| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/21/2008 | US20080042258 Package for semiconductor devices |
| 02/21/2008 | US20080042255 Chip package structure and fabrication method thereof |
| 02/21/2008 | US20080042253 Stack type ball grid array package and method for manufacturing the same |
| 02/21/2008 | US20080042244 Nitride Compound Semiconductor Element and Production Method Therefor |
| 02/21/2008 | US20080042241 Voltage-controlled semiconductor structure, resistor, and manufacturing processes thereof |
| 02/21/2008 | US20080042239 High performance system-on-chip using post passivation process |
| 02/21/2008 | US20080042238 High performance system-on-chip using post passivation process |
| 02/21/2008 | US20080042237 Semiconductor device and method of manufacturing the same |
| 02/21/2008 | US20080042236 Integrated circuit system employing gate shield and/or ground shield |
| 02/21/2008 | US20080042233 Semiconductor device having imprived electrical characteristics and method of manufacturing the same |
| 02/21/2008 | US20080042232 Isolation structures for integrated circuits and modular methods of forming the same |
| 02/21/2008 | US20080042230 Image sensor and fabrication method thereof |
| 02/21/2008 | US20080042229 Image Sensor and Method for Manufacturing the Same |
| 02/21/2008 | US20080042228 Image Sensor and Method for Manufacturing the Same |
| 02/21/2008 | US20080042226 Surface-shape sensor and method of manufacturing the same |
| 02/21/2008 | US20080042225 Ultrasonic transducer and manufacturing method |
| 02/21/2008 | US20080042224 Soi Disks Comprising Mems Structures and Filled Isolating Trenches Having a Defined Cross-Section |
| 02/21/2008 | US20080042222 Trench mosfet with copper metal connections |
| 02/21/2008 | US20080042220 Gate electrode forming method for semiconductor device |
| 02/21/2008 | US20080042218 Semiconductor memory device |
| 02/21/2008 | US20080042217 Array substrate for a liquid crystal display device and manufacturing method of the same |
| 02/21/2008 | US20080042216 Formation of standard voltage threshold and low voltage threshold mosfet devices |
| 02/21/2008 | US20080042213 Complementary metal-oxide-semiconductor transistor and method of manufacturing the same |
| 02/21/2008 | US20080042210 Semiconductor device and method of fabricating thereof |
| 02/21/2008 | US20080042208 Trench mosfet with esd trench capacitor |
| 02/21/2008 | US20080042206 Integrated circuit device having input/output electrostatic discharge protection cell equipped with electrostatic discharge protection element and power clamp |
| 02/21/2008 | US20080042205 Low-cost high-performance planar back-gate cmos |
| 02/21/2008 | US20080042203 Single and double-gate pseudo-fet devices for semiconductor materials evaluation |
| 02/21/2008 | US20080042200 Thin-film transistor and fabrication method thereof |
| 02/21/2008 | US20080042198 Demos structure |
| 02/21/2008 | US20080042196 Circuit and Method of Reducing Body Diode Reverse Recovery Time of Lateral Power Semiconductor Devices |
| 02/21/2008 | US20080042195 Semiconductor device including recessed-channel-array mosfet having a higher operational speed |
| 02/21/2008 | US20080042194 Trench mosfet with terraced gate and manufacturing method thereof |
| 02/21/2008 | US20080042193 Semiconductor device |
| 02/21/2008 | US20080042191 Non-volatile memory device and method of fabricating the same |
| 02/21/2008 | US20080042188 Nonvolatile semiconductor memory |
| 02/21/2008 | US20080042187 Flash Memory Device And A Method Of Fabricating The Same |
| 02/21/2008 | US20080042182 Capacitor and method of manufacturing the same |
| 02/21/2008 | US20080042176 Method for making image sensor with reduced etching damage |
| 02/21/2008 | US20080042175 Solid state image pickup device and method of producing solid state image pickup device |
