Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
05/2008
05/29/2008US20080121618 Method of Electrochemical Fabrication
05/29/2008US20080121617 Etching method for metal layer of display panel
05/29/2008US20080121560 Substrate container with fluid-sealing flow passageway
05/29/2008US20080121527 Immersing substrate into an electroplating bath including copper compound and defect reducing agent comprising reaction product of benzyl chloride and (hydroxyethyl) polyethylenimine; filling submicron-sized reliefs whereby occurrence of protrusion defects are reduced; crystal growth inhibition
05/29/2008US20080121518 Filling trench formed in wafer of semiconductor having at least one lateral wall and a bottom wall; vapor depositing a layer of material in trench, having a non-uniform thickness with an overhang; repeatedly varying operative parameters for varying the distance of the overhang from the bottom wall
05/29/2008US20080121345 Magnetic confinement of a plasma
05/29/2008US20080121344 Plasma processing apparatus
05/29/2008US20080121279 substrate includes p-type and n-type emitters on a surface of the substrate, the emitters being doped nano-particles of silicon; to reduce high interface recombination at the substrate surface, nano-particle emitters are preferably formed over a thin interfacial tunnel oxide layer on surface of substrat
05/29/2008US20080121262 Collapsible play structures
05/29/2008US20080121251 Substrate processing apparatus and substrate processing method
05/29/2008US20080121181 Cvd process for forming a thin film
05/29/2008US20080121177 Dual top gas feed through distributor for high density plasma chamber
05/29/2008US20080121173 Substrate processing system for performing exposure process in gas atmosphere
05/29/2008US20080120918 Polishing composition and polishing process
05/29/2008DE19805146B4 Verfahren zur Chipherstellung und eine druckempfindliche Haftschicht für die Chipherstellung Process for chip manufacture and a pressure-sensitive adhesive layer for chip manufacture
05/29/2008DE19633689B4 Verfahren zum Herstellen von Kondensatoren für Halbleitervorrichtungen A process for producing capacitors for semiconductor devices
05/29/2008DE112006001943T5 An Substraten ausgebildete Halbleiterstrukturen und Verfahren zum Herstellen dieser Substrates formed of semiconductor structures and methods for making these
05/29/2008DE112005000529T5 Verbindungshalbleiter-Vorrichtung, Herstellungsverfahren der Verbindungshalbleiter-Vorrichtung und Diode A compound semiconductor device production method of the compound semiconductor device, and diode
05/29/2008DE112004000745B4 Aufbau und Verfahren zum Bilden eines Feldeffekttransistors mit gekerbtem Gate Construction and method of forming a field effect transistor notched gate
05/29/2008DE112004000572B4 Multi-Chip-Ball-Grid-Array-Gehäuse und Herstellungsverfahren Multi-chip ball grid array package and manufacturing processes
05/29/2008DE10360206B4 Verfahren zum selektiven galvanischen Abscheiden in einer integrierten Schaltungsanordnung, insbesondere auf Kupfer, und integrierte Schaltungsanordnung A method of selectively electrodepositing in an integrated circuit arrangement, in particular copper, and integrated circuit arrangement
05/29/2008DE10351030B4 Speicherzelle, DRAM und Verfahren zur Herstellung einer Transistorstruktur in einem Halbleitersubstrat Memory cell, DRAM and methods of making a transistor structure in a semiconductor substrate,
05/29/2008DE10302022B4 Verfahren zur Herstellung eines verkleinerten Chippakets Process for the preparation of a reduced chip package
05/29/2008DE102007056970A1 Halbleiterelemente mit geringen TDs (Threading Dislocations) und verbesserter Lichtextraktion sowie Verfahren zum Herstellen derselben Semiconductor elements with low TDs (threading dislocations) and improved light extraction and method of making same
05/29/2008DE102007056501A1 Verfahren und Struktur einer Bildmaske zum Trockenätzen Procedures and structure of an image mask for dry etching
05/29/2008DE102007055284A1 Laserstrahlbearbeitungsanlage Laser beam machining system
