| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 03/27/2008 | US20080072823 Self aligning non contact shadow ring process kit |
| 03/27/2008 | US20080072818 Growing a desired portion of the nanowire, growing a sacrificial portion of the nanowire that is doped differently than the desired portion, differentially removing the sacrificial portion, and removing a growth stub from the desired portion, especially by etching |
| 03/27/2008 | US20080072792 Good film forming properties and step coverage is obtained by using 1,3-dioxolane; hardly freezes even in cold regions |
| 03/27/2008 | US20080072690 Penetrable cap |
| 03/27/2008 | US20080072585 Exhaust system |
| 03/27/2008 | US20080072421 Molded Substrate for Topography Based Lithography |
| 03/27/2008 | US20080072407 Methods for fabrication of improved electrolytic capacitor anode |
| 03/27/2008 | DE112004002377T5 Doppel-Damaszierungsprozess unter Verwendung von kohlenstoffdotierten und kohlenstofffreien Oxidschichten Double-Damaszierungsprozess using carbon-doped oxide and carbon-free |
| 03/27/2008 | DE10349933B4 Auswerteschaltung und Verfahren zum Feststellen und/oder zum Lokalisieren fehlerhafter Datenworte in einem Datenstrom Evaluation circuit and method for detecting and / or locating faulty data words in a data stream |
| 03/27/2008 | DE10318847B4 Verfahren zur Herstellung einer integrierten Schaltung mit zwei Schaltungsteilen A method of fabricating an integrated circuit having two circuit parts |
| 03/27/2008 | DE10248373B4 Teststruktur zum Bestimmen eines Kurzschlusses zwischen Grabenkondensatoren in einem Speicherzellenfeld Test structure for determining a short circuit between grave capacitors in a memory cell array |
| 03/27/2008 | DE102007047245A1 Metallic intermediate connection manufacturing method for semiconductor memory components, involves forming germ layer on surface of recess and electro polishing germ layer before filling recess with metal material |
| 03/27/2008 | DE102007043840A1 Wafer bearbeitende Hardware für das epitaktische Abscheiden mit reduzierter Autodotierung und weniger Störstellen auf der Rückseite Wafer machined hardware for the epitaxial deposition of reduced autodoping and less rough spots on the back |
| 03/27/2008 | DE102007043710A1 Tiefe Durchkontaktierungskonstruktion für eine Halbleitereinrichtung und ein Verfahren zu Ihrer Herstellung Depth Durchkontaktierungskonstruktion for a semiconductor device and a method for their preparation |
| 03/27/2008 | DE102007042149A1 Substrate attachment unit for comprehensive evaporation, has susceptor with hollow deepened region for carrying substrate and liquid metal formed on top side of susceptor, which fills gap between substrate and susceptor |
| 03/27/2008 | DE102007042089A1 Thin film-transistor device manufacturing method, involves irradiating semiconductor thin film with energy ray in presence of n-type and p-type foreign substances to form flat diffusion layer for diffusing substances into layer of film |
| 03/27/2008 | DE102007041082A1 Verfahren und Vorrichtung zur Verringerung von Funkelrauschen in einer Halbleitereinrichtung Method and apparatus for reducing flicker noise in a semiconductor device |
| 03/27/2008 | DE102007039911A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method |
| 03/27/2008 | DE102007039910A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method |
| 03/27/2008 | DE102007038384A1 Halbleitervorrichtung und zugehöriges Herstellungsverfahren A semiconductor device and manufacturing method thereof |
| 03/27/2008 | DE102007038343A1 Laser beam machining method of wafer for manufacture of semiconductor device e.g. integrated circuit, involves aligning centers of wafer and chuck table by moving them relatively corresponding to shift of outer periphery of wafer |
| 03/27/2008 | DE102007038169A1 Verfahren zum Verpacken auf Waferebene unter Verwendung von Waferdurchgangslöchern mit geringem Aspektverhältnis A method of packaging at the wafer level using wafer through holes with a low aspect ratio |
| 03/27/2008 | DE102007033866A1 Verfahren zur Bildung einer Feinstruktur für eine Halbleitervorrichtung A method of forming a fine structure for a semiconductor device |
| 03/27/2008 | DE102007025112A1 Verfahren zum Herstellen eines Dünnfilmmusters, Flüssigkristalldisplay sowie Verfahren zu dessen Herstellung A method of manufacturing a thin film pattern, the liquid crystal display and method for its production |
| 03/27/2008 | DE102007020342A1 Polierverfahren und Poliervorrichtung Polishing method and polishing apparatus |