| 02/21/2008 | US20080042174 Field effect transistors (fets) with inverted source/drain metallic contacts, and method of fabricating same |
| 02/21/2008 | US20080042173 Semiconductor device and method of manufacturing the same |
| 02/21/2008 | US20080042171 Transistor arrangement, sense-amplifier arrangement and methods of manufacturing the same via a phase shift mask |
| 02/21/2008 | US20080042170 Image Sensor and Method for Manufacturing the Same |
| 02/21/2008 | US20080042169 Doped plug for CCD gaps |
| 02/21/2008 | US20080042165 Semiconductor device and method for manufacturing semiconductor device |
| 02/21/2008 | US20080042162 Ultraviolet light-emitting device in which p-type semiconductor is used |
| 02/21/2008 | US20080042159 Transparent Electrode for Semiconductor Light-Emitting Device |
| 02/21/2008 | US20080042155 Semiconductor device, LED head and image forming apparatus |
| 02/21/2008 | US20080042154 Light-emitting device, method of fabricating the same, and electronic apparatus |
| 02/21/2008 | US20080042153 Wavelength conversion chip for use with light emitting diodes and method for making same |
| 02/21/2008 | US20080042152 Electronic device, display device, interface circuit and differential amplification device, which are constituted by using thin-film transistors |
| 02/21/2008 | US20080042143 Avalanche protection for wide bandgap devices |
| 02/21/2008 | US20080042138 Display device and method of making the same |
| 02/21/2008 | US20080042137 Electro-optical device, method for manufacturing electro-optical device, and electronic apparatus |
| 02/21/2008 | US20080042135 Thin-film transistor substrate, method of manufacturing the same and display apparatus having the same |
| 02/21/2008 | US20080042134 Array substrate for liquid crystal display device and method of fabricating the same |
| 02/21/2008 | US20080042133 Thin film transistor array substrate and method of fabricating the same |
| 02/21/2008 | US20080042132 Display panel and method for manufacturing the same |
| 02/21/2008 | US20080042126 Ballistic direct injection NROM cell on strained silicon structures |
| 02/21/2008 | US20080042121 METHOD FOR DEPOSITION OF MAGNESIUM DOPED (Al, In, Ga, B)N LAYERS |
| 02/21/2008 | US20080042120 Integrated circuit device, manufacturing method thereof, and display device |
| 02/21/2008 | US20080042118 Phase-change memory device with minimized reduction in thermal efficiency and method of manufacturing the same |
| 02/21/2008 | US20080042099 Solution for forming polishing slurry, polishing slurry and related methods |
| 02/21/2008 | US20080042077 Process and apparatus for post deposition treatment of low dielectric materials |
| 02/21/2008 | US20080042068 Exposure apparatus, exposure method, and method for producing device |
| 02/21/2008 | US20080042061 Method of alignment for efficient defect review |
| 02/21/2008 | US20080042044 Light Detecting Apparatus, Illumination Optical Apparatus, Exposure Apparatus and Exposure Method |
| 02/21/2008 | US20080041836 High temperature heating element for preventing contamination of a work piece |
| 02/21/2008 | US20080041831 Thermal flux processing by scanning a focused line beam |
| 02/21/2008 | US20080041820 Apparatus for reducing polymer deposition on a substrate and substrate support |
| 02/21/2008 | US20080041815 Spin-on protective coatings for wet-etch processing of microelectronic substrates |
| 02/21/2008 | US20080041714 Partially Oxidized Macroporous Silicon with Discontinuous Silicon Walls |
| 02/21/2008 | US20080041607 Microcomponent Comprising a Hermetically-Sealed Microcavity and Method for Production of Such a Microcomponent |
| 02/21/2008 | US20080041526 Single-sided etching |
| 02/21/2008 | US20080041525 Semiconductor device fabricating system |
| 02/21/2008 | US20080041517 Assembling Two Substrates by Molecular Adhesion, One of the Two Supporting an Electrically Conductive Film |