05/29/2008DE102007054064A1 Verfahren zum Herstellen einer Halbleitervorrichtung A method of manufacturing a semiconductor device
05/29/2008DE102007054058A1 MuGFET mit erhöhter Wärmemasse MuGFET with increased thermal mass
05/29/2008DE102007049961A1 ESD-Schutz für integrierte Schaltungen ESD Protection for Integrated Circuits
05/29/2008DE102007034960A1 Bildsensor und Verfahren zur Herstellung desselben Of the same image sensor and method for producing
05/29/2008DE102006055885A1 Verfahren zum Dotieren eines Halbleiterkörpers und hiermit dotiertes Halbleiterbauelement A method for doping a semiconductor body, and hereby doped semiconductor component
05/29/2008DE102006055862A1 Verfahren und Vorrichtung zum Herstellen einer elektrischen Solarzellen-Kontaktstruktur an einem Substrat Method and apparatus for making an electrical contact structure of a solar cell substrate
05/29/2008DE102006055618A1 Mobiler elektrostatischer Trägerwafer mit elektrisch isoliertem Ladungsspeicher Mobile electrostatic carrier wafer with electrically insulated charge storage
05/29/2008DE102006054846A1 Produktionsanlage zur Herstellung von Solarzellen im Inline-Verfahren, Inline-Batch-Umsetzeinrichtung, Batch-Inline-Umsetzeinrichtung sowie Verfahren zur Integration eines Batch-Prozesses in eine mehrspurige Inline-Produktionsanlage für Solarzellen Plant for the production of solar cells in an inline process, in-line batch converting, batch converting inline and methods for the integration of a batch process in a multi-lane line production plant for solar cells
05/29/2008DE102006053956A1 Semiconductor substrate structuring method for e.g. dynamic RAM, involves forming cover structure in process section so that marginal structure is formed along mask edge, and removing carbon masks
05/29/2008DE102006053182A1 Silicon p-doping method for e.g. manufacturing p-conducting base regions of thyristor, involves separating outdiffusion layer, collecting atoms into wafer under recrystallisation of defects, and placing atoms at space locations
05/29/2008DE102006049683B3 Verfahren und Vorrichtung zum Charakterisieren von Wafern bei der Herstellung von Solarzellen Method and device for characterizing wafers in the manufacture of solar cells
05/29/2008DE102006049155B3 Transistor und Speicherzellenfeld und Verfahren zu deren Herstellung Transistor and memory cell array and methods for their preparation
05/29/2008DE102006045836A1 Feedthrough producing method, involves metallizing borehole wall of clearence hole, and maintaining electrical contact to metal layer, where surface coating is laid at semiconductor substrate
05/29/2008DE102006023497B4 Verfahren zur Behandlung einer Halbleiterscheibe A process for treating a semiconductor wafer
05/29/2008DE102006013419B4 Verfahren zum Herstellen einer integrierten Schaltung A method of fabricating an integrated circuit
05/29/2008DE102004063523B4 Halbleitervorrichtung Semiconductor device
05/29/2008DE10122075B4 Halbleiterspeicherzelle und deren Herstellungsverfahren A semiconductor memory cell and its manufacturing method
05/29/2008DE10104274C5 Halbleiterbauteil mit MOS-Gatesteuerung und mit einer Kontaktstruktur sowie Verfahren zu seiner Herstellung A semiconductor device comprising MOS gated and with a contact structure and method for its preparation
05/28/2008EP1926158A1 Method and apparatus for manufacturing magnetoresistive device
05/28/2008EP1926147A2 Method of manufacturing a semiconductor device and products made thereby
05/28/2008EP1926141A2 Method of manufacturing single crystal silicon solar cell and single crystal silicon solar cell
05/28/2008EP1926140A2 Semiconductor devices having air gaps
05/28/2008EP1926139A2 SOQ substrate and method of manufacturing SOQ substrate
05/28/2008EP1926137A2 Heat-resistant adhesive tape for manufacturing semiconductor device
05/28/2008EP1926136A2 Electronic component and method for manufacturing the same
05/28/2008EP1926135A2 Electronic component and method for manufacturing the same
05/28/2008EP1926134A1 Method for manufacturing silicon epitaxial wafers
05/28/2008EP1926133A2 A method for boron contamination reduction in IC fabrication
