Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2008
02/14/2008US20080037858 Simultaneous computation of multiple points on one or multiple cut lines
02/14/2008US20080037602 Method and system for a laser diode bar array assembly
02/14/2008US20080037349 Ultra low-cost solid-state memory
02/14/2008US20080037323 Semiconductor integrated circuit and nonvolatile memory element
02/14/2008US20080037319 Methods for identifying non-volatile memory elements with poor subthreshold slope or weak transconductance
02/14/2008US20080037316 Multi-valued logic/memory cells and methods thereof
02/14/2008US20080037200 Multi-Level Thin Film Capacitor on a Ceramic Substrate and Method of Manufacturing the Same
02/14/2008US20080037196 Electrostatic chuck
02/14/2008US20080037195 Electrostatic chuck
02/14/2008US20080037194 Electrostatic Chuck
02/14/2008US20080036988 Lithographic apparatus, level sensor, method of inspection, device manufacturing method, and device manufactured thereby
02/14/2008US20080036987 Manufacturing method of display device and exposure system for that
02/14/2008US20080036986 Photomask, method and apparatus that uses the same, photomask pattern production method, pattern formation method, and semiconductor device
02/14/2008US20080036981 Stage Device And Exposure Apparatus
02/14/2008US20080036959 Spacers for display devices
02/14/2008US20080036949 Substrate for a display apparatus
02/14/2008US20080036935 Semiconductor device and method of manufacturing thereof
02/14/2008US20080036899 Target workpiece inspection apparatus, image alignment method, and computer-readable recording medium with program recorded thereon
02/14/2008US20080036809 Liquid ejecting apparatus
02/14/2008US20080036479 Probe and Method of Manufacturing Probe
02/14/2008US20080036362 Light-Emitting Device, Light-Emitting Module, Display Unit, Lighting Unit and Method for Manufacturing Light-Emitting Device
02/14/2008US20080036155 Ferrofluid Seal Unit Used on Vertical Thermal Processing Furnace System for Semiconductor Wafer
02/14/2008US20080036101 Metal telluride nanocrystals and synthesis thereof
02/14/2008US20080036097 Semiconductor package, method of production thereof and encapsulation resin
02/14/2008US20080036096 Semiconductor Multi-Package Module Having Package Stacked Over Die-Up Flip Chip Ball Grid Array Package and Having Wire Bond Interconnect Between Stacked Packages
02/14/2008US20080036095 Semiconductor device and method of fabricating the same
02/14/2008US20080036093 Method for embedding a component in a base
02/14/2008US20080036092 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner
02/14/2008US20080036091 Semiconductor integrated circuit device
02/14/2008US20080036089 Semiconductor device having multilayer wiring structure
02/14/2008US20080036087 Web process interconnect in electronic assemblies
02/14/2008US20080036086 Semiconductor device and method for manufacturing the same
02/14/2008US20080036084 Laser release process for very thin Si-carrier build
02/14/2008US20080036083 Semiconductor device and method of manufacturing the same
02/14/2008US20080036082 Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
02/14/2008US20080036079 Conductive connection structure formed on the surface of circuit board and manufacturing method thereof
02/14/2008US20080036078 Wirebond-less semiconductor package
02/14/2008US20080036073 Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities
02/14/2008US20080036072 Secmiconductor device and method for manufacturing a semiconductor device
02/14/2008US20080036069 Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device
02/14/2008US20080036068 Stacked Module Systems and Methods
02/14/2008US20080036065 Electronic device and method for producing a device
02/14/2008US20080036064 Semiconductor device
02/14/2008US20080036056 Flip chip in leaded molded package and method of manufacture thereof
02/14/2008US20080036055 Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
02/14/2008US20080036054 Packaging System For Semiconductor Devices
02/14/2008US20080036050 Package with solder-filled via holes in molding layers
02/14/2008US20080036049 Stacked integration module and method for manufacturing the same
02/14/2008US20080036048 Semiconductor junction device having reduced leakage current and method of forming same
02/14/2008US20080036047 Low voltage transient voltage suppressor with reduced breakdown voltage
02/14/2008US20080036045 Package-base structure of power semiconductor device and manufacturing process of the same
