Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
03/2009
03/04/2009EP2031647A1 Silicon wafer manufacturing method and silicon wafer manufactured by the method
03/04/2009EP2031646A1 Treating apparatus, method of treating and plasma source
03/04/2009EP2031645A1 Device for elevating up and down cleaning brush of chemical-mechanical wafer polishing apparatus
03/04/2009EP2031644A2 Method for improving germanide growth and devices obtained thereof
03/04/2009EP2031643A2 Blocking dielectric bandgap engineered SONOS/MONOS memory
03/04/2009EP2031642A2 Group III nitride semiconductor and a manufacturing method thereof
03/04/2009EP2031641A1 Semiconductor element and its use
03/04/2009EP2031640A1 Variable slit device, illuminating device, exposure device, exposure method, and method of manufacturing device
03/04/2009EP2031639A2 A method of self-diagnosing software used to drive a processing apparatus
03/04/2009EP2031638A2 A method of automatically resetting a processing apparatus
03/04/2009EP2031606A1 Superconducting thin film material and method for producing the same
03/04/2009EP2031510A1 Semiconductor integrated circuit
03/04/2009EP2031284A1 Valve element portion and gate valve device
03/04/2009EP2031103A1 Method for manufacturing gallium nitride crystal and gallium nitride wafer
03/04/2009EP2031088A2 Wet clean process for recovery of chamber parts
03/04/2009EP2030961A2 Plasma-resistant ceramics with controlled electrical resistivity
03/04/2009EP2030232A1 Semiconductor integrated circuit devices having high-q wafer back-side capacitors
03/04/2009EP2030231A2 Method and device for monitoring a heat treatment of a microtechnological substrate
03/04/2009EP2030230A2 Holder for electrical component and electrical device including the holder and component
03/04/2009EP2030229A2 Apparatus and method for semiconductor bonding
03/04/2009EP2030228A1 Method for producing an injection-moulded part comprising an integrated flexible printed circuit board
03/04/2009EP2030227A2 Methods and systems for selectively depositing si-containing films using chloropolysilanes
03/04/2009EP2030226A1 Plasma etching chamber
03/04/2009EP2030225A2 Wet etch suitable for creating square cuts in si and resulting structures
03/04/2009EP2030224A1 Laser processing of workpieces containing low-k dielectric material
03/04/2009EP2030223A1 Symmetrical mim capacitor design
03/04/2009EP2030222A1 Method and device for removing pollution from a confined environment
03/04/2009EP2030076A2 Method for forming a semiconductor on insulator structure
03/04/2009EP2029685A1 Bonding method with flowable adhesive composition
03/04/2009EP2029310A2 Device and method to create a low divergence, high power laser beam for material processing applications
03/04/2009EP1946358A4 Composition and method for recycling semiconductor wafers having low-k dielectric materials thereon
03/04/2009EP1779416A4 Asymmetric hetero-doped high-voltage mosfet (ah2mos)
03/04/2009EP1735829A4 Device and method for joining substrates
03/04/2009EP1644973A4 Bipolar transistor and method of making same
03/04/2009EP1586108A4 Finfet sram cell using inverted finfet thin film transistors
03/04/2009EP1357583B1 Sheet-fed treating device
03/04/2009EP1313891B1 Cvd coating device
03/04/2009EP1309940B1 Method for connecting a chip to the antenna of a radio frequency identification device of a contactless chip card variety
03/04/2009EP1210651B1 Antireflective coating for photoresist compositions
03/04/2009EP1036414B1 A method of forming a chip scale package using large ductile solder balls
03/04/2009EP1009026B1 Power semiconductor module
03/04/2009EP0968532B1 Lateral silicon carbide semiconductor device having a drift region with varying doping level
03/04/2009CN201204210Y Encapsulation structure for light emitting diode and forming die for manufacturing the same
03/04/2009CN201204199Y Apparatus for etching and soaking liquid crystal display substrate
03/04/2009CN201201803Y Transportation propulsion unit for panel carrier
03/04/2009CN101379896A Method for determining pickup order of component
03/04/2009CN101379628A Light-emitting diode and fabrication method thereof
03/04/2009CN101379610A Low resistance gate for power MOSFET applications and method of manufacture
03/04/2009CN101379609A CMOS devices with hybrid channel orientations, and method for fabricating the same
