Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2009
02/19/2009DE19753596B4 Vorrichtung zum Aufbringen einer dünnen Schicht auf ein Substrat A device for applying a thin layer on a substrate
02/19/2009DE112007000997T5 Verfahren zum Verkleinern des minimalen Teilungsmaßes in einer Struktur A method for reducing the minimum pitch of a structure
02/19/2009DE112006003669T5 Filmbildende Zusammensetzung Film-forming composition
02/19/2009DE112006003654T5 Entstauber Dust collector
02/19/2009DE112006003438T5 Kohlenstoffnanoröhrchen-Lötmittel-Kompositpaste für Hochleistungsverbindungen Carbon nanotube solder composite high performance interconnects
02/19/2009DE102008036843A1 Integrierte Schaltung mit Entkopplungskondensatoren, die deaktiviert werden können An integrated circuit having decoupling capacitors, which can be deactivated
02/19/2009DE102008035707A1 Bipolartransistor-Finfet-Technologie Bipolar FinFET technology
02/19/2009DE102008017569A1 Verfahren zur Herstellung eines organischen Substrats mit eingebetteten Aktivchips A process for producing an organic substrate with embedded active chips
02/19/2009DE102007038925A1 Integrated circuit e.g. semiconductor memory device, manufacturing method, involves etching trench in substrate in active region such that trench structure defines dimension of trench in lateral direction, and active device formed in trench
02/19/2009DE102007038744A1 Verfahren zur Herstellung eines Halbleiter-Bauelements, Halbleiter-Bauelement sowie Zwischenprodukt bei der Herstellung desselben The same process for producing a semiconductor device, the semiconductor device as well as an intermediate in the preparation of
02/19/2009DE102007038422A1 New anthracene dicarboxylic acid imide compounds useful e.g. as photodimerisation product for treating tumors, vat dye, dihydroanthercenebisimde compound and bisanthracene dicarboxylic acid imide compounds
02/19/2009DE102007037490A1 Gestapelte Schaltungen Stacked circuits
02/19/2009DE102007036998A1 Verfahren zur Herstellung von amorphen metallorganischen Makromolekülen, mit diesem Verfahren erhaltenes Material und seine Verwendung A process for the preparation of amorphous metal organic macromolecules, obtained by this process material and its use
02/19/2009DE102007015731B4 Verfahren zur Herstellung einer Halbleitervorrichtung, sowie hiermit hergestellte Halbleitervorrichtung A process for producing a semiconductor device, and semiconductor device produced therewith
02/19/2009DE102006025218B4 Leistungshalbleiterbauelement mit Ladungskompensationsstruktur und Verfahren zur Herstellung desselben Power semiconductor component thereof having charge compensation structure and method for producing
02/19/2009DE102006023998B4 Elektronische Schaltungsanordnung und Verfahren zur Herstellung einer solchen Electronic circuitry and methods for producing such
02/19/2009DE10197206B4 System und Verfahren zur Aufteilung einer Strömung System and method for allocating a flow
02/19/2009DE10014308B4 Vorrichtung zum gleichzeitigen Herstellen von mindestens vier Bondverbindungen und Verfahren dazu An apparatus for simultaneously producing at least four bonds and method thereof
02/18/2009EP2026379A1 Multilayer ceramic electronic component and method for manufacturing same
02/18/2009EP2026378A2 Non-volatile FinFET memory device and method of fabricating the same
02/18/2009EP2026081A1 Test device and test method
02/18/2009EP2026078A1 Probe card
02/18/2009EP2025709A1 Precursor composition for porous membrane, process for preparation of the precursor composition, porous membrane, process for production of the porous membrane, and semiconductor device
02/18/2009EP2025468A2 Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method
02/18/2009EP2025000A2 Conductive hard mask to protect patterned features during trench etch
02/18/2009EP2024996A2 Producing soi structure using ion shower
02/18/2009EP2024995A2 Formation of improved soi substrates using bulk semiconductor wafers
02/18/2009EP2024994A1 Method to prevent metal contamination by a substrate holder
02/18/2009EP2024993A1 Structures and methods for low-k or ultra low-k interlayer dielectric pattern transfer
02/18/2009EP2024992A1 Method for smoothing iii-n substrates
02/18/2009EP2024991A1 Method for producing a doped iii-n solid crystal and a free-standing doped iii-n substrate, and doped iii-n solid crystal and free-standing doped iii-n substrate
02/18/2009EP2024990A1 Method of increasing the quality factor of an inductor in a semiconductor device
02/18/2009EP2024716A1 Method and system for testing indirect bandgap semiconductor devices using luminescence imaging
02/18/2009EP2024532A2 Chemical vapor deposition of high quality flow-like silicon dioxide using a silicon containing precursor and atomic oxygen
02/18/2009EP2024264A2 Multiple slot load lock chamber and method of operation
02/18/2009EP1833980A4 Enzyme activity measurements using bio-layer interferometry
02/18/2009EP1570108B1 Susceptor system
02/18/2009EP1502154B1 Patterning of solid state features by direct write nanolithographic printing
02/18/2009EP1476894A4 High voltage power mosfet having a voltage sustaining region that includes doped columns formed by trench etching and diffusion from regions of oppositely doped polysilicon
02/18/2009EP1448745B1 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
02/18/2009EP1402584B1 Arrangement for reducing the piezoelectric effects in at least one electrical component which is sensitive to piezoelectric effects and arranged in an active layer of semiconductor material
