| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/05/2009 | DE19738750B4 Hochspannungs-Leistungs-MOS-Vorrichtung High-voltage power MOS device |
| 02/05/2009 | DE19541497B4 Lateraler Feldeffekttransistor Lateral field effect transistor |
| 02/05/2009 | DE112007000697T5 Leistungshalbleitervorrichtung Power semiconductor device |
| 02/05/2009 | DE112007000626T5 Halbleiter-Feldeffekttransistor und Verfahren zur Herstellung desselben Of the same semiconductor field-effect transistor and methods for making |
| 02/05/2009 | DE112006001194T9 Kondensatoren mit nassem Elektrolyten Wet electrolytic capacitors |
| 02/05/2009 | DE112006001194T5 Kondensatoren mit nassem Elektrolyten Wet electrolytic capacitors |
| 02/05/2009 | DE112004001244B4 Halbleitervorrichtung mit einem Feld aus Flashspeicherzellen und Prozess Semiconductor device having an array of flash memory cells process and |
| 02/05/2009 | DE10236197B4 Harzversiegelte Halbleitervorrichtung The resin-sealed semiconductor device |
| 02/05/2009 | DE102008035802A1 Substratbearbeitungsvorrichtung The substrate processing apparatus |
| 02/05/2009 | DE102008034801A1 Wiederverwendbares Substrat und Verfahren zu dessen Behandlung A reusable substrate and method of treatment |
| 02/05/2009 | DE102008034789A1 Verfahren zum Herstellen einer Halbleitervorrichtung, Verfahren zum Herstellen einer SOI-Vorrichtung, Halbleitervorrichtung und SOI-Vorrichtung A method of manufacturing a semiconductor device, method for producing a SOI device, semiconductor device, and SOI device |
| 02/05/2009 | DE102008034693A1 Integrierte Schaltung mit verbundenem Vorderseitenkontakt und Rückseitenkontakt Integrated circuit with a bandaged front contact and back contact |
| 02/05/2009 | DE102008034562A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation |
| 02/05/2009 | DE102008034515A1 Erzeugung einer digital gesteuerten analogen Sinusfunktion Generating a digitally controlled analog sine function |
| 02/05/2009 | DE102008034158A1 Integrierte Schaltung mit einer Halbleiteranordnung in Dünnfilm-SOI-Technologie An integrated circuit with a semiconductor device in thin film SOI technology |
| 02/05/2009 | DE102008032510A1 System in einem Gehäuse und Verfahren zu seiner Herstellung System in a housing and method for its preparation |
| 02/05/2009 | DE102008032233A1 Verfahren zur Herstellung einer Kristallvorrichtung A method of manufacturing a crystal device |
| 02/05/2009 | DE102008029867A1 Verfahren zur Herstellung eines Flash-Speicherbauelementes A method for producing a flash memory device |
| 02/05/2009 | DE102008027466A1 Bond-Pad-Stacks für ESD unter einem Pad und Bonden einer aktiven Schaltung unterhalb eines Pads Bond pad stacks for ESD under a pad and bonding an active circuit below a pad |
| 02/05/2009 | DE102008002653A1 Verfahren und Layout eines Halbleiterbauelements mit reduzierten Störeffekten A method and layout of a semiconductor device with reduced interference effects |
| 02/05/2009 | DE102007049923A1 Photomasken-Layoutmuster Photomask layout pattern |
| 02/05/2009 | DE102007042271B3 Methods for determining position of stripping edge of disk-shaped object, involves recording boundary region of object in line-by-line manner, where boundary region has stripping edge |
| 02/05/2009 | DE102007037888A1 Speicherzellen-Array mit Tunnel-FET als Zugriffstransistor Memory cell array of tunnel FET as an access transistor |
| 02/05/2009 | DE102007037375A1 Verfahren zum Ausbilden einer Struktur auf einem Substrat und ein Bauelement A method of forming a structure on a substrate and a component |
| 02/05/2009 | DE102007036246A1 Vergrößertes Schaltzyklus-resistives Speicherelement Increased switching cycle-resistive memory element |
| 02/05/2009 | DE102007036226A1 Anbringungsstruktur für LEDs, LED-Baugruppe, LED-Baugruppensockel, Verfahren zum Ausbilden einer Anbringungsstruktur The mounting structure for LEDs, LED module, LED module base, method for forming a mounting structure |
| 02/05/2009 | DE102007036045A1 Elektronischer Baustein mit zumindest einem Bauelement, insbesondere einem Halbleiterbauelement, und Verfahren zu dessen Herstellung Electronic component with at least one component, in particular a semiconductor device, and method for its production |
| 02/05/2009 | DE102007036044A1 Chip module, particularly power module, comprises chip which is provided with main side with one or multiple chip contact surfaces, where structured sheet metal layer is provided with main side |
