Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2009
02/05/2009WO2009017271A2 Metal-based package substrate, three-dimensional multi-layered package module using the same, and manufacturing method thereof
02/05/2009WO2009017253A1 Liquid resin composition for adhesive, semiconductor device, and process for producing semiconductor device
02/05/2009WO2009017247A1 Polymer for forming insulating film, composition for forming insulating film, insulating film, and electronic device having insulating film
02/05/2009WO2009017223A1 Semiconductor evaluation circuit
02/05/2009WO2009017221A1 High-strength columnar crystal silicon and plasma etching device part formed by the high-strength columnar crystal silicon
02/05/2009WO2009017200A1 Circuit connection material, and connection structure of circuit member and connection method of circuit member using the circuit connection material
02/05/2009WO2009017146A1 Cu wiring film
02/05/2009WO2009017111A1 Method for adjusting exposure apparatus, exposure apparatus and device manufacturing method
02/05/2009WO2009017095A1 Polishing liquid for metal and method of polishing
02/05/2009WO2009017088A1 Method of manufacturing electrostatic chuck mechanism
02/05/2009WO2009017073A1 Polyimide film and wiring board
02/05/2009WO2009017020A1 Quartz glass member for plasma etching
02/05/2009WO2009016980A1 Plated material having metal thin film formed by electroless plating, and method for production thereof
02/05/2009WO2009016979A1 Plated material having metal thin film formed by electroless plating, and method for production thereof
02/05/2009WO2009016951A1 Method for manufacturing semiconductor device, semiconductor device, and exposure apparatus
02/05/2009WO2009016928A1 Semiconductor device and method for manufacturing the same
02/05/2009WO2009016920A1 Floating transfer apparatus, and treating system having the floating transfer apparatus
02/05/2009WO2009016919A1 Processing apparatus and clean system including processing apparatus
02/05/2009WO2009016918A1 Direction change device and levitation transportation system including direction change device
02/05/2009WO2009016880A1 Semiconductor device
02/05/2009WO2009016870A1 Heat treatment apparatus and heat treatment method
02/05/2009WO2009016795A1 Bonded wafer manufacturing method
02/05/2009WO2009016794A1 Epitaxial wafer manufacturing method and epitaxial wafer
02/05/2009WO2009016778A1 Semiconductor device and method for manufacturing the same
02/05/2009WO2009016742A1 Semiconductor device, and noise measuring method
02/05/2009WO2009016739A1 Semiconductor device and its manufacturing method
02/05/2009WO2009016732A1 Substrate inspection apparatus and substrate inspection method
02/05/2009WO2009016495A1 Semiconductor device having a bump electrode and method for its manufacture
02/05/2009WO2009016438A1 Method of forming openings in a semiconductor device and semiconductor device
02/05/2009WO2009016437A1 Method of manufacturing a semiconductor device and semiconductor device obtainable therewith
02/05/2009WO2009016408A1 Flexible joint
02/05/2009WO2009016304A2 Method for coating two elements hybridized by means of a soldering material
02/05/2009WO2009016134A1 Production of isolation trenches with different sidewall dopings
02/05/2009WO2009016126A1 Method for manufacturing a module and module
02/05/2009WO2009016041A1 Method for producing an electronic component and electronic component
02/05/2009WO2009015923A1 Small area, robust silicon via structure and process
02/05/2009WO2009015742A2 Device and method for holding and transporting substrates
02/05/2009WO2008147433A3 Methods and devices employing metal layers in gates to introduce channel strain
02/05/2009WO2008145085A4 Gripper, in particular a bernoulli gripper
02/05/2009WO2008143885A3 Protection layer for fabricating a solar cell
02/05/2009WO2008142546A3 An antireflective coating composition comprising fused aromatic rings
02/05/2009WO2008119038A3 Improved method of reducing channeling of ion implants using a sacrificial scattering layer
02/05/2009WO2008115266A3 Growth of metallic nanodots using specific precursors
02/05/2009WO2008112673A3 Dynamic temperature backside gas control for improved within-substrate processing uniformity
02/05/2009WO2008099767A3 Curable liquid composition, method of coating, inorganic substrate, and semiconductor device
02/05/2009WO2007131057A3 Vacuum processing chamber suitable for etching high aspect ratio features and components of same
02/05/2009WO2007110515A8 Method of detaching a thin film by melting precipitates
02/05/2009WO2007078572A3 Apparatus and method for controlling plasma density profile