05/28/2008EP1926132A1 Chromium-free etching solution for Si-substrates and SiGe-substrates, method for revealing defects using the etching solution and process for treating Si-substrates and SiGe-substrates using the etching solution
05/28/2008EP1926131A1 Laser annealing method and device
05/28/2008EP1926130A1 Method of improving the surface of a semiconductor substrate
05/28/2008EP1926129A1 Beam transforming element, illumination optical apparatus, exposure apparatus, and exposure method
05/28/2008EP1926128A1 Exposure apparatus, method and process for producing device
05/28/2008EP1926127A1 Exposure apparatus, exposure method, and device manufacturing method
05/28/2008EP1926126A2 Substrate processing apparatus and substrate processing method
05/28/2008EP1926125A1 Endpoint detection for photomask etching
05/28/2008EP1925980A2 Positive type resisit composition and resisit pattern formation method using same
05/28/2008EP1925974A2 Fabrication of a wiring pattern and of an active matrix substrate
05/28/2008EP1925964A1 Light scanning mechanism for scan displacement invariant laser ablation apparatus
05/28/2008EP1925946A2 Tunnel magnetoresistance element
05/28/2008EP1925909A1 Device for cleaning and decontaminating an object with a non-airtight confined environment limited by a flexible membrane wall
05/28/2008EP1925863A1 Fluid controller
05/28/2008EP1925649A2 Polishing composition and polishing process
05/28/2008EP1925648A2 Polishing composition and polishing process
05/28/2008EP1925647A2 Polishing composition and polishing method
05/28/2008EP1925584A2 Overhead traveling vehicle having lateral movement mechanism
05/28/2008EP1925577A1 Method for forming stacks of wafers to be doped on one side, in particular solar wafers, and handling system for loading a process boat with wafer batches
05/28/2008EP1925192A1 Laminated substrate for mounting electronic parts
05/28/2008EP1925029A1 Spacers between bitlines in virtual ground memory array
05/28/2008EP1925028A2 Protective barrier layer for semiconductor device electrodes
05/28/2008EP1925025A2 Printed fuse devices and methods for making the same
05/28/2008EP1925024A1 Capping layer formation onto a dual damescene interconnect
05/28/2008EP1925023A1 Method and device for depositing electronic components on a substrate
05/28/2008EP1925022A2 Process for modifying dielectric materials
05/28/2008EP1925021A1 Cleaning member, substrate cleaning apparatus and substrate processing apparatus
05/28/2008EP1925020A2 Systems, masks, and methods for photolithography
05/28/2008EP1925003A2 Siox:si composite material compositions and methods of making same
05/28/2008EP1924998A2 Sram cell with separate read-write circuitry
05/28/2008EP1924962A1 Device for encapsulating a plurality of electronic identification tags
05/28/2008EP1924719A2 Siox:si composite articles and methods of making same
05/28/2008EP1924666A2 Abrasive-free polishing system
05/28/2008EP1924632A2 Semiconductor device including a coupled dielectric layer and metal layer, method of fabrication thereof, and material for coupling a dielectric layer and a metal layer in a semiconductor device
05/28/2008EP1782461A4 System and method of cleaning and etching a substrate
05/28/2008EP1754254B1 Lift pin with roller glide for reducing friction
05/28/2008EP1714317B1 Optical devices comprising thin ferroelectric films
05/28/2008EP1694585A4 Wafer container with door actuated wafer restraint
05/28/2008EP1683195B1 Semiconductor surface protecting method
05/28/2008EP1586115B1 A layer transfer method
05/28/2008EP1556901B1 Layer arrangement of hetero-connected semiconductor layers, comprising at least one intermediate separation layer, and method for the production thereof
05/28/2008EP1535319A4 Atomic layer deposition of high k metal oxides
05/28/2008EP1535314A4 High rate deposition at low pressures in a small batch reactor
05/28/2008EP1497852A4 Method and apparatus for connecting vertically stacked integrated circuit chips
05/28/2008EP1382048A4 Electrolytic capacitors and method for making them
05/28/2008EP1373099A4 Thin wafer insert