Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2008
05/22/2008US20080118338 Transfer robot
05/22/2008US20080118333 Automation for high throughput semiconductor batch-wafer processing equipment
05/22/2008US20080118236 Load lock chamber with heater in tube
05/22/2008US20080117945 Semiconductor laser, method of manufacturing semiconductor laser, optical pickup and optical disk system
05/22/2008US20080117680 Non-Volatile Memory and Semiconductor Device
05/22/2008US20080117672 Gated Diode Nonvolatile Memory Structure with Diffusion Barrier Structure
05/22/2008US20080117670 Thin film magnetic memory device including memory cells having a magnetic tunnel junction
05/22/2008US20080117512 Mirror unit, method of producing the same, and exposure apparatus and method using the mirror unit
05/22/2008US20080117415 Apparatus and method for inspecting defects
05/22/2008US20080117390 Coating/developing apparatus and substrate transfer method
05/22/2008US20080117347 Tft lcd array substrate and the manufacturing method thereof
05/22/2008US20080117344 Liquid crystal display panel, method for fabricating the same, and thin film transistor substrate
05/22/2008US20080117149 Liquid crystal display device
05/22/2008US20080117144 Inspection device and inspection method for active matrix panel, and manufacturing method for active matrix organic light emitting diode panel
05/22/2008US20080117011 Inductors having input/output paths on opposing sides
05/22/2008US20080116939 Semiconductor device, logic circuit and electronic equipment
05/22/2008US20080116795 Display device and manufacturing method of display device
05/22/2008US20080116591 Semiconductor device and method for manufacturing same
05/22/2008US20080116589 Ball grid array package assembly with integrated voltage regulator
05/22/2008US20080116588 Assembly and Method of Placing the Assembly on an External Board
05/22/2008US20080116587 Conductor polymer composite carrier with isoproperty conductive columns
05/22/2008US20080116586 Methods for manufacturing thermally enhanced flip-chip ball grid arrays
05/22/2008US20080116584 Self-aligned through vias for chip stacking
05/22/2008US20080116583 Semiconductor device and method of forming the same
05/22/2008US20080116582 Interconnect Structures with Improved Electromigration Resistance and Methods for Forming Such Interconnect Structures
05/22/2008US20080116580 Semiconductor package and fabrication method thereof
05/22/2008US20080116579 Method of manufacturing multilevel interconnect structure and multilevel interconnect structure
05/22/2008US20080116578 Initiation layer for reducing stress transition due to curing
05/22/2008US20080116577 Semiconductor device and production method therefor
05/22/2008US20080116576 Semiconductor devices and methods of manufacture thereof
05/22/2008US20080116575 Nitride semiconductor device and method of manufacturing the same
05/22/2008US20080116573 Method of packaging a device having a multi-contact elastomer connector contact area and device thereof
05/22/2008US20080116566 Electronic component and method for manufacturing the same
05/22/2008US20080116565 Circuit board structure with embedded semiconductor chip and method for fabricating the same
05/22/2008US20080116564 Wafer level package with die receiving cavity and method of the same
05/22/2008US20080116562 Carrier structure for semiconductor chip and method for manufacturing the same
05/22/2008US20080116560 Method of packaging a device having a tangible element and device thereof
05/22/2008US20080116558 Decoupling capacitor, wafer stack package including the decoupling capacitor, and method of fabricating the wafer stack package
05/22/2008US20080116555 Package structure of memory card and manufacturing method thereof
05/22/2008US20080116554 Packaging micro devices
05/22/2008US20080116551 Method For Producing A Laser Diode Component, Housing For A Laser Diode Comoponent, And Laser Diode Component Itself
05/22/2008US20080116546 Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same
05/22/2008US20080116545 Packaged semiconductor chips
05/22/2008US20080116544 Packaged semiconductor chips with array
05/22/2008US20080116543 Semiconductor devices and methods of manufacture thereof
05/22/2008US20080116542 Gate Dielectric Having a Flat Nitrogen Profile and Method of Manufacture Therefor
05/22/2008US20080116541 Structure for integrating an rf shield structure in a carrier substrate
05/22/2008US20080116540 Stacked Switchable Element and Diode Combination With a Low Breakdown Switchable Element
05/22/2008US20080116539 Schottky device and process of making the same
05/22/2008US20080116537 Cmos imager array with recessed dielectric
05/22/2008US20080116535 Methods and apparatus for a dual-metal magnetic shield structure