02/18/2009EP1264334B1 Method and apparatus for aligning a component on a substrate using digital feature separation
02/18/2009EP1118102B1 Low-pressure apparatus and pressure control valve
02/18/2009EP1085579B1 Method of manufacturing solar cell
02/18/2009CN201196950Y Inflation equipment and air inlet apparatus
02/18/2009CN201196949Y System and target for aligning semiconductor device processing equipment
02/18/2009CN201196654Y Wafer suction disc apparatus for test bench
02/18/2009CN101371413A Nitride semiconductor light-emitting device
02/18/2009CN101371351A Systems and methods for forming additional metal routing in semiconductor devices
02/18/2009CN101371350A Integrated circuit with antireflective coating
02/18/2009CN101371349A Semiconductor device including shallow trench isolation (sti) regions with a superlattice therebetween and associated methods
02/18/2009CN101371348A Germanium on glass and glass-ceramic structures
02/18/2009CN101371347A Large area semiconductor on glass insulator
02/18/2009CN101371346A Pressure bonding device and mounting method
02/18/2009CN101371345A Semiconductor device for high frequency
02/18/2009CN101371344A 场效应晶体管 FET
02/18/2009CN101371343A Self-aligned trench MOSFET structure and method of manufacture
02/18/2009CN101371342A Heating method and heating system for batch-type reaction chamber
02/18/2009CN101371341A Plasma processing apparatus
02/18/2009CN101371340A Method for smoothing wafer surface and apparatus used therefor
02/18/2009CN101371339A Chemical mechanical polishing compositions for step-ii copper liner and other associated materials and method of using same
02/18/2009CN101371338A Method for fabricating and separating semiconductor devices
02/18/2009CN101371337A Trench schottky barrier diode with differential oxide thickness
02/18/2009CN101371336A Fin structure formation
02/18/2009CN101371335A Method for producing semiconductor chip, and field effect transistor and method for manufacturing same
02/18/2009CN101371334A SOI wafer manufacturing method and SOI wafer
02/18/2009CN101371333A Method of packaging a semiconductor die and package thereof
02/18/2009CN101371332A Low resistance and inductance backside through vias and methods of fabricating same
02/18/2009CN101371331A Magnetic annealing tool heat exchange system and processes
02/18/2009CN101371268A Memory card and method for manufacturing memory card
02/18/2009CN101370972A Method for manufacturing aluminum nitride crystal, aluminum nitride crystal, aluminum nitride crystal substrate and semiconductor device
02/18/2009CN101370965A Apparatus for the removal of a set of byproducts from a substrate edge and methods therefor
02/18/2009CN101370962A Methods and arrangement for a highly efficient gas distribution arrangement
02/18/2009CN101370350A Plasma processing system, antenna, and use of plasma processing system
02/18/2009CN101370349A Plasma processing apparatus, plasma processing method and storage medium
02/18/2009CN101369638A Light emitting device and its fabrication method
02/18/2009CN101369637A Organic el device and method of manufacturing the same
02/18/2009CN101369634A Illumination device and making method thereof
02/18/2009CN101369632A Display element with barrier wall structure in display section and manufacturing method thereof
02/18/2009CN101369620A Method for implementing gallium nitride thin film low temperature deposition on silicon substrate
02/18/2009CN101369615A Packaging method for low-thermal resistance high-power light-emitting diode
02/18/2009CN101369613A Method for preparing polysilicon solar battery suede in magnetic field
02/18/2009CN101369611A Insertion type optical coupler array and application in preparation of hybrid integrated circuit
02/18/2009CN101369607A Flash memory unit structure and preparation thereof
02/18/2009CN101369606A Thin-film transistor panel having structure that suppresses characteristic shifts and method for manufacturing the same
02/18/2009CN101369604A Semiconductor device and manufacturing method thereof
02/18/2009CN101369602A Dielectric isolation type semiconductor device and manufacturing method therefor
02/18/2009CN101369601A Heterostructure field effect transistor and manufature method thereof
02/18/2009CN101369600A P type silicon carbide device and preparation thereof
02/18/2009CN101369599A Ohm contact of gallium nitride base device and preparation method thereof
02/18/2009CN101369597A Multi-level memory cell having phase change element and asymmetrical thermal boundary
02/18/2009CN101369596A Solid-state imaging device and method for manufacturing solid-state imaging device
02/18/2009CN101369594A Photoelectric conversion device, method of manufacturing photoelectric conversion device, and image pickup system
02/18/2009CN101369593A Optical device and method for fabricating the same, camera module using optical device, and electronic equipment mounting camera module
02/18/2009CN101369591A Image sensing element packaging body and preparation thereof
02/18/2009CN101369588A Thin film transistor array panel and manufacturing method thereof
02/18/2009CN101369587A Display apparatus
02/18/2009CN101369585A NOR flash memory device and method for fabricating the same
02/18/2009CN101369584A Non-volatile memory device and method of fabricating the same
02/18/2009CN101369582A Vertical non-volatile memory and manufacturing method thereof