Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2008
03/27/2008US20080073787 Method forming metal interconnection filling recessed region using electro-plating technique
03/27/2008US20080073786 Semiconductor device and method of manufacturing the same
03/27/2008US20080073785 Semiconductor device having sealing film and manufacturing method thereof
03/27/2008US20080073783 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument
03/27/2008US20080073780 Semiconductor device and method for manufacturing the same
03/27/2008US20080073776 Sintered metallic thermal interface materials for microelectronic cooling assemblies
03/27/2008US20080073773 Electronic device and production method
03/27/2008US20080073771 Semiconductor package and semiconductor system in package using the same
03/27/2008US20080073770 Integrated circuit package system with stacked die
03/27/2008US20080073766 System for manufacturing microelectronic, microoptoelectronic or micromechanical devices
03/27/2008US20080073764 Lead frame having a die stage smaller than a semiconductor device and a semiconductor device using the same
03/27/2008US20080073763 Semiconductor device and method of manufacturing the same
03/27/2008US20080073757 Semiconductor dies and methods and apparatus to mold lock a semiconductor die
03/27/2008US20080073756 Module with a shielding and/or heat dissipating element
03/27/2008US20080073754 Coating compositions for photolithography
03/27/2008US20080073752 Semiconductor apparatus
03/27/2008US20080073750 Semiconductor Storage Apparatus and Method for Manufacturing the Same
03/27/2008US20080073747 Electromagnetic shielding using through-silicon vias
03/27/2008US20080073746 Semiconductor device
03/27/2008US20080073743 Templated growth of semiconductor nanostructures, related devices and methods
03/27/2008US20080073742 Stacked image package
03/27/2008US20080073739 Electronic component package, electronic component using the package, and method for manufacturing electronic component package
03/27/2008US20080073736 Image sensor and method of fabricating the same
03/27/2008US20080073735 Image sensor and fabrication method thereof
03/27/2008US20080073734 Camera module and method of fabricating the same
03/27/2008US20080073733 Semiconductor device and method for manufacturing the same
03/27/2008US20080073732 Method of manufacturing semiconductor device
03/27/2008US20080073731 High withstand voltage transistor and manufacturing method thereof, and semiconductor device adopting high withstand voltage transistor
03/27/2008US20080073730 Semiconductor device and method for formimg the same
03/27/2008US20080073728 Semiconductor device and manufacturing method thereof
03/27/2008US20080073726 Semiconductor integrated circuit device and process for manufacturing the same
03/27/2008US20080073725 Buried guard ring structures and fabrication methods
03/27/2008US20080073724 Double layer etch stop layer structure for advanced semiconductor processing technology
03/27/2008US20080073723 Selective anisotropic wet etching of workfunction metal for semiconductor devices
03/27/2008US20080073722 Circuit for storing information in an integrated circuit and method therefor
03/27/2008US20080073719 Semiconductor device
03/27/2008US20080073718 Mask for forming a thin-film transistor, thin-film transistor substrate manufactured using the same and method of manufacturing a thin-film transistor substrate using the same
03/27/2008US20080073717 Semiconductor devices having substrate plug and methods of forming the same
03/27/2008US20080073715 Method of manufacturing semiconductor device
03/27/2008US20080073714 Semiconductor device
03/27/2008US20080073713 Method of fabricating semiconductor device having stress enhanced MOS transistor and semiconductor device fabricated thereby
03/27/2008US20080073712 Power mosfet, semiconductor device including the power mosfet, and method for making the power mosfet
03/27/2008US20080073711 Method of manufacturing a semiconductor integrated circuit device having a columnar laminate
03/27/2008US20080073710 Semiconductor device with a vertical MOSFET and method for manufacturing the same
03/27/2008US20080073709 Semiconductor device and method of manufacturing the same
03/27/2008US20080073708 Semiconductor device and method of forming the same
03/27/2008US20080073707 Power MOSFET with recessed field plate
03/27/2008US20080073706 High withstand voltage trenched MOS transistor and manufacturing method thereof
03/27/2008US20080073703 Nonvolatile semiconductor memory device and method for fabricating the same