| 03/27/2008 | DE102007018854A1 Halbleitervorrichtungs-Herstellungsverfahren, Halbleiterwafer und Halbleitervorrichtung A semiconductor device manufacturing method, semiconductor wafers and semiconductor device |
| 03/27/2008 | DE102006056812A1 Heater for regulating/controlling surface temperature of substrate e.g. mold for glass lens, comprises a thermal pyrolytic layer in base support for providing specific maximum temperature variation, and having specific thermal conductivity |
| 03/27/2008 | DE102006056614A1 Vorrichtung mit verbesserter thermischer Leitfähigkeit und Verfahren zum Herstellen derselben Device with improved thermal conductivity and method of making same |
| 03/27/2008 | DE102006045094A1 Chip-to-chip connections manufacturing method for three dimensional-integration of individual chip-to-chip stack, involves attaching adhesive material on joint contacts, where adhesive material has recesses in pattern of connection model |
| 03/27/2008 | DE102006043389A1 Verfahren zum Plasmaätzen zur Erzeugung positiver Ätzprofile in Siliziumsubstraten A method for plasma etching for generating positive etching profiles in silicon substrates |
| 03/27/2008 | DE102006043215A1 Chip i.e. semiconductor chip, coplanar installing method, involves connecting adhesive surfaces with each other by chip and support under adjusting of intermediate area between chip and support |
| 03/27/2008 | DE102006043163A1 Verfahren zur Herstellung eines Verbundwerkstoffs, zugehöriger Verbundwerkstoff sowie zugehörige Halbleiterschaltungsanordnungen A process for producing a composite material, associated composite material and associated semiconductor circuitry |
| 03/27/2008 | DE102006042775B3 Schaltungsmodul und Verfahren zur Herstellung eines Schaltungsmoduls A circuit module and method of manufacturing a circuit module |
| 03/27/2008 | DE102006042774A1 Verfahren zur Herstellung einer elektrischen Ankontaktierung A method for producing an electrical contacting of |
| 03/27/2008 | DE102006042032A1 Halbleiterbauelement Semiconductor device |
| 03/27/2008 | DE102006041983A1 Verfahren zum elektrischen Verbinden eines ersten Substrat mit einem zweiten Substrat A method of electrically connecting a first substrate to a second substrate |
| 03/27/2008 | DE102006038001B3 Procedure for drying and/or dry holding of workpiece during fluid jet guidance processing of the workpiece, comprises supplying dry inert gas at a process head, which is conveyed nearly at the workpiece, whose processed area is dried |
| 03/27/2008 | DE102006037162A1 Verfahren und Vorrichtung und deren Verwendung zur Prüfung des Layouts einer elektronischen Schaltung Method and apparatus and their use for the examination of the layout of an electronic circuit |
| 03/27/2008 | DE102006035646B3 Verfahren zur Herstellung verformter Transistoren durch Verspannungskonservierung auf der Grundlage einer verspannten Implantationsmaske A process for producing transistors deformed by tension conservation on the basis of a strained implantation mask |
| 03/27/2008 | DE102005045863B4 Nichtflüchtiges Speicherbauelement und Verfahren zu seiner Herstellung A non-volatile memory device and method for its preparation |
| 03/27/2008 | DE102005033254B4 Verfahren zur Herstellung eines Chip-Trägersubstrats aus Silizium mit durchgehenden Kontakten A method of manufacturing a chip carrier substrate of silicon with through contacts |
| 03/27/2008 | DE102005029136B4 Verfahren und Einrichtung für die Montage von Halbleiterchips Method and device for the assembly of semiconductor chips |
| 03/27/2008 | DE10200399B4 Verfahren zur Erzeugung einer dreidimensional integrierten Halbleitervorrichtung und dreidimensional integrierte Halbleitervorrichtung Method for producing a three-dimensional integrated semiconductor device and three-dimensionally integrated semiconductor device |
| 03/27/2008 | DE10120295B4 Gerät und Prozess zur Gasphasenbeschichtung Device and process for gas-phase coating |
| 03/26/2008 | EP1903611A2 Semiconductor device and manufacturing method thereof |
| 03/26/2008 | EP1903606A2 Stackable tier structure comprising an IC die and a high density feedthrough structure |
| 03/26/2008 | EP1903604A2 Organic electro-luminescent display and method of frabricating the same |
| 03/26/2008 | EP1903603A2 Substrate holder assembly device |
| 03/26/2008 | EP1903602A2 Non-volatile memory transistor |
| 03/26/2008 | EP1903601A2 Electronic timer comprising floating-gate transistors and method of initialising thereof |
| 03/26/2008 | EP1903600A2 Method for producing P-type group III nitride semiconductor and method for producing electrode for P-type group III nitride semiconductor |
