Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2008
02/26/2008US7335546 Method and device for CMOS image sensing with separate source formation
02/26/2008US7335545 Control of strain in device layers by prevention of relaxation
02/26/2008US7335543 MOS device for high voltage operation and method of manufacture
02/26/2008US7335542 Semiconductor device with mushroom electrode and manufacture method thereof
02/26/2008US7335541 Method for fabricating thin film transistor using the mask for forming polysilicon including slit patterns deviated from each other
02/26/2008US7335540 Low temperature polysilicon thin film transistor and method of manufacturing the same
02/26/2008US7335539 Method for making thin-film semiconductor device
02/26/2008US7335538 Method for manufacturing bottom substrate of liquid crystal display device
02/26/2008US7335537 Method of manufacturing semiconductor device including bonding pad and fuse elements
02/26/2008US7335536 Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
02/26/2008US7335535 Method and apparatus for lubricating microelectromechanical devices in packages
02/26/2008US7335534 Semiconductor component and method of manufacture
02/26/2008US7335533 Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another
02/26/2008US7335532 Method of assembly for multi-flip chip on lead frame on overmolded IC package
02/26/2008US7335531 Semiconductor device package and method of production and semiconductor device of same
02/26/2008US7335530 Freeform substrates and devices
02/26/2008US7335529 Manufacturing method of a semiconductor device utilizing a flexible adhesive tape
02/26/2008US7335528 Methods of nanotube films and articles
02/26/2008US7335527 Method for microfabricating structures using silicon-on-insulator material
02/26/2008US7335526 Sensing system
02/26/2008US7335525 Method and structure to reduce optical crosstalk in a solid state imager
02/26/2008US7335524 Method of manufacturing a thin film transistor array panel
02/26/2008US7335523 Process for manufacturing a light-emitting device
02/26/2008US7335522 Package structure for light emitting diode and method thereof
02/26/2008US7335521 Method for the production of multilayer discs
02/26/2008US7335520 Method and apparatus for fabricating flat panel display
02/26/2008US7335519 Method for manufacturing a light-emitting diode
02/26/2008US7335518 Method for manufacturing semiconductor device
02/26/2008US7335517 Multichip semiconductor device, chip therefor and method of formation thereof
02/26/2008US7335465 Developer composition for resists and method for formation of resist pattern
02/26/2008US7335464 A vinylpyrrolidone-vinylimidazole copolymer; triethylamine of paratoulenesulfonates as acid generator capable of generating an acid by heating, solvent containing water; used for coating the resist pattern with a resistance to an electron beam
02/26/2008US7335462 Method of depositing an amorphous carbon layer
02/26/2008US7335461 Three dimensional topologies without multiple photolithography layers; mono-molecular layer enables very high spatial resolution; azomonochlorosilane initiator layer; radiating to selectively reduce density, polymerized monomers as a mask; miniature steps, slopes or surface variations; semiconductors
02/26/2008US7335455 Method of forming an underlayer of a bi-layer resist film and method of fabricating a semiconductor device using the same
02/26/2008US7335449 The light-shielding layer is patterned to form a main pattern and a phantom pattern; eliminate optical proximity effects; substrate with the phantom pattern can be narrower; etched to form trenches in the substrate; photolithographic process to make semiconductor wafer
02/26/2008US7335319 Semiconductor stress buffer coating edge bead removal compositions and method for their use
02/26/2008US7335315 Method and device for measuring wafer potential or temperature
02/26/2008US7335288 Exposing noble metal layer to electrodeposition composition comprising a copper salt, a suppressor, an accelerator and an electrolyte, initiating electrodeposition of copper on a surface of the noble metal layer by application of a predetermined current density
02/26/2008US7335278 Plasma processing apparatus and plasma processing method
02/26/2008US7335277 Vacuum processing apparatus
02/26/2008US7335268 Inorganic compound for removing polymers in semiconductor processes
02/26/2008US7335267 Heat treating apparatus having rotatable heating unit
02/26/2008US7335266 Method of forming a controlled and uniform lightly phosphorous doped silicon film
02/26/2008US7335261 Apparatus for forming a semiconductor thin film
02/26/2008US7335259 Growth of single crystal nanowires
02/26/2008US7335255 Manufacturing method of semiconductor device
02/26/2008US7335244 Air-purifying device for a front-opening unified pod
02/26/2008US7335239 hydrophobic chemical mechanical polishing pads comprising an organic polymers and metal agents including beta-diketonate ligands
