Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
02/2009
02/12/2009WO2009020129A1 Plasma processing method and plasma processing apparatus
02/12/2009WO2009020070A1 P-type mgzno-based thin film and semiconductor light-emitting element
02/12/2009WO2009020068A1 Container for processing tool for mounting substrate
02/12/2009WO2009020052A1 Coating method
02/12/2009WO2009020051A1 Securing tool and work processing method
02/12/2009WO2009020050A1 Work carrying method and device with work transfer mechanism
02/12/2009WO2009020033A1 Semiconductor light emitting element and method for manufacturing the same
02/12/2009WO2009020029A1 Radiosensitive resin composition
02/12/2009WO2009020024A1 Susceptor and method for manufacturing silicon epitaxial wafer
02/12/2009WO2009020023A1 Power adjusting method, method for manufacturing silicon epitaxial wafer, and susceptor
02/12/2009WO2009020014A1 Integrator and illuminating apparatus using the integrator
02/12/2009WO2009020005A1 Adhesive composition, film-like adhesive, and connection structure for circuit member
02/12/2009WO2009019987A1 Substrate processing method, substrate processing apparatus, program, recording medium and substituting agent
02/12/2009WO2009019985A1 Detecting circuit and electronic apparatus using detecting circuit
02/12/2009WO2009019949A1 Magnetic random access memory and method for manufacturing the same
02/12/2009WO2009019948A1 Magnetic recorder and magnetization fixing method
02/12/2009WO2009019947A1 Magnetic wall random access memory
02/12/2009WO2009019866A1 Semiconductor device and method for driving the same
02/12/2009WO2009019865A1 Semiconductor device, method for manufacturing the same and image display
02/12/2009WO2009019864A1 Semiconductor device, method for manufacturing the same and image display
02/12/2009WO2009019827A1 Semiconductor device and manufacturing method thereof
02/12/2009WO2009019813A1 Solid-state imaging device
02/12/2009WO2009019788A1 Semiconductor integrated circuit
02/12/2009WO2009019762A1 Process for manufacturing optical matrix device
02/12/2009WO2009019745A1 Anti-dropping mechanism for molded product
02/12/2009WO2009019266A2 Method of low-temperature transfer from a layer of self-assembled molecules
02/12/2009WO2009019265A2 Method of transferring a layer onto a liquid material
02/12/2009WO2009019187A2 Circuit structure with metal gate and high-k dielectric
02/12/2009WO2009019091A1 Unit and production of a unit
02/12/2009WO2009019063A1 Electromigration resistant interconnect structure
02/12/2009WO2009005921A3 Polyceramic e-chuck
02/12/2009WO2009002050A3 Apparatus for transferring wafer carrier and system for fabricating semiconductor having the same
02/12/2009WO2008156631A3 Reactive flow deposition and synthesis of inorganic foils
02/12/2009WO2008155490A3 Integrated electronic circuit including a thin film portion based on hafnium oxide
02/12/2009WO2008147432A3 Method of assembling one-dimensional nanostructures
02/12/2009WO2008128080A3 Electrostatic dissipative stage for use in forming lcd products
02/12/2009WO2008122890A3 Heat cycle-able connection
02/12/2009WO2008100691A3 Vapor deposition methods for forming a metal- containing layer on a substrate
02/12/2009WO2008076092A3 Semiconductor device and method for forming the same
02/12/2009WO2008061689A3 Production plant for manufacturing solar cells, inline batch transfer device, batch inline transfer device, and associated method
02/12/2009WO2007127294A9 Exhaust system
02/12/2009WO2006107532A3 Single wafer thermal cvd processes for hemispherical grained silicon and nano-crystalline grain-sized polysilicon
02/12/2009US20090044162 Semiconductor integrated circuit device and fabrication method thereof
02/12/2009US20090044161 Thin-film transistor circuit, design method for thin-film transistor, design program for thin-film transistor circuit, design program recording medium, design library database, and display device
02/12/2009US20090043419 Substrate processing system, substrate processing method, sealed container storing apparatus, program for implementing the substrate processing method, and storage medium storing the program
02/12/2009US20090042489 Wafer polishing apparatus and wafer polishing method
02/12/2009US20090042486 Polishing method, substrate manufacturing method, and electronic apparatus manufacturing method
02/12/2009US20090042482 Rough polishing method of semiconductor wafer and polishing apparatus of semiconductor wafer
02/12/2009US20090042408 Semiconductor device manufacturing method and substrate processing apparatus
