Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2008
02/13/2008CN101123194A Method of dry etching oxide semiconductor film
02/13/2008CN101123193A Manufacture of thin-film semiconductor device
02/13/2008CN101123192A Method of fabricating lateral double diffused metal oxide semiconductor field effect transistor
02/13/2008CN101123191A A non extension method for making high-voltage part groove
02/13/2008CN101123190A Method for cleaning residual metal
02/13/2008CN101123189A Dielectric block material including metal compound particle and its forming method
02/13/2008CN101123188A Semiconductor wafers with highly precise edge profile and method for producing them
02/13/2008CN101123187A A method for optimizing thickness of high-temperature chemical gas phase sediment oxide of separated bar part
02/13/2008CN101123186A Making method for grid structure
02/13/2008CN101123185A Making method for grid structure
02/13/2008CN101123184A Semiconductor thin film manufacturing method and device, beam-shaping mask, and thin film transistor
02/13/2008CN101123183A Semiconductor thin film manufacturing method and device, beam-shaping mask, and thin film transistor
02/13/2008CN101123182A Pattern forming method and apparatus
02/13/2008CN101123181A Pattern forming method and apparatus
02/13/2008CN101123180A Fin structure and method of manufacturing fin transistor adopting the fin structure
02/13/2008CN101123179A Control method for extension slice equability for 6 inch As back lining MOS part
02/13/2008CN101123178A Plasma processing device
02/13/2008CN101123177A Vacuum processing apparatus
02/13/2008CN101123176A Vacuum processing apparatus
02/13/2008CN101123175A Semiconductor wafer holding method, semiconductor wafer holding apparatus and semiconductor wafer holding structure
02/13/2008CN101123174A Vacuum processing device, diagnostic method for static electricity chuck and storing medium
02/13/2008CN101123173A Spraying and erosion local protection method and device for semiconductor part chip table
02/13/2008CN101123172A Removal method for welding assisted agent residuals
02/13/2008CN101123171A Forming method for thin film coated layer
02/13/2008CN101123170A Method for RTA constant temperature measurement and its used measurement and control wafer
02/13/2008CN101123169A Making method for storage capacitor
02/13/2008CN101123168A Thin film peel-off device
02/13/2008CN101122969A Electronic label chip carrier tape (STRAP) module package process
02/13/2008CN101122752A Centering device and exposure device
02/13/2008CN101122751A Liquid reclamation device for developing machine platform and the developing machine platform comprising same
02/13/2008CN101122749A Method of forming photoresist pattern
02/13/2008CN101122736A An improved CPL mask and a method and program product for generating the same
02/13/2008CN101122735A Photomask, exposing method and instrument, image manufacturing and forming method, and semiconductor device
02/13/2008CN101122724A Liquid crystal display and its manufacture method
02/13/2008CN101122719A Array substrate for liquid crystal display device and method of fabricating the same
02/13/2008CN101122690A Display device and manufacturing method of the same
02/13/2008CN101122655A Optical waveguide and its manufacture method thereof
02/13/2008CN101122627A Semi-conducting material thermoelectricity performance test system
02/13/2008CN101122616A Contactor assembly
02/13/2008CN101122613A Carrier tray for use with prober
02/13/2008CN101122561A Back penetration measuring method for film base binding performance
02/13/2008CN101122026A Polysilicon planarization solution for planarizing low temperature polysilicon film panel
02/13/2008CN101122014A Method for forming medium film with gradual changed components
02/13/2008CN101122013A Purge gas unit and purge gas supply integrated unit
02/13/2008CN101122011A Methods for low temperature deposition of an amorphous carbon layer
02/13/2008CN101122009A Annealing treatment method for deposition ring
02/13/2008CN101121866A Pressure-sensitive adhesive sheets for wafer grinding and warp inhibiting
02/13/2008CN101121865A Compositions and methods for improved planarization of copper utilizing inorganic oxide abrasive
02/13/2008CN101121497A Carbon nano-tube composite material and preparation method thereof
02/13/2008CN101121466A Air table for conveying sheet material and conveyer with the same