03/27/2008US20080073702 NROM fabrication method
03/27/2008US20080073701 Nonvolatile semiconductor memory device and method of manufacturing the same
03/27/2008US20080073700 Manufacturing method of flash memory device
03/27/2008US20080073699 Semiconductor device and method for manufacturing semiconductor device
03/27/2008US20080073697 Semiconductor device and method of fabricating the same
03/27/2008US20080073696 Semiconductor device and method of manufacturing the same
03/27/2008US20080073695 Semiconductor memory and method for manufacturing a semiconductor memory
03/27/2008US20080073693 Semiconductor devices having tunnel and gate insulating layers and methods of forming the same
03/27/2008US20080073692 Semiconductor chip and method of forming the same
03/27/2008US20080073691 Semiconductor device and method of manufacturing same
03/27/2008US20080073684 Semiconductor memory device and method of manufacturing the same
03/27/2008US20080073683 Semiconductor memory device and method of manufacturing the same
03/27/2008US20080073682 Non-volatile semiconductor memory device and method for fabricating the same
03/27/2008US20080073681 Semiconductor apparatus and method for manufacturing the semiconductor apparatus
03/27/2008US20080073680 Semiconductor device and fabrication process thereof
03/27/2008US20080073678 High-sensitivity image sensor and fabrication method thereof
03/27/2008US20080073677 Solid-state imaging device and method of manufacturing the same
03/27/2008US20080073676 Method for fabricating semiconductor device and semiconductor device
03/27/2008US20080073671 Semiconductor device
03/27/2008US20080073667 Tri-gate field-effect transistors formed by aspect ratio trapping
03/27/2008US20080073666 Power MOSFET integration
03/27/2008US20080073665 Modified Gold-Tin System With Increased Melting Temperature for Wafer Bonding
03/27/2008US20080073664 Semiconductor device and method of fabricating the same
03/27/2008US20080073662 Method of manufacturing high power light-emitting device package and structure thereof
03/27/2008US20080073656 Low temperature polysilicon thin film transistor
03/27/2008US20080073654 Display device and fabrication method thereof
03/27/2008US20080073653 Semiconductor apparatus and method of manufacturing the same
03/27/2008US20080073652 III-V Hemt Devices
03/27/2008US20080073651 Liquid crystal display device
03/27/2008US20080073650 Fabrication method for polycrystalline silicon thin film and apparatus using the same
03/27/2008US20080073649 Thin film transistor substrate and manufacturing method thereof
03/27/2008US20080073646 P-channel nanocrystalline diamond field effect transistor
03/27/2008US20080073645 Thin films and methods of making them
03/27/2008US20080073644 Thin film transistor array substrate, method for manufacturing the same and system for inspecting the substrate
03/27/2008US20080073641 Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures
03/27/2008US20080073640 Method of manufacturing semiconductor device
03/27/2008US20080073639 Dislocation-free InSb quantum well structure on Si using novel buffer architecture
03/27/2008US20080073635 Semiconductor Memory and Method of Manufacturing the Same
03/27/2008US20080073574 Writing method of charged particle beam, support apparatus of charged particle beam writing apparatus, writing data generating method and program-recorded readable recording medium
03/27/2008US20080073522 Method of correcting opaque defect of chrome mask, in which atomic force microscope fine working apparatus has been used
03/27/2008US20080073410 Method of testing bonded connections, and a wire bonder
03/27/2008US20080073324 Method For Processing Outer Periphery Of Substrate And Apparatus Thereof
03/27/2008US20080073114 Technique for plating substrate devices using voltage switchable dielectric material and light assistance
03/27/2008US20080073034 Method for thermally releasing adherend and apparatus for thermally releasing adherend
03/27/2008US20080073032 Stage for plasma processing apparatus, and plasma processing apparatus
03/27/2008US20080073031 Method and apparatus for semiconductor processing
03/27/2008US20080073030 Apparatus for manufacturing semiconductor device
03/27/2008US20080073027 Alignment method and mounting method using the alignment method
03/27/2008US20080073024 Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus
03/27/2008US20080072929 Dilution gas recirculation
03/27/2008US20080072926 Method for Cleaning Soi Wafer