02/26/2008US7335153 Arrays of microparticles and methods of preparation thereof
02/26/2008US7334979 Adjustable substrate transfer apparatus
02/26/2008US7334826 End-effectors for handling microelectronic wafers
02/26/2008US7334754 Guide rails for conveying band-form members
02/26/2008US7334708 Integral blocks, chemical delivery systems and methods for delivering an ultrapure chemical
02/26/2008US7334690 Substrate supporting rod and substrate cassette using the same
02/26/2008US7334605 Modular substrate gas panel having manifold connections in a common plane
02/26/2008US7334602 Apparatus for controlling flow rate of gases used in semiconductor device by differential pressure
02/26/2008US7334595 Cabinet for chemical delivery with solvent purging and removal
02/26/2008US7334588 Method and apparatus for wafer cleaning
02/26/2008US7334320 Method of making an electronic fuse with improved ESD tolerance
02/26/2008CA2457818C Electro-optical component including a fluorinated poly (phenylene ether ketone) protective coating and related methods
02/21/2008WO2008022277A2 Selective chemistry for fixed abrasive cmp
02/21/2008WO2008022245A1 Anti-reflective imaging layer for multiple patterning process
02/21/2008WO2008022165A2 Selective removal of gold from a lead frame
02/21/2008WO2008022107A1 Fluid dispensing system for semiconductor manufacturing processes with self-cleaning dispense valve
02/21/2008WO2008022097A2 Methods for forming patterned structures
02/21/2008WO2008022074A2 Semiconductor devices with sealed, unlined trenches and methods of forming same
02/21/2008WO2008021973A2 Method of manufacturing a photodiode array with through-wafer vias
02/21/2008WO2008021935A1 Thermal method to control underfill flow in semiconductor devices
02/21/2008WO2008021919A1 Jfet with built in back gate in either soi or bulk silicon
02/21/2008WO2008021797A1 Thermally enhanced bga package apparatus and method
02/21/2008WO2008021782A2 An etching mask usable in a process for manufacturing solar cells
02/21/2008WO2008021747A2 Methods for substrate surface cleaning suitable for fabricating silicon-on-insulator structures
02/21/2008WO2008021746A2 Methods for surface activation by plasma immersion ion implantation process utilized in silicon-on-insulator structure
02/21/2008WO2008021736A2 Nonvolatile memories with shaped floating gates
02/21/2008WO2008021672A1 Highly-selective metal etchants
02/21/2008WO2008021609A1 Method of treating a mask layer prior to performing an etching process
02/21/2008WO2008021598A1 Thermal processing system with improved process gas flow and method for injecting a process gas into a thermal processing system
02/21/2008WO2008021501A2 Apparatus and method for ultra-shallow implantation in a semiconductor device
02/21/2008WO2008021403A2 Method for deposition of magnesium doped (al, in, ga, b)n layers
02/21/2008WO2008021362A1 Memory device with non-orthogonal word and bit lines and manufacturing method thereof
02/21/2008WO2008021272A2 Semiconductor device and method for manufacturing a semiconductor device
02/21/2008WO2008021269A2 Device chip carriers, modules, and methods of forming thereof
02/21/2008WO2008021221A2 Low voltage transient voltage suppressor with reduced breakdown voltage
02/21/2008WO2008021220A2 Semiconductor device and method for manufacturing a semiconductor device having improved heat dissipation capabilities
02/21/2008WO2008021219A2 Semiconductor device having improved heat dissipation capabilities
02/21/2008WO2008020982A2 Semiconductor junction device having reduced leakage current and method of forming same
02/21/2008WO2008020974A2 Method and apparatus for single-sided etching
02/21/2008WO2008020911A2 High power insulated gate bipolar transistors
02/21/2008WO2008020715A1 Gas saver for semiconductor manufacturing
02/21/2008WO2008020599A1 Method for manufacturing group iii nitride compound semiconductor light-emitting device, group iii nitride compound semiconductor light-emitting device, and lamp
02/21/2008WO2008020592A1 Film-forming material, silicon-containing insulating film and method for forming the same
02/21/2008WO2008020577A1 Connecting method
02/21/2008WO2008020573A1 Positive photosensitive resin composition
02/21/2008WO2008020566A1 Semiconductor device, semiconductor device manufacturing method and display device
02/21/2008WO2008020543A1 Mold release film for the resin encapsulation of semiconductors
02/21/2008WO2008020394A1 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
02/21/2008WO2008020191A2 Method for anisotropically plasma etching a semiconductor wafer
02/21/2008WO2008020072A1 High-voltage mos transistor device and method of making the same
02/21/2008WO2008005944A3 Systems and methods for alignment of laser beam (s) for semiconductor link processing
02/21/2008WO2008005541A3 Clean ignition system for wafer substrate processing