02/14/2008US20080036044 Semiconductor optical device and manufacturing method therefor
02/14/2008US20080036041 Production Of Semiconductor Substrates With Buried Layers By Joining (Bonding) Semiconductor Wafers
02/14/2008US20080036040 Semiconductor Wafers With Highly Precise Edge Profile And Method For Producing Them
02/14/2008US20080036039 New Structure for Microelectronics and Microsystem and Manufacturing Process
02/14/2008US20080036038 PULSED GROWTH OF CATALYST-FREE GROWITH OF GaN NANOWIRES AND APPLICATION IN GROUP III NITRIDE SEMICONDUCTOR BULK MATERIAL
02/14/2008US20080036034 Lead Frame with Included Passive Devices
02/14/2008US20080036033 One-time programmable memory
02/14/2008US20080036031 Fuse box for semiconductor device and method of forming same
02/14/2008US20080036030 Process for manufacturing a wafer by annealing of buried channels
02/14/2008US20080036028 Dual trench isolation for cmos with hybrid orientations
02/14/2008US20080036026 Metal line of image sensor
02/14/2008US20080036024 Image sensors and methods of manufacturing the same
02/14/2008US20080036017 Method and structure to use an etch resistant liner on transistor gate structure to achieve high device performance
02/14/2008US20080036015 Semiconductor devices with sealed, unlined trenches and methods of forming same
02/14/2008US20080036014 Semiconductor device and method of fabricating the same
02/14/2008US20080036013 Semiconductor device and method for fabricating the same
02/14/2008US20080036010 Semiconductor device and manufacturing method thereof
02/14/2008US20080036008 Semiconductor device and method for manufacturing the same
02/14/2008US20080036007 Method of forming nitride films with high compressive stress for improved pfet device performance
02/14/2008US20080036006 Semiconductor device having analog transistor with improved operating and flicker noise characteristics and method of making same
02/14/2008US20080036004 Semiconductor apparatus with improved esd withstanding voltage
02/14/2008US20080036002 Semiconductor device and method of fabricating semiconductor device
02/14/2008US20080036001 Semiconductor devices having field effect transistors
02/14/2008US20080036000 PLANAR DUAL-GATE FIELD EFFECT TRANSISTORS (FETs)
02/14/2008US20080035999 Thin-film transistor display devices having composite electrodes
02/14/2008US20080035997 Fin Field-Effect Transistor and Method for Fabricating a Fin Field-Effect Transistor
02/14/2008US20080035996 Semiconductor device and method of manufacturing the same
02/14/2008US20080035994 Semiconductor Device and Method of Manufacturing the Same
02/14/2008US20080035990 Semiconductor device and method of manufacturing the same
02/14/2008US20080035989 Fabricating process and structure of trench power semiconductor device
02/14/2008US20080035986 Semiconductor device and method of fabricating the same
02/14/2008US20080035985 Semiconductor device and method of manufacturing the same
02/14/2008US20080035984 Flash memory device and method of fabricating the same
02/14/2008US20080035983 Nanoscale floating gate and methods of formation
02/14/2008US20080035981 One time programmable memory and the manufacturing method thereof
02/14/2008US20080035979 Capacitive electrode having semiconductor layers with an interface of separated grain boundaries
02/14/2008US20080035976 Semiconductor device having box-shaped cylindrical storage nodes and fabrication method thereof
02/14/2008US20080035975 Semiconductor memory device and manufacturing method thereof
02/14/2008US20080035974 High performance system-on-chip using post passivation process
02/14/2008US20080035972 High performance system-on-chip using post passivation process
02/14/2008US20080035971 Thin film transistor array panel for a liquid crystal display and method for manufacturing the same
02/14/2008US20080035969 CMOS image sensors and methods of forming the same
02/14/2008US20080035967 CMOS Image Sensor and Manufacturing Method Thereof
02/14/2008US20080035966 Cmos image sensor and method of driving the same
02/14/2008US20080035964 Cmos image sensor
02/14/2008US20080035962 Semiconductor Device And Method of Manufacturing the Same
02/14/2008US20080035960 Electromechanical memory devices and methods of manufacturing the same
02/14/2008US20080035959 Chip scale package for power devices and method for making the same
02/14/2008US20080035956 Memory device with non-orthogonal word and bit lines
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