Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2008
02/19/2008US7332442 Systems and methods for forming metal oxide layers
02/19/2008US7332441 Passivation of porous semiconductors
02/19/2008US7332440 Wet etching apparatus and method
02/19/2008US7332439 Metal gate transistors with epitaxial source and drain regions
02/19/2008US7332438 Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool
02/19/2008US7332437 Method for processing semiconductor wafer and semiconductor wafer
02/19/2008US7332436 Process of removing residue from a precision surface using liquid or supercritical carbon dioxide composition
02/19/2008US7332435 Silicide structure for ultra-shallow junction for MOS devices
02/19/2008US7332434 Semiconductor device having diffusion barrier layer containing chrome and method for fabricating the same
02/19/2008US7332432 Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same
02/19/2008US7332431 Method of manufacturing semiconductor device
02/19/2008US7332430 Method for improving the mechanical properties of BOC module arrangements
02/19/2008US7332429 Laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates
02/19/2008US7332427 Method of forming an interconnection line in a semiconductor device
02/19/2008US7332426 Substrate processing method and fabrication process of a semiconductor device
02/19/2008US7332425 Simultaneous deposition and etch process for barrier layer formation in microelectronic device interconnects
02/19/2008US7332424 Fluxless solder transfer and reflow process
02/19/2008US7332423 Soldering a die to a substrate
02/19/2008US7332422 Surface of copper interconnect treated with a nitrogen and oxygen; treating with a NH3 or H2 plasma treatment under vacuun; cap layer is formed over the copper interconnect
02/19/2008US7332421 Method of fabricating gate electrode of semiconductor device
02/19/2008US7332420 Method for manufacturing semiconductor device
02/19/2008US7332419 Structure and method of fabricating a transistor having a trench gate
02/19/2008US7332418 High-density single transistor vertical memory gain cell
02/19/2008US7332417 Semiconductor structures with structural homogeneity
02/19/2008US7332416 Methods to manufacture contaminant-gettering materials in the surface of EUV optics
02/19/2008US7332415 Silicon wafer dividing method and apparatus
02/19/2008US7332414 Chemical die singulation technique
02/19/2008US7332413 Semiconductor wafers including one or more reinforcement structures and methods of forming the same
02/19/2008US7332412 Structure of strained silicon on insulator and method of manufacturing the same
02/19/2008US7332411 Systems and methods for wafer bonding by localized induction heating
02/19/2008US7332410 Method of epitaxial-like wafer bonding at low temperature and bonded structure
02/19/2008US7332409 Methods of forming trench isolation layers using high density plasma chemical vapor deposition
02/19/2008US7332408 Isolation trenches for memory devices
02/19/2008US7332407 Method and apparatus for a semiconductor device with a high-k gate dielectric
02/19/2008US7332406 Air gap interconnect structure and method
02/19/2008US7332405 Method of forming alignment marks for semiconductor device fabrication
02/19/2008US7332404 Method of fabricating capacitor having metal electrode
02/19/2008US7332403 System and method for providing a buried thin film resistor having end caps defined by a dielectric mask
02/19/2008US7332402 Method for optically trimming electronic components
02/19/2008US7332401 Method of fabricating an electrode structure for use in an integrated circuit
02/19/2008US7332400 Method of manufacturing a semiconductor device having a gate structure with low parasitic capacitance
02/19/2008US7332399 Method for manufacturing a semiconductor substrate and method for manufacturing a semiconductor in which film thicknesses can be accurately controlled
02/19/2008US7332398 Manufacture of trench-gate semiconductor devices
02/19/2008US7332397 Method for fabricating semiconductor device
02/19/2008US7332396 Semiconductor device with recessed trench and method of fabricating the same
02/19/2008US7332395 Method of manufacturing a capacitor
02/19/2008US7332394 Method to reduce a capacitor depletion phenomena
02/19/2008US7332393 Method of fabricating a cylindrical capacitor
02/19/2008US7332392 Trench-capacitor DRAM device and manufacture method thereof
02/19/2008US7332391 Method for forming storage node contacts in semiconductor device
02/19/2008US7332390 Semiconductor memory device and fabrication thereof
02/19/2008US7332389 Selective polysilicon stud growth
02/19/2008US7332388 Method to simultaneously form both fully silicided and partially silicided dual work function transistor gates during the manufacture of a semiconductor device, semiconductor devices, and systems including same