| 02/21/2008 | US20080041422 Semiconductor substrate cleaning system |
| 02/21/2008 | US20080041420 Substrate Cleaning Method and Computer Readable Storage Medium |
| 02/21/2008 | US20080041313 Gas delivery apparatus for atomic layer deposition |
| 02/21/2008 | US20080041159 Method and Appartus For Detection Of Mechanical Defects In An Ingot Piece Composed Of Semiconductor Material |
| 02/21/2008 | US20080040917 Component Supply Head Device And Component Mounting Head Device |
| 02/21/2008 | DE19882568B4 Behälter für Halbleiterwafer Container for semiconductor wafers |
| 02/21/2008 | DE112005001418T5 Halbleiterstruktur-Bearbeitung unter Verwendung von mehreren Laserstrahlpunkten Semiconductor structure editing using a plurality of laser beam spots |
| 02/21/2008 | DE10392392B4 Verfahren zur Herstellung einer integrierten Schaltung mit nichtflüchtigem Speicherbauelement ohne Bitleitungskurzschlüsse A method of manufacturing an integrated circuit nonvolatile memory device without Bitleitungskurzschlüsse |
| 02/21/2008 | DE10259634B4 Verfahren zur Herstellung von Kontakten auf einem Wafer A process for the production of contacts on a wafer |
| 02/21/2008 | DE10250538B4 Elektronisches Bauteil als Multichipmodul und Verfahren zu dessen Herstellung Electronic component as a multi-chip module and method of producing the |
| 02/21/2008 | DE102007038183A1 Resist pattern formation on semiconductor chip or circuit board, uses first and second photohardenable resist films sensitive to light in different wavelength regions to reduce illumination time |
| 02/21/2008 | DE102007035990A1 Verfahren zum Verbessern von Grenzflächenreaktionen an Halbleiteroberflächen A method for improving interfacial reactions at the semiconductor surfaces |
| 02/21/2008 | DE102007034959A1 Polierpad und Chemisch-Mechanische Poliervorrichtung Polishing and chemical-mechanical polishing apparatus |
| 02/21/2008 | DE102007034651A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 02/21/2008 | DE102006052202B3 Semiconductor component has metal layer comprising coherent section, and other metal layer is arranged on coherent section of former metal layer, where latter metal layer is structured between layered regions |
| 02/21/2008 | DE102006038875A1 Electronic unit manufacturing method, involves fastening semiconductor unit to carrier, and providing wire bond connection between semiconductor unit and carrier by applying conductive embossed contact sill on carrier |
| 02/21/2008 | DE102006038457A1 Verfahren und Vorrichtung zum Temperieren elektronischer Bauelemente Method and apparatus for tempering electronic components |
| 02/21/2008 | DE102006038171A1 Silicon-on-insulator complementary MOS semiconductor device e.g. insulated-gate bipolar transistor, manufacturing method, involves adjusting doping concentration with variation length to factor two, by implantation and tempering steps |
| 02/21/2008 | DE102006037538A1 Elektronisches Bauteil bzw. Bauteilstapel und Verfahren zum Herstellen eines Bauteils Electronic component or component stack and method for manufacturing a component |
| 02/21/2008 | DE102006037267A1 Halbleiterscheiben mit hochpräzisem Kantenprofil und Verfahren zu ihrer Herstellung Semiconductor wafers with high precision edge profile and process for their preparation |
| 02/21/2008 | DE102006037045A1 Manufacturing process for producing semiconductor device in semiconductor substrate, involves supporting auxiliary layer on substrate, where covering layer is supported on layer by surface oxidation of substrate and auxiliary layer |
| 02/21/2008 | DE102006030581B3 Verfahren zum Herstellen eines Bauelements A method of manufacturing a device |
| 02/21/2008 | DE102006017525B4 Speichervorrichtung und Verfahren zur Herstellung einer Speichervorrichtung Memory device and method of manufacturing a memory device |