| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/14/2008 | US20080035955 Semiconductor device and method for manufacturing the same |
| 02/14/2008 | US20080035954 Semiconductor device |
| 02/14/2008 | US20080035953 Gallium nitride-based light emitting diode and method of manufacturing the same |
| 02/14/2008 | US20080035951 Selective growth method, nitride semiconductor light emitting device and manufacturing method of the same |
| 02/14/2008 | US20080035950 Method to make low resistance contact |
| 02/14/2008 | US20080035943 Device chip carriers, modules, and methods of forming thereof |
| 02/14/2008 | US20080035940 Selective smile formation under transfer gate in a CMOS image sensor pixel |
| 02/14/2008 | US20080035939 Method of fabricating semiconductor devices on a group iv substrate with controlled interface properties and diffusion tails |
| 02/14/2008 | US20080035937 Array Substrate and Method of Manufacturing the Same |
| 02/14/2008 | US20080035933 Thin film transistor array substrate, manufacturing method thereof and display device |
| 02/14/2008 | US20080035932 Thin film transistor and organic electroluminescence display using the same |
| 02/14/2008 | US20080035930 Thin film transistor substrate, manufacturing method of thin film transistor, and display device |
| 02/14/2008 | US20080035928 Vertical electromechanical memory devices and methods of manufacturing the same |
| 02/14/2008 | US20080035926 Display device and display device manufacturing method |
| 02/14/2008 | US20080035925 Liquid crystal display device and manufacturing method thereof |
| 02/14/2008 | US20080035920 Thin-film transistor array, method of fabricating the same, and liquid crystal display device including the same |
| 02/14/2008 | US20080035918 Organic thin-film transistor and method for manufacturing the same |
| 02/14/2008 | US20080035917 Array substrate for liquid crystal display device and method of fabricating the same |
| 02/14/2008 | US20080035912 Field-Effect Transistor, Method of Manufacturing the Same, and Electronic Device Using the Same |
| 02/14/2008 | US20080035909 Method for controlling color contrast of a multi-wavelength light-emitting diode |
| 02/14/2008 | US20080035906 Germanium compound, semiconductor device fabricated using the same, and methods of forming the same |
| 02/14/2008 | US20080035614 Energy efficient, laser-based method and system for processing target material |
| 02/14/2008 | US20080035609 System And Method for Selective Etching Of Silicon Nitride During Substrate Processing |
| 02/14/2008 | US20080035608 Surface processing apparatus |
| 02/14/2008 | US20080035607 Method and Apparatus for the Etching of Microstructures |
| 02/14/2008 | US20080035273 System and method for decapsulating an encapsulated object |
| 02/14/2008 | US20080035199 Process for Producing Light Absorbing Layer for Chalcopyrite Type Thin-Film Solar Cell |
| 02/14/2008 | US20080035198 Method for the Contact Separation of Electrically-Conducting Layers on the Back Contacts of Solar Cells and Corresponding Solar Cells |
| 02/14/2008 | US20080035061 Fabricating A Semiconductor Device |
| 02/14/2008 | US20080035058 Plasma Processing Unit |
| 02/14/2008 | US20080035052 Method for manufacturing a semiconductor substrate |
| 02/14/2008 | DE4392931B4 Fluidheizvorrichtung Fluid heating apparatus |
| 02/14/2008 | DE112007000010T5 Halbleitervorrichtung mit IGBT-Zelle und Diodenzelle, sowie Verfahren zur Gestaltung hiervon A semiconductor device comprising IGBT cell and diode cell, and methods thereof for the design of |
| 02/14/2008 | DE112006000995T5 Halbleiterpackungs-Aufnahmevorrichtung Semiconductor package pickup apparatus |
| 02/14/2008 | DE112006000832T5 Trenched-Gate-Feldeffekttransistoren und Verfahren zum Bilden derselben Trenched-gate field effect transistors and methods of forming the same |
| 02/14/2008 | DE112006000558T5 Schmale Halbleitergrabenstruktur Narrow grave semiconductor structure |
| 02/14/2008 | DE10360537B4 Verfahren zum Ausbilden tiefer Isolationsgräben bei der Herstellung integrierter Schaltungen A method of forming deep isolation trenches in the manufacture of integrated circuits |
| 02/14/2008 | DE10333557B4 Verfahren zur Herstellung einer Speichereinrichtung, Speicherzelle, Speichereinrichtung und Verfahren zum Betrieb der Speichereinrichtung A method of manufacturing a memory device, memory cell memory device and method of operating the memory device |
