Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2009
02/25/2009CN101373723A Electronic device handler for a bonding apparatus
02/25/2009CN101373722A Semiconductor device and manufacturing method for the same
02/25/2009CN101373721A Method for making ic structure and method for processing inner-inserting plate wafer
02/25/2009CN101373720A Method of manufacturing semiconductor device
02/25/2009CN101373719A Manufacturing method of semiconductor device having relay board
02/25/2009CN101373718A Ball-establishing method for package substrate
02/25/2009CN101373717A Method for manufacturing transistor by thinning silicon monocrystal thin sheet prediffusion single face
02/25/2009CN101373716A Manufacture process of self-aligning silicides film and structure thereof
02/25/2009CN101373715A Method for increasing energy band gap of aluminum oxide layer and method of manufacturing storing device
02/25/2009CN101373714A Method for preparing nano-scale pattern substrate for nitride epitaxial growth
02/25/2009CN101373713A Semiconductor wafer processing to increase the usable planar surface area
02/25/2009CN101373712A Method for preparing transparent conductive oxide CuAlO2 thin film
02/25/2009CN101373711A Method for manufacturing non-volatile memory device
02/25/2009CN101373710A Manufacturing method for SSOI substrate
02/25/2009CN101373709A Method for preparing non-crack nitride semiconductor substrate
02/25/2009CN101373708A Substrate processing apparatus
02/25/2009CN101373707A Processing device
02/25/2009CN101373706A Substrate cleaning apparatus and substrate cleaning method
02/25/2009CN101373705A Apparatus for cleaning substrate and method for cleaning substrate
02/25/2009CN101373704A Method for cleaning semiconductor substrate
02/25/2009CN101373703A Cap-opening mechanism and semiconductor processing device and cap-opening control method thereof
02/25/2009CN101373702A Cavity inner lining and reaction cavity
02/25/2009CN101373694A Ion implantation apparatus
02/25/2009CN101373635A Non-volatile memory device
02/25/2009CN101373508A Test device and method suitable for electronic label
02/25/2009CN101373375A Method for controlling semiconductor-processing apparatus
02/25/2009CN101373337A Exposure method, device manufacturing method, substrate and manufacturing method thereof
02/25/2009CN101373336A Method for optimizing exposure device monitoring
02/25/2009CN101373335A Method for optimizing scan exposure
02/25/2009CN101373327A Mask for semiconductor device and patterning method using the same
02/25/2009CN101373322A Blank mask and method for fabricating photomask using the same
02/25/2009CN101373303A Liquid crystal display panel, pixel structure and pixel structure preparation method
02/25/2009CN101373301A FFS type TFT-LCD array substrate structure and manufacturing method thereof
02/25/2009CN101373300A TFT LCD color film substrate structure and manufacturing method thereof
02/25/2009CN101373299A FFS thin-film transistor LCD device pixel structure and manufacturing method thereof
02/25/2009CN101372760A Preparation of glowing oxygen doped gallium arsenide polycrystalline film
02/25/2009CN101372745A Method for adjusting etching bias
02/25/2009CN101372739A Method for removing metal impurity from quartz component part used in heat processing apparatus of batch type
02/25/2009CN101372090A Method for measuring thickness of substrate and equipment for processing substrate
02/25/2009CN101372089A Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing
02/25/2009CN101371958A Exhaust gas collection device
02/25/2009CN100464502C Monotonic dynamic-static pseudo-NMOS logic circuit and method of forming logic gate array
02/25/2009CN100464439C LED package structure and method for manufacturing the same
02/25/2009CN100464430C Method for producing a vertical field effect transistor and field effect transistor
02/25/2009CN100464429C Liquid crystal display device, its manufacturing method, and liquid crystal television receiver
02/25/2009CN100464428C Gate electrode inversion thyristor with controllable efficiency
02/25/2009CN100464427C Method for evaluateevaluating grid insulated film
02/25/2009CN100464426C Pixel sensor and method of forming the same
02/25/2009CN100464425C Semiconductor constructions and manufacturing method thereof
02/25/2009CN100464424C Integrated circuit and formation method thereof