02/12/2009US20090042407 Dual Top Gas Feed Through Distributor for High Density Plasma Chamber
02/12/2009US20090042406 Systems and methods for forming metal oxides using metal compounds containing aminosilane ligands
02/12/2009US20090042405 Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
02/12/2009US20090042404 Semiconductor processing
02/12/2009US20090042403 Method for fabricating semiconductor device and semiconductor device
02/12/2009US20090042402 Method for fabricating semiconductor device
02/12/2009US20090042401 Compositions and methods for substantially equalizing rates at which material is removed over an area of a structure or film that includes recesses or crevices
02/12/2009US20090042400 Silicon surface preparation
02/12/2009US20090042399 Method for Dry Develop of Trilayer Photoresist Patterns
02/12/2009US20090042398 Method for etching low-k material using an oxide hard mask
02/12/2009US20090042397 Copper re-deposition preventing method, semiconductor device manufacturing method, and substrate processing apparatus
02/12/2009US20090042396 Methods of forming semiconductor devices using selective etching of an active region through a hardmask
02/12/2009US20090042395 Spacer process for CMOS fabrication with bipolar transistor leakage prevention
02/12/2009US20090042394 Manufacturing method for wiring
02/12/2009US20090042393 Production method of polishing composition
02/12/2009US20090042392 Polishing apparatus, substrate manufacturing method, and electronic apparatus manufacturing method
02/12/2009US20090042391 Methods for forming patterns
02/12/2009US20090042390 Etchant for silicon wafer surface shape control and method for manufacturing silicon wafers using the same
02/12/2009US20090042389 Double exposure semiconductor process for improved process margin
02/12/2009US20090042388 Method of cleaning a semiconductor substrate
02/12/2009US20090042387 Manufacturing method of semiconductor device
02/12/2009US20090042386 Semiconductor device using metal nitride as insulating film and its manufacture method
02/12/2009US20090042385 Method of manufacturing metal line
02/12/2009US20090042384 Semiconductor device manufacturing method and target substrate processing system
02/12/2009US20090042383 Method of fabricating a semiconductor device
02/12/2009US20090042382 Device packages
02/12/2009US20090042381 High-K Gate Dielectric and Method of Manufacture
02/12/2009US20090042380 Semiconductor device and method of manufacturing the same
02/12/2009US20090042379 Method for Fabricating Semiconductor Device Capable of Adjusting the Thickness of Gate Oxide Layer
02/12/2009US20090042378 Use of a polymer spacer and si trench in a bitline junction of a flash memory cell to improve tpd characteristics
02/12/2009US20090042377 Method for forming self-aligned wells to support tight spacing
02/12/2009US20090042376 Integrated circuit fabrication process with minimal post-laser annealing dopant deactivation
02/12/2009US20090042375 Method of manufacturing silicon carbide semiconductor device
02/12/2009US20090042374 Method of growing a strained layer
02/12/2009US20090042373 Process of forming an electronic device including a doped semiconductor layer
02/12/2009US20090042372 Polysilicon Deposition and Anneal Process Enabling Thick Polysilicon Films for MEMS Applications
02/12/2009US20090042371 Laser crystallization process and laser process
02/12/2009US20090042370 Method of cutting pcbs
02/12/2009US20090042369 Method and structure using selected implant angles using a linear accelerator process for manufacture of free standing films of materials
02/12/2009US20090042368 Wafer processing method
02/12/2009US20090042367 Sawing method for a semiconductor element with a microelectromechanical system
02/12/2009US20090042366 Semiconductor die singulation method
02/12/2009US20090042365 Three-dimensional face-to-face integration assembly
02/12/2009US20090042364 Method For Manufacturing Soi Wafer and Soi Wafer
02/12/2009US20090042363 Method for manufacturing bonded wafer and outer-peripheral grinding machine of bonded wafer
02/12/2009US20090042362 Manufacturing methods of SOI substrate and semiconductor device
02/12/2009US20090042361 Method for Manufacturing SOI Substrate and SOI Substrate
02/12/2009US20090042360 Strained semiconductor by full wafer bonding
02/12/2009US20090042359 Structure and Method of Producing Isolation with Non-Dopant Implantation
02/12/2009US20090042358 Semiconductor device and method of fabricating same
02/12/2009US20090042357 Method of selective oxygen implantation to dielectrically isolate semiconductor devices using no extra masks