| 03/26/2008 | EP1903599A2 Adhesive tape cutting method and adhesive tape joining apparatus using the same |
| 03/26/2008 | EP1903596A2 Electron microscope for inspecting and processing of an object with miniaturized structures and method thereof |
| 03/26/2008 | EP1903392A2 Fine mold and method for regenerating fine mold |
| 03/26/2008 | EP1903389A1 Mask data generation program, mask data generation method, mask fabrication method, exposure method, and device manufacturing method |
| 03/26/2008 | EP1903370A1 An optical reduction system for use in photolithography |
| 03/26/2008 | EP1903120A2 Nickel based alloy comprising cobalt and rhenium disulfide and method of applying it as a coating |
| 03/26/2008 | EP1903119A1 Ultrahigh-purity copper and process for producing the same, and bonding wire comprising ultrahigh-purity copper |
| 03/26/2008 | EP1902473A2 Semiconductor device including a superlattice having at least one group of substantially undoped layer |
| 03/26/2008 | EP1902472A2 Semiconductor device comprising a superlattice dielectric interface layer |
| 03/26/2008 | EP1902469A2 Flat display active plate |
| 03/26/2008 | EP1902465A2 Workpiece support structures and apparatus for accessing same |
| 03/26/2008 | EP1902464A2 Device for storing substrates |
| 03/26/2008 | EP1902463A1 Method for reducing roughness of a thick insulating layer |
| 03/26/2008 | EP1902462A2 Fluid deposition cluster tool |
| 03/26/2008 | EP1902460A2 High speed substrate aligner apparatus |
| 03/26/2008 | EP1902456A1 Reactor for carrying out an etching method for a stack of masked wafers and an etching method |
| 03/26/2008 | EP1902003A2 Localized surface annealing of components for substrate processing chambers |
| 03/26/2008 | EP1901983A2 Load port module |
| 03/26/2008 | EP1901897A1 Device and method for positioning and blocking thin substrates on a cut substrate block |
| 03/26/2008 | EP1756627A4 Lens array and method for making same |
| 03/26/2008 | EP1756244A4 Cerium oxide abrasive and slurry containing the same |
| 03/26/2008 | EP1733424A4 A semiconductor apparatus |
| 03/26/2008 | EP1697991A4 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same |
| 03/26/2008 | EP1620878A4 Method for treating semiconductor processing components and components formed thereby |
| 03/26/2008 | EP1576668A4 Multi-level memory cell with lateral floating spacers |
| 03/26/2008 | EP1421609B1 Process and apparatus for treating a workpiece such as a semiconductor wafer |
| 03/26/2008 | EP1330875B1 Digitally controlled impedance for i/o of an integrated circuit device |
| 03/26/2008 | EP1307906B1 Structuring of ferroelectric layers |
| 03/26/2008 | EP1275135B1 Apparatus for thermally processing wafers |
| 03/26/2008 | EP1258034B1 A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE OF SiC |
| 03/26/2008 | EP1245050B1 Controllable semiconductor switching element with bidirectional blocking capability |
| 03/26/2008 | EP1234340A4 Formation of contacts on thin films |
| 03/26/2008 | EP1190487B1 High voltage protection circuit on standard cmos process |
| 03/26/2008 | EP1105920B1 Pattern formation method using light-induced suppression of etching |
| 03/26/2008 | EP1097471B1 Integrated circuit with at least one transistor and a capacitor and corresponding production method |
| 03/26/2008 | EP1044474B1 Trench-gate semiconductor device |
| 03/26/2008 | EP0938741B1 Vacuum plasma processor having coil with intermediate portion coupling lower magnetic flux density to plasma than center and peripheral portions of the coil |
| 03/26/2008 | CN101151947A Ball capturing device, solder ball arrangement device, ball capturing method, and solder ball arranging method |
| 03/26/2008 | CN101151891A Drive method for driving element having capacity impedance, drive device, and imaging device |
| 03/26/2008 | CN101151734A Split gate multi-bit memory cell |
| 03/26/2008 | CN101151731A Manufacturing method of solid-state imaging device |
| 03/26/2008 | CN101151727A 集成电路芯片封装和方法 An integrated circuit chip package and method |
| 03/26/2008 | CN101151725A Building fully-depleted and partially-depleted transistors on same chip |
| 03/26/2008 | CN101151724A Metal carbide gate structure and method of fabrication |
| 03/26/2008 | CN101151723A Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus |
| 03/26/2008 | CN101151722A Treatment of items |
| 03/26/2008 | CN101151721A Method of fabricating insulating layer and method of fabricating semiconductor device |
| 03/26/2008 | CN101151720A Integrated circuit fabrication |
| 03/26/2008 | CN101151719A Etch with photoresist mask |