02/19/2008US7332387 MOSFET structure and method of fabricating the same
02/19/2008US7332386 Methods of fabricating fin field transistors
02/19/2008US7332385 Method of manufacturing a semiconductor device that includes gettering regions
02/19/2008US7332384 Technique for forming a substrate having crystalline semiconductor regions of different characteristics
02/19/2008US7332383 Switching device for a pixel electrode and methods for fabricating the same
02/19/2008US7332382 Thin film transistor and manufacturing method thereof
02/19/2008US7332381 Semiconductor device and method of manufacturing the same
02/19/2008US7332380 Pattern design method and program of a semiconductor device including dummy patterns
02/19/2008US7332379 Method of an array of structures sensitive to ESD and structure made therefrom
02/19/2008US7332378 Integrated circuit memory system with dummy active region
02/19/2008US7332377 Manufacturing method with self-aligned arrangement of solid body electrolyte memory cells of minimum structure size
02/19/2008US7332376 Method of encapsulating packaged microelectronic devices with a barrier
02/19/2008US7332375 Method of making an integrated circuit package
02/19/2008US7332374 Prealignment and gapping for RF substrates
02/19/2008US7332373 Method of manufacturing semiconductor device
02/19/2008US7332372 Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween
02/19/2008US7332371 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
02/19/2008US7332370 Method of manufacturing a phase change RAM device utilizing reduced phase change current
02/19/2008US7332369 Organic electronic devices
02/19/2008US7332368 Light guide for image sensor
02/19/2008US7332367 Bouncing mode operated scanning micro-mirror
02/19/2008US7332365 Method for fabricating group-III nitride devices and devices fabricated using method
02/19/2008US7332364 Method of fabricating a Zn-base semiconductor light emitting device
02/19/2008US7332363 Integrated battery pack with lead frame connection
02/19/2008US7332362 Method for inspecting semiconductor device
02/19/2008US7332361 Xerographic micro-assembler
02/19/2008US7332360 Early detection of metal wiring reliability using a noise spectrum
02/19/2008US7332359 Semiconductor device inspection method
02/19/2008US7332358 MOSFET temperature sensing
02/19/2008US7332357 Method for fabricating semiconductor device
02/19/2008US7332266 Coating that prevents effectively reflection particularly when an irradiating light with a wavelength of 193 nm is used for microfabrication, and that can be rapidly removed; for use in manufacture of a semiconductor device
02/19/2008US7332262 Forming amorphous carbon layer on semiconductor stack; etching; elimination of intermediate layer
02/19/2008US7332258 mixture a copolymer or terpolymer that is insoluble or slightly soluble in an alkali developer and becoming soluble in an alkali developer by an action of an acid, and acid generators, used in microlithography for production high capacity microelectronics
02/19/2008US7332252 Method of forming a mask layout and layout formed by the same
02/19/2008US7332250 Photomask
02/19/2008US7332212 Immersion of polytetrafluoroethylene dielectric layers in solutions comprising electroconductive polymers and intermetallic seeding materials, then rinsing, drying and coppering to form printed circuits or laminated chip carriers; electronics; printed circuit boards (PCBs), laminated chip carriers
02/19/2008US7332198 plating bath of a double bath structure including an inner bath holding a plating solution, and an outer bath surrounding the inner bath and is in communication with it; and a heater in the outer bath; uniform temperature control; especially for electroless deposition of copper or silver
02/19/2008US7332104 Slurry for CMP, polishing method and method of manufacturing semiconductor device
02/19/2008US7332098 Phase shift mask and fabricating method thereof
02/19/2008US7332068 Selective removal of dielectric materials and plating process using same
02/19/2008US7332066 Coating or coppering substrates such as semiconductor wafers in electrolytic cells to form electroconductive layers that are readily annealed at low temperatures; electrical and electronic apparatus
02/19/2008US7332056 Thin film removing device and thin film removing method
02/19/2008US7332055 Substrate processing apparatus
02/19/2008US7332054 Etch apparatus
02/19/2008US7332040 Semiconductor manufacturing system having a vaporizer which efficiently vaporizes a liquid material
02/19/2008US7332039 Plasma processing apparatus and method thereof
02/19/2008US7332038 Device for depositing in particular crystalline layers on one or more, in particular likewise crystalline substrates