| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 02/05/2009 | US20090035904 Methods of forming non-volatile memory having tunnel insulator of increasing conduction band offset |
| 02/05/2009 | US20090035903 Semiconductor devices and methods of fabricating the same |
| 02/05/2009 | US20090035902 Integrated method of fabricating a memory device with reduced pitch |
| 02/05/2009 | US20090035901 Method for fabricating memory device with recess channel mos transistor |
| 02/05/2009 | US20090035900 Method of Forming High Density Trench FET with Integrated Schottky Diode |
| 02/05/2009 | US20090035899 Microelectronic device |
| 02/05/2009 | US20090035898 Method of fabricating a layer with tiny structure and thin film transistor comprising the same |
| 02/05/2009 | US20090035897 Hybrid orientation cmos with partial insulation process |
| 02/05/2009 | US20090035896 High power mcm package with improved planarity and heat dissipation |
| 02/05/2009 | US20090035895 Chip package and chip packaging process thereof |
| 02/05/2009 | US20090035894 Apparatus and method for bonding silicon wafer to conductive substrate |
| 02/05/2009 | US20090035893 Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same |
| 02/05/2009 | US20090035892 Component Bonding Method, Component Laminating Method And Bonded Component Structure |
| 02/05/2009 | US20090035891 Method and apparatus for flip-chip bonding |
| 02/05/2009 | US20090035889 CMOS Image Sensor and Method for Manufacturing the Same |
| 02/05/2009 | US20090035888 Two epitaxial layers to reduce crosstalk in an image sensor |
| 02/05/2009 | US20090035887 Solid-state image pickup element, method for manufacturing such solid-state image pickup element and optical waveguide forming device |
| 02/05/2009 | US20090035886 Predoped transfer gate for a cmos image sensor |
| 02/05/2009 | US20090035884 Method for manufacturing surface-emitting laser |
| 02/05/2009 | US20090035883 Auto Routing for Optimal Uniformity Control |
| 02/05/2009 | US20090035882 Method and apparatus for affecting surface composition of cigs absorbers formed by two-stage process |
| 02/05/2009 | US20090035881 Method for manufacturing semiconductor device |
| 02/05/2009 | US20090035880 Maunfacturing method for exposure mask, generating method for mask substrate information, mask substrate, exposure mask, manufacturing method for semiconductor device and server |
| 02/05/2009 | US20090035879 Laser dicing device and laser dicing method |
| 02/05/2009 | US20090035878 Plasma Doping Method and Apparatus |
| 02/05/2009 | US20090035877 Methods of forming a ferroelectric layer and methods of manufacturing a ferroelectric capacitor including the same |
| 02/05/2009 | US20090035667 Method for correcting mask |
| 02/05/2009 | US20090035666 Container for housing a mask blank, method of housing a mask blank, and mask blank package |
| 02/05/2009 | US20090035588 Semiconductor structure and method of manufacturing same |
| 02/05/2009 | US20090035534 Method and structure of a reusable substrate |
| 02/05/2009 | US20090035497 Storage container for photomask-forming synthetic quartz glass substrate |
| 02/05/2009 | US20090035464 having a specific amino alcohol as a ligand containing hafnium metal; as a precursor in thin film formation involving vaporization, such as chemical vapor deposition and atomic layer deposition |
| 02/05/2009 | US20090035105 Apparatus for separating chip, a method for fabricating the apparatus, and a method for separating a chip |
| 02/05/2009 | US20090035103 Substrate processing apparatus |
| 02/05/2009 | US20090035102 Method and system for locally buffering substrate carriers in an overhead transport system for enhancing input/output capabilities of process tools |
| 02/05/2009 | US20090035100 Method of processing an object in a container and lid opening/closing system used in the method |
| 02/05/2009 | US20090035099 Lid opening/closing system for closed container and substrate processing method using same |
| 02/05/2009 | US20090035098 Lid opening/closing system for closed container and substrate processing method using same |
| 02/05/2009 | US20090034567 Method of manufacturing semiconductor laser, semiconductor laser, optical pickup, optical disk device, method of manufacturing semiconductor device, semiconductor device, and method of growing nitride type group iii-v compound semiconductor layer |
| 02/05/2009 | US20090034355 Integrated circuit including memory cells with tunnel fet as selection transistor |
| 02/05/2009 | US20090034317 Semiconductor storage device and method of fabricating the same |
| 02/05/2009 | US20090034225 Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same |
| 02/05/2009 | US20090034151 Pressure Assisted Wafer Holding Apparatus and Control Method |
| 02/05/2009 | US20090034150 Substrate holding system and exposure apparatus using the same |
| 02/05/2009 | US20090034149 Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing |
| 02/05/2009 | US20090034147 Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing |
| 02/05/2009 | US20090033948 Method of Measuring Shot Shape and Mask |
