Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2008
02/19/2008US7332037 Numerical jet machine for the application of a coating onto a substrate
02/19/2008US7332034 Coating apparatus and coating method using the same
02/19/2008US7332032 Precursor mixtures for use in preparing layers on substrates
02/19/2008US7332031 Bulk single crystal gallium nitride and method of making same
02/19/2008US7332030 Method of treating a part in order to alter at least one of the properties thereof
02/19/2008US7331844 Polishing method
02/19/2008US7331843 Substrate polishing method and method of manufacturing semiconductor device
02/19/2008US7331780 Heat treatment jig for semiconductor wafer
02/19/2008US7331751 Vacuum processing method
02/19/2008US7331737 Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip
02/19/2008US7331502 Method of manufacturing electronic part and electronic part obtained by the method
02/19/2008US7331500 Solder bumps formation using solder paste with shape retaining attribute
02/19/2008US7331495 Substrate and method of separating components from a substrate
02/19/2008US7331416 Oil-hydraulic vehicle
02/19/2008US7331307 Thermally sprayed member, electrode and plasma processing apparatus using the electrode
02/19/2008US7331306 Plasma processing method and apparatus
02/19/2008US7331250 Sensor device for non-intrusive diagnosis of a semiconductor processing system
02/19/2008US7331106 Underfill method
02/19/2008US7331103 Magazine, tray component feeding device, and component mounting device
02/19/2008US7331102 Apparatus for detecting an amount of strain and method for manufacturing same
02/19/2008US7331101 Method of fabricating a micro-electromechanical actuating mechanism
02/19/2008CA2397070C X-ray measuring and testing complex
02/19/2008CA2286433C Electrical hook-up process for igbt transistor chips mounted on an integrated circuit board
02/19/2008CA2228426C Biomaterial
02/14/2008WO2008019404A2 P-channel nanocrystalline diamond field effect transistor
02/14/2008WO2008019377A2 Method of separating semiconductor dies
02/14/2008WO2008019362A2 Controlling critical dimensions in track lithography tools
02/14/2008WO2008019329A2 Improved radiation immunity of integrated circuits using backside die contact and electrically conductive layers
02/14/2008WO2008019282A1 Improving cmos sion gate dielectric performance with double plasma nitridation containing noble gas
02/14/2008WO2008019277A2 Substrate bonding process with integrated vents
02/14/2008WO2008019268A2 Production of chain agglomerations of nano-scale metal particles
02/14/2008WO2008019252A1 Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing
02/14/2008WO2008019154A2 Methods of and systems for forming carbon based materials
02/14/2008WO2008019076A2 Substrate carrier enclosure
02/14/2008WO2008018994A1 Zirconium substituted barium titanate gate dielectrics
02/14/2008WO2008018981A2 Silicone resin and silicone composition
02/14/2008WO2008018956A2 Coating composition, article, and associated method
02/14/2008WO2008018900A2 Systems and methods for sensing properties of a workpiece and embedding a photonic sensor in metal
02/14/2008WO2008018748A1 Pogo pin, the fabrication method thereof and test socket using the same
02/14/2008WO2008018731A1 Device for supporting substrate
02/14/2008WO2008018664A1 Hardmask composition for resist underlayer film and process of producing semiconductor integrated circuit device using the same
02/14/2008WO2008018613A1 Semiconductor manufacturing apparatus
02/14/2008WO2008018580A1 Positive resist processing liquid composition and liquid developer
02/14/2008WO2008018557A1 Semiconductor package and method for manufacturing same, and sealing resin
02/14/2008WO2008018545A1 Substrate processing apparatus and semiconductor device manufacturing method
02/14/2008WO2008018537A1 Disc wafer inspecting device and inspecting method
02/14/2008WO2008018490A1 Method for forming conductive film, thin film transistor, panel with thin film transistor, and method for manufacturing thin film transistor
02/14/2008WO2008018478A1 Junction structure of device
02/14/2008WO2008018463A1 Defect inspecting method and defect inspecting apparatus
02/14/2008WO2008018432A1 Silicon carbide semiconductor device and method for manufacturing the same
02/14/2008WO2008018419A1 Semiconductor manufacturing apparatus and semiconductor manufacturing method
02/14/2008WO2008018392A1 Method for manufacturing electronic circuit component
02/14/2008WO2008018379A1 Resin sealing apparatus