| 02/05/2009 | DE102007035902A1 Verfahren zum Herstellen eines elektronischen Bausteins und elektronischer Baustein A method of manufacturing an electronic component and electronic component |
| 02/05/2009 | DE102007035858A1 Integrated circuit for use in e.g. semiconductor device, has memory cell array with spatially positioned cavities, where size of cavities are selected such that mechanical stress occurring inside array is compensated partially by cavities |
| 02/05/2009 | DE102007035857A1 Fabricating an integrated circuit with a resistance change memory device, comprises forming a second conducting layer on or above a first conducting layer of a compound structure, and structuring the second conducting layer |
| 02/05/2009 | DE102007035838A1 Verfahren zum Ausbilden einer Halbleiterstruktur mit einer Implantation von Ionen eines nicht-dotierenden Elements A method of forming a semiconductor structure with an implantation of ions of a non-doping element |
| 02/05/2009 | DE102007035837A1 Halbleiterbauelement mit einer Kornorientierungsschicht A semiconductor device having a grain orientation layer |
| 02/05/2009 | DE102007035834A1 Halbleiterbauelement mit lokal erhöhtem Elektromigrationswiderstand in einer Verbindungsstruktur A semiconductor device with locally increased electromigration resistance in an interconnection structure |
| 02/05/2009 | DE102007035832A1 Verfahren zur Herstellung eines tiefen Grabens in einem SOI-Bauelement durch Reduzieren des Abschirmeffekts der aktiven Schicht während des Ätzprozesses für den tiefen Graben A process for producing a deep trench in an SOI device by reducing the shielding effect of the active layer during the etching process for the deep trench |
| 02/05/2009 | DE102007035788A1 Waferfügeverfahren, Waferverbund sowie Chip Wafer bonding process, the wafer assembly and chip |
| 02/05/2009 | DE102007035608A1 Semiconductor module, has connecting element connecting electrode of semiconductor chip with contact connection surface of substrate, and semiconductor chip, connecting element and substrate embedded in cover of flexible group layer |
| 02/05/2009 | DE102007035587A1 Integrierte Schaltung und entsprechende Herstellungsverfahren Integrated circuit and corresponding manufacturing processes |
| 02/05/2009 | DE102007034949A1 Einheitlich normierte Leistungspackages Uniformly normalized power packages |
| 02/05/2009 | DE102006053823B4 Verfahren zum Verlegen eines Drahtes Method for laying a wire |
| 02/05/2009 | DE102006051494B4 Verfahren zum Ausbilden einer Halbleiterstruktur, die einen Feldeffekt-Transistor mit verspanntem Kanalgebiet umfasst A method of forming a semiconductor structure comprising a field effect transistor having strained channel region |
| 02/05/2009 | DE102004016992B4 Verfahren zur Herstellung eines Bipolar-Transistors A process for producing a bipolar transistor |
| 02/04/2009 | EP2020691A2 III-Nitride semiconductor light emitting device |
| 02/04/2009 | EP2020682A1 Storage container for photomask-forming synthetic quartz glass substrate |
| 02/04/2009 | EP2020681A2 Process of manufacturing trench gate semiconductor device |
| 02/04/2009 | EP2020680A1 Polishing liquid for cmp and method of polishing |
| 02/04/2009 | EP2020679A1 Illuminating optical apparatus, exposure apparatus, and device manufacturing method |
| 02/04/2009 | EP2020658A2 Semiconductor memory device and semiconductor device |
| 02/04/2009 | EP2020588A1 Test wafer for detecting position |
| 02/04/2009 | EP2020031A2 High performance 3d fet structures, and methods for forming the same using preferential crystallographic etching |
| 02/04/2009 | EP2020024A1 Substrate transfer equipment and high speed substrate processing system using the same |
| 02/04/2009 | EP2020023A2 Method for forming c4 connections on integrated circuit chips and the resulting devices |
| 02/04/2009 | EP2020022A2 Semiconductor on glass insulator made using improved thinning process |
| 02/04/2009 | EP2020021A1 Improved semiconductor seal ring |
| 02/04/2009 | EP1466367B1 Non-volatile two-transistor semiconductor memory cell and method for producing the same |
| 02/04/2009 | EP1417704B1 Method of manufacturing a non-volatile memory transistor with an access gate on one side of a control gate/floating-gate stack using a spacer |