05/22/2008US20080116533 Semiconductor device in wafer assembly
05/22/2008US20080116532 Method of manufacturing semiconductor device, and semiconductor device
05/22/2008US20080116530 Semiconductor Devices Having Transistors with Different Gate Structures and Related Methods
05/22/2008US20080116528 Semiconductor device and method of manufacturing the same
05/22/2008US20080116527 Methods of improving operational parameters of pair of matched transistors and set of transistors
05/22/2008US20080116526 Semiconductor device and method for manufacturing the same
05/22/2008US20080116522 Cmos structure including topographic active region
05/22/2008US20080116521 CMOS Integrated Circuits that Utilize Insulating Layers with High Stress Characteristics to Improve NMOS and PMOS Transistor Carrier Mobilities and Methods of Forming Same
05/22/2008US20080116520 Termination Structures For Semiconductor Devices and the Manufacture Thereof
05/22/2008US20080116518 Metal-oxide-semiconductor device and manufacturing method thereof
05/22/2008US20080116517 Dual stress device and method
05/22/2008US20080116516 Thin film transistor array substrate and fabricating method thereof
05/22/2008US20080116515 Mugfet with increased thermal mass
05/22/2008US20080116514 Method and structure for reducing floating body effects in mosfet devices
05/22/2008US20080116513 Modular bipolar-CMOS-DMOS analog integrated circuit and power transistor technology
05/22/2008US20080116512 Semiconductor device and method of making the same
05/22/2008US20080116511 Semiconductor device with trench transistors and method for manufacturing such a device
05/22/2008US20080116510 Mos-gated device having a buried gate and process for forming same
05/22/2008US20080116509 Multi-State Non-Volatile Integrated Circuit Memory Systems that Employ Dielectric Storage Elements
05/22/2008US20080116506 Charge trapping devices with field distribution layer over tunneling barrier
05/22/2008US20080116505 Non-volatile memory cells formed in back-end-of line processes
05/22/2008US20080116504 Flash Memory Cell and Method for Manufacturing the Same
05/22/2008US20080116503 Semiconductor memory device including a stacked gate having a charge storage layer and a control gate, and method of manufacturing the same
05/22/2008US20080116502 Non-volatile memory with epitaxial regions for limiting cross coupling between floating gates
05/22/2008US20080116501 Pixel structure and repair method thereof
05/22/2008US20080116500 Semiconductor device and method for manufacturing the same
05/22/2008US20080116499 Gated Diode Nonvolatile Memory Process
05/22/2008US20080116498 Method of forming a semiconductor device having a capacitor and a resistor
05/22/2008US20080116494 Method for manufacturing a semiconductor device
05/22/2008US20080116493 Multi-layer spacer with inhibited recess/undercut and method for fabrication thereof
05/22/2008US20080116488 Transistor structure and manufacturing method thereof
05/22/2008US20080116487 Methods of fabricating transistors having high carrier mobility and transistors fabricated thereby
05/22/2008US20080116484 Method of enhancing hole mobility
05/22/2008US20080116483 High-quality sgoi by annealing near the alloy melting point
05/22/2008US20080116482 Method to form selective strained si using lateral epitaxy
05/22/2008US20080116480 Method and device for electrostatic discharge protection
05/22/2008US20080116474 Thin film transistor array and method of manufacturing the same
05/22/2008US20080116472 Semiconductor light emitting element and method of manufacturing the same
05/22/2008US20080116469 Liquid crystal display panel and manufacture method thereof
05/22/2008US20080116463 Light-emitting apparatus and production method thereof
05/22/2008US20080116461 Semiconductor device and manufacturing method thereof
05/22/2008US20080116460 Non-volatile memory device and fabrication method of non-volatile memory device and memory apparatus including non-volatile memory device
05/22/2008US20080116459 Thin film transistor array substrate and method for fabricating same
05/22/2008US20080116458 EL display device, driving method thereof, and electronic equipment provided with the EL display device
05/22/2008US20080116457 Driving device for unit pixel of organic light emitting display and method of manufacturing the same
05/22/2008US20080116447 Non-volatile memory transistor with quantum well charge trap
05/22/2008US20080116446 Electron Emission Element and Electron Emission Element Fabrication Method
05/22/2008US20080116443 Phase change memory device with hole for a lower electrode defined in a stable manner and method for manufacturing the same
05/22/2008US20080116442 Phase change memory cell having a sidewall contact
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