| 02/05/2009 | US20090033929 Substrates for raman spectroscopy having discontinuous metal coatings |
| 02/05/2009 | US20090033915 Apc system and multivariate monitoring method for plasma process machine |
| 02/05/2009 | US20090033905 Lithographic apparatus and device manufacturing method |
| 02/05/2009 | US20090033897 Limiting a Portion of a Patterning Device Used to Pattern A Beam |
| 02/05/2009 | US20090033893 Methods and Systems to Compensate for a Stitching Disturbance of a Printed Pattern in a Maskless Lithography System Not Utilizing Overlap of the Exposure Zones |
| 02/05/2009 | US20090033815 Pixel Structures, Methods of Forming the Same and Multi Domain Vertical Alignment LCDs |
| 02/05/2009 | US20090033695 Printheads |
| 02/05/2009 | US20090033582 RFID tags and antennas and methods of their manufacture |
| 02/05/2009 | US20090033397 Delay time adjusting method of semiconductor integrated circuit |
| 02/05/2009 | US20090033362 Method for Forming a Structure on a Substrate and Device |
| 02/05/2009 | US20090033350 Element Substrate, Inspecting Method, and Manufacturing Method of Semiconductor Device |
| 02/05/2009 | US20090033206 Graded Junction Silicon Nanocrystal Embedded Silicon Oxide Electroluminescence Device |
| 02/05/2009 | US20090032998 Molding apparatus and molding method |
| 02/05/2009 | US20090032979 Semiconductor device having alignment mark and its manufacturing method |
| 02/05/2009 | US20090032978 Microelectronic structure including dual damascene structure and high contrast alignment mark |
| 02/05/2009 | US20090032976 Semiconductor device manufacturing method |
| 02/05/2009 | US20090032975 Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution |
| 02/05/2009 | US20090032974 Method and structure to reduce cracking in flip chip underfill |
| 02/05/2009 | US20090032971 Die Stacking Apparatus and Method |
| 02/05/2009 | US20090032970 Stacking of integrated circuits using glassy metal bonding |
| 02/05/2009 | US20090032969 Arrangement of Integrated Circuit Dice and Method for Fabricating Same |
| 02/05/2009 | US20090032966 Method of fabricating a 3-D device and device made thereby |
| 02/05/2009 | US20090032964 System and method for providing semiconductor device features using a protective layer |
| 02/05/2009 | US20090032963 Semiconductor structures including tight pitch contacts and methods to form same |
| 02/05/2009 | US20090032962 Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation |
| 02/05/2009 | US20090032961 Semiconductor device having a locally enhanced electromigration resistance in an interconnect structure |
| 02/05/2009 | US20090032960 Semiconductor devices and methods of manufacturing semiconductor devices |
| 02/05/2009 | US20090032958 Intermetallic conductors |
| 02/05/2009 | US20090032955 Semiconductor device, its manufacturing method and display apparatus |
| 02/05/2009 | US20090032954 Semiconductor device and method of fabricating the same |
| 02/05/2009 | US20090032953 Semiconductor device and method of manufacturing the same |
| 02/05/2009 | US20090032951 Small Area, Robust Silicon Via Structure and Process |
| 02/05/2009 | US20090032950 Film forming method, semiconductor device manufacturing method, semiconductor device, program and recording medium |
| 02/05/2009 | US20090032949 Method of depositing Tungsten using plasma-treated tungsten nitride |
| 02/05/2009 | US20090032947 Semiconductor device and method of manufacturing |
| 02/05/2009 | US20090032944 Electronic device, method of producing the same, and semiconductor device |
| 02/05/2009 | US20090032943 Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication |
| 02/05/2009 | US20090032942 Semiconductor chip with solder bump and method of fabricating the same |
| 02/05/2009 | US20090032941 Under Bump Routing Layer Method and Apparatus |
| 02/05/2009 | US20090032940 Conductor Bump Method and Apparatus |
| 02/05/2009 | US20090032939 Method of forming a stud bump over passivation, and related device |
| 02/05/2009 | US20090032936 Semiconductor device, method for the same, and heat radiator |
| 02/05/2009 | US20090032935 Semiconductor device |
| 02/05/2009 | US20090032933 Redistributed chip packaging with thermal contact to device backside |
| 02/05/2009 | US20090032930 Packaging substrate having chip embedded therein and manufacturing method thereof |
| 02/05/2009 | US20090032929 Semiconductor chips with reduced stress from underfill at edge of chip |
| 02/05/2009 | US20090032928 Multi-chip stack structure having through silicon via and method for fabrication the same |
| 02/05/2009 | US20090032927 Semiconductor substrates connected with a ball grid array |
| 02/05/2009 | US20090032926 Integrated Support Structure for Stacked Semiconductors With Overhang |
| 02/05/2009 | US20090032925 Packaging with a connection structure |
| 02/05/2009 | US20090032924 Hermetically sealed package with window |
| 02/05/2009 | US20090032920 Laser release process for very thin si-carrier build |
| 02/05/2009 | US20090032918 Integrated circuit package system with multiple devices |