| 02/04/2009 | EP1247292B1 Method of forming copper interconnections and thin films using chemical vapor deposition with catalyst |
| 02/04/2009 | EP1243915B1 Apparatus for evaluating electrical characteristics |
| 02/04/2009 | EP1169735B1 Semiconductor radiation emitter package |
| 02/04/2009 | EP0951071B1 Semiconductor device |
| 02/04/2009 | EP0916157B1 Method of fabricating thin film ferroelectric capacitors having improved memory retention through the use of smooth bottom electrode structures |
| 02/04/2009 | CN201191538Y Bonded wire production equipment for semiconductor package |
| 02/04/2009 | CN201190182Y Automatic loading trolleys by electro-magnetism vapor deposition method |
| 02/04/2009 | CN201189632Y Carrier billet adjusting apparatus for grinding silicon chip |
| 02/04/2009 | CN101361412A Electronic components mounting adhesive, manufacturing method of an electronic components mounting adhesive, electronic components mounted structure, and manufacturing method of an electronic componen |
| 02/04/2009 | CN101361201A Method of photoelement resin sealing/molding |
| 02/04/2009 | CN101361192A Semiconductor device |
| 02/04/2009 | CN101361191A Electronic element, current control device, arithmetic device, and display device |
| 02/04/2009 | CN101361190A Solid state imaging device and method for fabricating the same |
| 02/04/2009 | CN101361179A Manufacturing method of semiconductor device and semiconductor device |
| 02/04/2009 | CN101361178A Semiconductor transistors with expanded top portions of gates |
| 02/04/2009 | CN101361177A Substrate transferring apparatus, substrate processing apparatus, substrate transferring arm and substrate transferring method |
| 02/04/2009 | CN101361176A Plasma diagnostic apparatus and method |
| 02/04/2009 | CN101361175A Method of encapsulating electronic part with resin and die assembly and lead frame both for use in the same |
| 02/04/2009 | CN101361174A Method for fabricating last level copper-to-c4 connection with interfacial cap structure |
| 02/04/2009 | CN101361173A Introduction of metal impurity to change workfunction of conductive electrodes |
| 02/04/2009 | CN101361172A Air break for improved silicide formation with composite caps |
| 02/04/2009 | CN101361171A Method for manufacturing silicon single crystal wafer |
| 02/04/2009 | CN101361170A Method for production of nano-porous substrate |
| 02/04/2009 | CN101361169A Substrate processing apparatus and substrate processing method |
| 02/04/2009 | CN101361168A High efficiency solar cell fabrication |
| 02/04/2009 | CN101361167A Apparatus and method for cleaning of objects, in particular of thin discs |
| 02/04/2009 | CN101361166A Apparatus and method for cleaning of objects, in particular of thin discs |
| 02/04/2009 | CN101361165A Rotary chip attach |
| 02/04/2009 | CN101361164A Apparatus for degassing a wafer-like substrate |
| 02/04/2009 | CN101361163A Metal cuboid semiconductor device and method |
| 02/04/2009 | CN101361033A Method, program and arithmetic processor for setting microprocessor power supply voltage |
| 02/04/2009 | CN101360983A Temperature estimation method and device |
| 02/04/2009 | CN101360852A Process for producing silicon single crystal wafer |
| 02/04/2009 | CN101360589A Multijoint robot |
| 02/04/2009 | CN101360393A Circuit board construction embedded with semi-conductor chip and preparation thereof |
| 02/04/2009 | CN101360392A Circuit board construction embedded with passive component and stack connection construction |
| 02/04/2009 | CN101359899A Thin film semiconductor device and manufacturing method |
| 02/04/2009 | CN101359805A Growing method for epitaxial wafer of 780nm-850nm non-aluminum laser |
| 02/04/2009 | CN101359723A Preparation of organic light emitting display |
| 02/04/2009 | CN101359718A Phase change memory device and method of fabricating the same |
| 02/04/2009 | CN101359709A Process for transferring epitaxial layer of gallium nitride |
| 02/04/2009 | CN101359705A Multi-element alloy oxide film material with forbidden bandwidth continuously adjustable and preparation thereof |
| 02/04/2009 | CN101359703A Manufacturing method for strip material of embedded ejection forming conductive wire frame |
| 02/04/2009 | CN101359693A Thin film transistor, array substrate having the transistor, and method of manufacturing the array substrate |