02/05/2009US20090037852 Pattern data generation method and pattern data generation program
02/05/2009US20090036835 Catheter securement device
02/05/2009US20090036041 Cmp pad dresser and cmp apparatus using the same
02/05/2009US20090036024 Cmp apparatus and method of polishing wafer using cmp
02/05/2009US20090035952 Methods for low temperature oxidation of a semiconductor device
02/05/2009US20090035951 Manufacturing method of semiconductor device
02/05/2009US20090035950 Nitriding method of gate oxide film
02/05/2009US20090035949 Method of depositing rare earth oxide thin films
02/05/2009US20090035948 Substrate processing apparatus, heating apparatus for use in the same, method of manufacturing semiconductors with those apparatuses, and heating element supporting structure
02/05/2009US20090035947 Manufacturing Method of Semiconductor Device, and Substrate Processing Apparatus
02/05/2009US20090035946 In situ deposition of different metal-containing films using cyclopentadienyl metal precursors
02/05/2009US20090035945 Manufacturing method of semiconductor integrated circuit device
02/05/2009US20090035944 Methods of for forming ultra thin structures on a substrate
02/05/2009US20090035943 Method of Fabricating for Semiconductor Device Fabrication
02/05/2009US20090035942 Ruthenium CMP compositions and methods
02/05/2009US20090035941 Methods and apparatus for manufacturing a semiconductor device in a processing chamber
02/05/2009US20090035940 Copper metallization of through silicon via
02/05/2009US20090035939 Fabrication method to minimize ballast layer defects
02/05/2009US20090035938 Methods of Forming CoSi2, Methods of Forming Field Effect Transistors, and Methods of Forming Conductive Contacts
02/05/2009US20090035937 In-Situ Deposition for Cu Hillock Suppression
02/05/2009US20090035936 Semiconductor device having a grain orientation layer
02/05/2009US20090035935 Method of forming a metal wiring
02/05/2009US20090035934 Self-Aligned Cross-Point Memory Fabrication
02/05/2009US20090035933 Dendrite growth control circuit
02/05/2009US20090035932 Method for forming vias in a substrate
02/05/2009US20090035931 Method for forming vias in a substrate
02/05/2009US20090035930 Method of forming a wire structure
02/05/2009US20090035929 Method of manufacturing semiconductor device
02/05/2009US20090035928 Method of processing a high-k dielectric for cet scaling
02/05/2009US20090035927 Method of forming dielectric layers on a substrate and apparatus therefor
02/05/2009US20090035926 Methods of Fabricating Silicon Carbide Devices Incorporating Multiple Floating Guard Ring Edge Terminations
02/05/2009US20090035925 Gallium Nitride Semiconductor Device
02/05/2009US20090035924 Method of forming a semiconductor structure comprising an implantation of ions of a non-doping element
02/05/2009US20090035923 Method for manufacturing a semiconductor device
02/05/2009US20090035922 Semiconductor device and manufacturing method thereof
02/05/2009US20090035921 Formation of lattice-tuning semiconductor substrates
02/05/2009US20090035920 Process for fabricating a substrate of the silicon-on-insulator type with reduced roughness and uniform thickness
02/05/2009US20090035919 In-place bonding of microstructures
02/05/2009US20090035918 Post deposition plasma treatment to increase tensile stress of hdp-cvd sio2
02/05/2009US20090035917 Method for forming device isolation structure of semiconductor device using annealing steps to anneal flowable insulation layer
02/05/2009US20090035916 Method for manufacturing semiconductor device having fin gate
02/05/2009US20090035915 Method of high density plasma gap-filling with minimization of gas phase nucleation
02/05/2009US20090035914 Isolation trench processing for strain control
02/05/2009US20090035913 High-capacitance density thin film dielectrics having columnar grains formed on base-metal foils
02/05/2009US20090035912 Semiconductor Device and Fabrication Method Thereof
02/05/2009US20090035911 Method for forming a semiconductor device having abrupt ultra shallow epi-tip regions
02/05/2009US20090035910 Method of Forming The NDMOS Device Body With The Reduced Number of Masks
02/05/2009US20090035909 Method of fabrication of a finfet element
02/05/2009US20090035908 Process for fabricating a nanowire-based vertical transistor structure
02/05/2009US20090035907 Method of forming stacked gate structure for semiconductor memory
02/05/2009US20090035906 Method of manufacturing a non-volatile semiconductor device
02/05/2009US20090035905 Insitu formation of inverse floating gate poly structures