03/04/2009CN101379608A Copper interconnection for fabricating flat-panel display
03/04/2009CN101379607A Electrostatic chuck
03/04/2009CN101379606A Apparatus for bonding chuck
03/04/2009CN101379605A A semiconductor process system having an optical instrument comprising an apparatus for aligning an optical device with an object
03/04/2009CN101379604A High speed substrate aligner apparatus
03/04/2009CN101379603A Contact-bonding device
03/04/2009CN101379602A Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
03/04/2009CN101379601A Nitrogen based implants for defect reduction in strained silicon
03/04/2009CN101379600A Anisotropic etching method
03/04/2009CN101379599A Single wafer etching method
03/04/2009CN101379598A 化学机械研磨垫 The chemical mechanical polishing pad
03/04/2009CN101379597A Semiconductor device manufacturing method and method for reducing microroughness of semiconductor surface
03/04/2009CN101379596A Method of forming trench contacts for MOS transistors
03/04/2009CN101379595A Method for fabricating a semiconductor component having regions with different levels of doping
03/04/2009CN101379594A Plasma treatment apparatus
03/04/2009CN101379593A Exposure device, device-manufacturing method and exposing method
03/04/2009CN101379592A Semiconductor production plant
03/04/2009CN101379591A Semiconductor device and method of manufacturing thereof
03/04/2009CN101379590A Support for wafer singulation
03/04/2009CN101379539A Reflective TFT substrate and method for manufacturing reflective TFT substrate
03/04/2009CN101379407A An integrated circuit package, and a method for producing an integrated circuit package having two dies with input and output terminals of integrated circuits of the dies directly addressable for test
03/04/2009CN101379214A Epitaxial deposition process and apparatus
03/04/2009CN101379154A CMP composition for improved oxide removal rate
03/04/2009CN101378632A Production method for wiring and vias
03/04/2009CN101378624A Module structure integrating perimeter circuit and manufacturing method thereof
03/04/2009CN101378104A Semiconductor foreign substrate and growing method thereof
03/04/2009CN101378092A Solar battery and component subfissure detection device and test method
03/04/2009CN101378085A Metal-insulator-metal capacitor and method for manufacturing the same
03/04/2009CN101378084A Nonvolatile semiconductor memory element and manufacturing method thereof
03/04/2009CN101378082A Display device and manufacturing method of the same
03/04/2009CN101378081A LCD driver IC and method for manufacturing the same
03/04/2009CN101378080A Semiconductor device and fabricating method thereof
03/04/2009CN101378076A Inverted nonvolatile memory device, stack module, and method of fabricating the same
03/04/2009CN101378073A Insulated gate bipolar transistor and method for manufacturing the same
03/04/2009CN101378069A Image sensor and method for manufacturing the same
03/04/2009CN101378068A Solid-state image capturing device, manufacturing method thereof and electronic information device
03/04/2009CN101378067A Characteristic spectrum identification chip, manufacturing method thereof and detection device using the chip
03/04/2009CN101378065A Memory and manufacturing method thereof
03/04/2009CN101378064A Dram cell and method of manufacturing the same
03/04/2009CN101378063A Semiconductor device and a method for fabricating the same
03/04/2009CN101378061A Semidoncudtor device and method of manufacturing the same
03/04/2009CN101378060A Semiconductor device, method for manufacturing the same, and method for driving the same
03/04/2009CN101378059A Semiconductor device and a method for fabricating the same
03/04/2009CN101378058A LCD driver IC and method for manufacturing the same
03/04/2009CN101378057A Metal-insulator-metal capacitor and method for manufacturing the same
03/04/2009CN101378055A Darlington tube with high reliability for selsyn module and preparation method thereof
03/04/2009CN101378054A Inductor for semiconductor and manufacture method thereof
03/04/2009CN101378051A Semiconductor device and manufacturing method thereof
03/04/2009CN101378050A Multi-substrate chunk type packaging piece and manufacturing method thereof
03/04/2009CN101378049A Inner-burying type multifunctional integration type structure and preparation method thereof
03/04/2009CN101378048A Packaging structure for stacking multiple chips