| 02/14/2008 | DE10314876B4 Verfahren zum mehrstufigen Herstellen von Diffusionslötverbindungen und seine Verwendung für Leistungsbauteile mit Halbleiterchips A method for multistage manufacturing Diffusionslötverbindungen and its use for power devices with semiconductor chips |
| 02/14/2008 | DE10234162B4 Verfahren zur Herstellung eines organischen Bauelements A method for producing an organic device |
| 02/14/2008 | DE10228771B4 Verfahren zur Planarisierung mit definierbarer Planarisierungslänge in integrierten Halbleiterschaltungen und derartige integrierte Halbleiterschaltung Method for planarization with definable planarization length in semiconductor integrated circuits and such semiconductor integrated circuit |
| 02/14/2008 | DE102007036348A1 Verfahren zum Korrigieren einer kritischen Abmessung in einem Srukturelement mit hohem Seitenverhältnis A method of correcting a critical dimension in a Srukturelement high aspect ratio |
| 02/14/2008 | DE102007036268A1 Halbleiterbauelement Semiconductor device |
| 02/14/2008 | DE102007033633A1 Halbleiteranordnungen und Verfahren zur Herstellung derselben Semiconductor devices and methods of manufacturing the same |
| 02/14/2008 | DE102007027658A1 Selektives Wachstumsverfahren, Nitrid-Halbleiterleuchtvorrichtung und Verfahren zu deren Herstellung Selective growth method, the nitride semiconductor light-emitting device and process for their preparation |
| 02/14/2008 | DE102007005780A1 Verbundstruktur für die Mikrolithographie und optische Anordnung Composite structure for microlithography and optical assembly |
| 02/14/2008 | DE102006037789A1 Separating semiconducting devices from semiconducting wafer involves etching separating trenches in first surface, reducing wafer from second main surface until reduced second surface reaches trenches, semiconducting devices are separated |
| 02/14/2008 | DE102006037652A1 Expanded silicon substrate for the production of sensors/solar cell or for the production of further substrates, consists of monocrystalline regions having a uniform crystal orientation to its respective surface-normal |
| 02/14/2008 | DE102006037587A1 Semiconducting component protection structure has substrate configured above second buffer coating so second buffer coating essentially encloses entire substrate to reduce substrate damage if external force is exerted on side of substrate |
| 02/14/2008 | DE102006037532A1 Verfahren zur Erzeugung einer elektrischen Funktionsschicht auf einer Oberfläche eines Substrats A method for generating an electrical functional layer on a surface of a substrate |
| 02/14/2008 | DE102006037512A1 Stacked module of semiconductor chips has elastic spheres, for movement, compressed between the layers by fasteners in a compact structure |
| 02/14/2008 | DE102006037198A1 Wafer bonding, as a flip chip, has a metallic layer on one or both surfaces to be pressed together and pressure sintered |
| 02/14/2008 | DE102006035875A1 Verfahren zur Herstellung eines Fuse-Elements, eines Fuse-Speicherelements oder eines Widerstandselements A process for the preparation of a fuse element, a fuse memory element or a resistive element |
| 02/14/2008 | DE102006035864A1 Verfahren zur Herstellung einer elektrischen Durchkontaktierung A method for producing an electrical plated-through hole |
| 02/14/2008 | DE102006035645A1 Verfahren zum Ausbilden einer elektrisch leitfähigen Leitung in einem integrierten Schaltkreis A method of forming an electrically conductive line in an integrated circuit |
| 02/14/2008 | DE102006035644A1 Verfahren zum Reduzieren der Kontamination durch Vorsehen einer zu entfernenden Polymerschutzschicht während der Bearbeitung von Mikrostrukturen A method for reducing the contamination by providing a polymeric protective layer to be removed during processing of microstructures |
| 02/14/2008 | DE102006033073B3 Verfahren zur Schaffung einer hitze- und stoßfesten Verbindung des Baugruppen-Halbleiters und zur Drucksinterung vorbereiteter Halbleiterbaustein A method of providing a heat and impact resistant connection of the module-type semiconductor and pressure sintering prepared semiconductor device |