02/14/2008WO2008018342A1 Silicon carbide semiconductor device and method for fabricating the same
02/14/2008WO2008018341A1 Electrostatic chuck device
02/14/2008WO2008018304A1 Method for forming insulating film, apparatus for forming insulating film, method for manufacturing semiconductor device, semiconductor device and surface treatment method for silicon carbide substrate
02/14/2008WO2008018302A1 Aluminum nitride sintered body and method for producing the same
02/14/2008WO2008018296A1 Laminated structure, electronic element using the same, manufacturing method therefor, electronic element array, and display unit
02/14/2008WO2008018295A1 Substrate processing method and substrate processing apparatus
02/14/2008WO2008018291A1 Plasma processing method and plasma processing apparatus
02/14/2008WO2008018286A1 Probe card cassette and probe card
02/14/2008WO2008018285A1 Substrate transferring apparatus, substrate processing apparatus, substrate transferring arm and substrate transferring method
02/14/2008WO2008018265A1 Semiconductor substrate, method for forming electrode, and method for manufacturing solar cell
02/14/2008WO2008018251A1 Cleaning member, delivery member with cleaning function, and method of cleaning substrate processing apparatus
02/14/2008WO2008018246A1 Cleaning member, delivery member with cleaning function, and method of cleaning substrate processing apparatus
02/14/2008WO2008018237A1 GaxIn1-xN SUBSTRATE AND GaxIn1-xN SUBSTRATE CLEANING METHOD
02/14/2008WO2008018164A1 Method and device for separation of support plate from wafer
02/14/2008WO2008018134A1 Process for producing polycrystalline semiconductor thin-film
02/14/2008WO2008018026A2 Active matrix displays and other electronic devices having plastic substrates
02/14/2008WO2008017733A1 Ion beam etching method and ion beam etching apparatus
02/14/2008WO2008017619A1 Method for producing an electric functional layer on a surface of a substrate
02/14/2008WO2008017457A1 Light modulators comprising si-ge quantum well layers
02/14/2008WO2008017320A1 Method for producing a doped iii-n solid crystal and a free-standing doped iii-n substrate, and doped iii-n solid crystal and free-standing doped iii-n substrate
02/14/2008WO2008017232A1 Substrate and process for semiconductor flip chip package
02/14/2008WO2008017186A2 Anisotropic magnetic elements for spintronic devices
02/14/2008WO2008017143A1 Method of fabricating semiconductor devices on a group iv substrate with controlled interface properties and diffusion tails
02/14/2008WO2008002521A3 Semiconductor heterojunction devices based on sic
02/14/2008WO2007146777A3 Method of manufacturing gate sidewalls that avoids recessing
02/14/2008WO2007143072A3 Wet etch suitable for creating square cuts in si and resulting structures
02/14/2008WO2007143058A3 Methods for trapping charge in a microelectromechanical system and microelectromechanical system employing same
02/14/2008WO2007143009A3 Self aligned gate and guard ring structure for use in a sit
02/14/2008WO2007140455A3 System and method for semiconductor processing
02/14/2008WO2007140425A3 Process chamber for dielectric gapfill
02/14/2008WO2007135514A3 Liquid ring pumping and reclamation systems in a processing environment
02/14/2008WO2007126393A3 An improved net table
02/14/2008WO2007114974A3 Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species
02/14/2008WO2007103224A3 Structure and method of making lidded chips
02/14/2008WO2007095438A3 Low resistance gate for power mosfet applications and method of manufacture
02/14/2008US20080040064 Surface inspection apparatus and surface inspection method
02/14/2008US20080038999 Retaining ring with conductive portion
02/14/2008US20080038995 Periodic Acid Compositions For Polishing Ruthenium/Low K Substrates
02/14/2008US20080038994 Method to passivate conductive surfaces during semiconductor processing
02/14/2008US20080038937 Method for reducing hot carrier effect of mos transistor
02/14/2008US20080038936 Method to form ultra high quality silicon-containing compound layers
02/14/2008US20080038935 Aperture masks for circuit fabrication
02/14/2008US20080038934 Materials and methods of forming controlled void
02/14/2008US20080038933 Plasma and electron beam etching device and method
02/14/2008US20080038932 Method for Selective Etching
02/14/2008US20080038931 Method of manufacturing a capacitor deep trench and of etching a deep trench opening
02/14/2008US20080038930 Method of ashing an object and apparatus for performing the same