials
02/07/2008WO2006011607A8 Material for forming resist protective film and method for forming resist pattern using same
02/07/2008US20080032880 Process For Manufacturing Wafer Of Silicon Carbide Single Crystal
02/07/2008US20080032583 Dual panel type organic electroluminescent display device and method of fabricating the same
02/07/2008US20080032514 Method For Manufacturing Semiconductor Device, And Substrate Processing Apparatus
02/07/2008US20080032513 Integrated circuit system including nitride layer technology
02/07/2008US20080032512 Method forming silicon oxynitride gate dielectric layer with uniform nitrogen concentration
02/07/2008US20080032511 Semiconductor Device Manufacturing Method and Plasma Oxidation Treatment Method
02/07/2008US20080032510 Cmos sion gate dielectric performance with double plasma nitridation containing noble gas
02/07/2008US20080032509 Method for forming a nitrogen-containing gate insulating film
02/07/2008US20080032508 Method and Material For Forming A Double Exposure Lithography Pattern
02/07/2008US20080032507 Method of treating a mask layer prior to performing an etching process
02/07/2008US20080032506 Method of Forming a Mask Pattern
02/07/2008US20080032505 Polishing composition and polishing process
02/07/2008US20080032504 Polishing cloth and method of manufacturing semiconductor device
02/07/2008US20080032503 High nucleation density organometallic compounds
02/07/2008US20080032502 Safety features for semiconductor processing apparatus using pyrophoric precursor
02/07/2008US20080032501 Silicon on metal for mems devices
02/07/2008US20080032500 Substrate processing system and substrate processing method
02/07/2008US20080032499 Method for manufacturing contact structures of wiring
02/07/2008US20080032498 Method for fabricating metal line of semiconductor device
02/07/2008US20080032497 Preparing method of CNT-based semiconductor sensitized solar cell
02/07/2008US20080032496 Post passivation interconnection schemes on top of the IC chips
02/07/2008US20080032495 Ball transferring method and apparatus
02/07/2008US20080032494 Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
02/07/2008US20080032493 Semiconductor device
02/07/2008US20080032492 Method of manufacturing flash memory device
02/07/2008US20080032491 Wafer backside particle removal for track tools