| 02/14/2008 | DE102004021227B4 Einmalig beschreibbarer Halbleiterspeicher auf der Basis molekularer selbstorganisierter Monolagen Write once semiconductor memory based on molecular self-assembled monolayers |
| 02/14/2008 | DE10103966B4 Verfahren zum Anordnen eines Halbleiterchips auf einem Substrat und zum Anordnen auf einem Substrat angepaßte Halbleitervorrichtung A method for disposing a semiconductor chip on a substrate and adapted for mounting on a substrate the semiconductor device |
| 02/14/2008 | CA2657504A1 Method of fabricating semiconductor devices on a group iv substrate with controlled interface properties and diffusion tails |
| 02/13/2008 | EP1887846A1 Printed wiring board |
| 02/13/2008 | EP1887845A1 Printed wiring board |
| 02/13/2008 | EP1887841A1 Plasma generating apparatus and plasma generating method |
| 02/13/2008 | EP1887631A1 Semiconductor device and method for manufacturing same |
| 02/13/2008 | EP1887624A1 Semiconductor device and method for manufacturing same |
| 02/13/2008 | EP1887622A2 Capacitor built-in substrate and method of manufacturing the same and electronic component device |
| 02/13/2008 | EP1887620A1 Mounting structure for ic tag and ic chip for mounting purpose |
| 02/13/2008 | EP1887619A2 MIS transistors with different gate electrodes or gate oxides and method for manufacturing the same |
| 02/13/2008 | EP1887618A1 Group iii-v nitride compound semiconductor device and electrode-forming method |
| 02/13/2008 | EP1887617A2 Deposition method over mixed substrates using trisilane |
| 02/13/2008 | EP1887616A2 Surface finishing of SOI substrates using an EPI process |
| 02/13/2008 | EP1887615A1 Sensor calibration method, exposure method, exposure device, device fabrication method, and reflection type mask |
| 02/13/2008 | EP1887614A1 Patterning method |
| 02/13/2008 | EP1887613A1 Bonded wafer manufacturing method and apparatus for grinding outer circumference of bonded wafer |
| 02/13/2008 | EP1887612A1 Process for manufacture of bonded wafer |
| 02/13/2008 | EP1887611A1 Opening/closing structure for container for conveying thin plate |
| 02/13/2008 | EP1886989A1 Calixresorcinarene compound, photoresist base comprising the same, and composition thereof |
| 02/13/2008 | EP1886759A1 Water-soluble preflux and use thereof |
| 02/13/2008 | EP1886377A1 Semiconductor device |
| 02/13/2008 | EP1886355A1 Semiconductor device |
| 02/13/2008 | EP1886354A1 A semiconductor device featuring an arched structure strained semiconductor layer |
| 02/13/2008 | EP1886352A2 Gallium nitride material structures including substrates and methods associated with the same |
| 02/13/2008 | EP1886342A2 Improved amorphization/templated recrystallization method for hybrid orientation substrates |
| 02/13/2008 | EP1886341A1 Polar fluid removal from surfaces using supercritical fluids |
| 02/13/2008 | EP1886340A2 Methods for forming arrays of small, closely spaced features |
| 02/13/2008 | EP1886339A1 Method and apparatus for hydrogenation of thin film silicon on glass |
| 02/13/2008 | EP1886261A1 Semiconductor device |
| 02/13/2008 | EP1886191A2 Optical imaging arrangement |
| 02/13/2008 | EP1886159A2 Method for analyzing an integrated circuit, apparatus and integrated circuit |
| 02/13/2008 | EP1885918A1 Controlled polarity group iii-nitride films and methods of preparing such films |
| 02/13/2008 | EP1885658A2 Method of making scratch resistant coated glass article including layer(s) resistant to fluoride-based etchant(s) |
| 02/13/2008 | EP1885406A2 Active material emitting device |
| 02/13/2008 | EP1572856B1 Cleaning agent composition, cleaning and production methods for semiconductor wafer |
| 02/13/2008 | EP1569759B1 Method and apparatus for control of layer thicknesses |
| 02/13/2008 | EP1540665A4 Photolithography mask repair |
| 02/13/2008 | EP1428075A4 Method for high resolution patterning using low-energy electron beam, process for preparing nano device using the method |
| 02/13/2008 | EP1428074A4 Method for high resolution patterning using soft x-ray, process for preparing nano device using the method |
| 02/13/2008 | EP1414718A4 Protective shipper |
| 02/13/2008 | EP1319239B1 Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto |
| 02/13/2008 | EP1252658A4 Silicon nanoparticle field effect transistor and transistor memory device |