02/13/2008CN101121247A Device for cleaning grinding head
02/13/2008CN101121246A Method for controlling chemical and mechanical grinding endpoint
02/13/2008CN101121245A Method for improving homogeneity of oxidation film CMP
02/13/2008CN101121244A Method for determining grinding time of chemical and mechanical grinding technology
02/13/2008CN101121243A Chemical and mechanical grinding method
02/13/2008CN101121242A Method for detecting chemical and mechanical flattening endpoint
02/13/2008CN101121241A Device and method for cleaning chemical and mechanical polishing equipment
02/13/2008CN101121240A Method for controlling CMP film thickness internal homogeneity
02/13/2008CN101121239A Chemical and mechanical grinding bench chemical liquid supplying device
02/13/2008CN101121237A Device for grinding and cutting wafer
02/13/2008CN101121222A Device for irradiating laser beam on amorphous silicon film
02/13/2008CN100369533C Wire soldering method for circuit board package
02/13/2008CN100369532C Module and method of manufacturing module
02/13/2008CN100369530C Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
02/13/2008CN100369339C Silicon-based DBR laser with standard integrated circuit compatible and its process
02/13/2008CN100369329C Anisotropic electrically conductive film and method of producing the same
02/13/2008CN100369268C Film transistor element and manufacturing method thereof
02/13/2008CN100369266C Controlled film transistor, its preparation method and electroluminescent display apparatus containing same
02/13/2008CN100369265C Three-dimensional multi-gate high-voltage P type transverse double-diffused metal-oxide semiconductor device
02/13/2008CN100369264C Three-dimensional multi-gate high-voltage N type transverse double-diffused metal-oxide semiconductor device
02/13/2008CN100369263C Semiconductor assembly with a high dielectric constant gate dielectric layer and producing method thereof
02/13/2008CN100369262C Field effect transistor, integrated circuit and manufacturing method
02/13/2008CN100369260C Quantum efficiency enhancement for cmos imaging sensor with borderless contact
02/13/2008CN100369257C Method for fabricating an nrom memory cell array
02/13/2008CN100369256C Capacitor array for increasing memory capacitance on semiconductor base plate
02/13/2008CN100369255C Ferroelectric capacitor and method of manufacturing the same
02/13/2008CN100369254C 半导体集成电路器件 The semiconductor integrated circuit device
02/13/2008CN100369253C Semiconductor integrated circuit device, its manufacturing method and action method
02/13/2008CN100369251C Device junction structure
02/13/2008CN100369250C Semiconductor integrated circuit
02/13/2008CN100369249C Semiconductor device and method of manufacturing the same, electronic device, electronic instrument
02/13/2008CN100369248C Stack MCP and manufacturing method thereof
02/13/2008CN100369242C Pre-soldering arrangement for semiconductor packaging substrate and method for making same
02/13/2008CN100369241C Packaging structure of cubic flat pin-free type chips and packaging process thereof
02/13/2008CN100369239C Manufacturing method of a semiconductor integrated circuit device
02/13/2008CN100369238C Nrom semiconductor memory device and fabrication method
02/13/2008CN100369237C Technical method of front procedures for CMOS image sensor
02/13/2008CN100369236C Method for manufacturing high accuracy analog circuit chip
02/13/2008CN100369235C Machining substrates, particularly semiconductor wafers
02/13/2008CN100369234C Method for forming semiconductor device
02/13/2008CN100369233C Method of manufacture semiconductor component with low dielectric constant dielectric layer
02/13/2008CN100369232C Interspace technical method for implementing copper connecting lines in semiconductor device
02/13/2008CN100369231C Method for producing semi-conductor assembly
02/13/2008CN100369230C Processing method and processing appts
02/13/2008CN100369229C Process controller for semiconductor manufacturing
02/13/2008CN100369228C Method for detecting interface defects of silicon bonding wafer
02/13/2008CN100369227C Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method
02/13/2008CN100369226C Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method
02/13/2008CN100369225C Testing apparatus, system and method for testing contact between semiconductor and carrier
02/13/2008CN100369224C Chip with built-in software and hardware system and making method thereof