02/25/2009CN100464423C Memory part, its making method and operation method
02/25/2009CN100464422C Hollow cylindrical capacitor and its producing method
02/25/2009CN100464421C Integrated enhancement type and depletion type vertical bilateral diffusion metallic oxide field effect pipe
02/25/2009CN100464418C Semiconductor device and manufacturing method therefor
02/25/2009CN100464417C Semiconductor device with silicon-containing copper wiring layer and manufacturing method thereof
02/25/2009CN100464415C Non-pin packaging structure of semiconductor element and packaging technology thereof
02/25/2009CN100464414C Soft soldering method for semiconductor components and semiconductor device
02/25/2009CN100464411C Encapsulation method and structure of light emitting diode
02/25/2009CN100464406C Package for electronic device and method for manufacturing electronic device
02/25/2009CN100464404C Making method of pixel structure
02/25/2009CN100464403C DRAM hollow column capacitor and manufacturing method thereof
02/25/2009CN100464402C Method for manufacturing semiconductor device
02/25/2009CN100464401C Object table device
02/25/2009CN100464400C Semiconductor package stacking structure and its preparing method
02/25/2009CN100464399C Lug process and wafer structure of protective detection welding pad
02/25/2009CN100464398C Underfill and mold compounds including siloxane-based aromatic diamines
02/25/2009CN100464397C Field effect transistors and manufacturing method thereof
02/25/2009CN100464396C Method for fabricating thin film transistor
02/25/2009CN100464395C Process for film production and semiconductor device utilizing film produced by the process
02/25/2009CN100464394C Manufacture of semiconductor device using CMP
02/25/2009CN100464393C A manufacture method for GaN insulation or semi-insulation epitaxy layer
02/25/2009CN100464383C T-shaped beam parallel plate micromechanical variable capacitor and manufacturing process thereof
02/25/2009CN100464241C Picture element structure of liquid crystal display device and producing method thereof
02/25/2009CN100464236C Structure of semiconductor chip and display device using the same
02/25/2009CN100464235C Liquid crystal display device and method of fabricating the same
02/25/2009CN100463783C Transport apparatus, control method for the same, and vacuum processing system
02/25/2009CN100463778C Parallel planar grinder
02/24/2009US7495967 Method of identifying logical information in a programming and erasing cell by on-side reading scheme
02/24/2009US7495881 Chucking method and processing method using the same
02/24/2009US7495870 Magnetoresistive effect element, magnetic head, and magnetic reproducing apparatus
02/24/2009US7495840 Very high-aperture projection objective
02/24/2009US7495756 Pattern inspection apparatus
02/24/2009US7495742 Measuring method and apparatus, exposure method and apparatus using the same, and device manufacturing method
02/24/2009US7495741 Method for cutting liquid crystal display panel and method for fabricating liquid crystal display panel using the same
02/24/2009US7495526 Apparatus and method for reducing propagation delay in a conductor system selectable to carry a single signal or independent signals
02/24/2009US7495461 Wafer probe
02/24/2009US7495348 Process for producing copy protection for an electronic circuit
02/24/2009US7495347 Ion implantation with multiple concentration levels
02/24/2009US7495344 Semiconductor apparatus
02/24/2009US7495342 Angled flying lead wire bonding process
02/24/2009US7495341 Methods and apparatus for packaging integrated circuit devices
02/24/2009US7495334 Stacking system and method
02/24/2009US7495332 Multilayer printed wiring board
02/24/2009US7495326 Stacked electronic structures including offset substrates
02/24/2009US7495323 Semiconductor package structure having multiple heat dissipation paths and method of manufacture
02/24/2009US7495322 Light-emitting device
02/24/2009US7495319 Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same
02/24/2009US7495315 Method and apparatus of fabricating a semiconductor device by back grinding and dicing
02/24/2009US7495312 Method for producing vertical bipolar transistors and integrated circuit
02/24/2009US7495309 Semiconductor device and manufacturing method thereof